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    • 1. 发明授权
    • Integrated circuit heat sink support and retention mechanism
    • 集成电路散热器支撑和保持机构
    • US06563213B1
    • 2003-05-13
    • US09419964
    • 1999-10-18
    • Thomas WongNeal UlenPeter DavisonKetan Shah
    • Thomas WongNeal UlenPeter DavisonKetan Shah
    • H05K720
    • H01L23/4093H01L2924/0002Y10T24/44026H01L2924/00
    • The present invention provides an improved heat sink retention assembly, such that the heat sink is physically supported by a base rather than by an integrated circuit. Traditional heat sinks have an alignment feature that physically aligns and supports the heat sink by contact of the feature with an integrated circuit, and that transfers force applied to the heat sink to the integrated circuit. This transferred force may be seen as shear stress at the pins of integrated circuits such as pin-grid arrays, and may damage the integrity of the integrated circuit or its connection to an external circuit. The present invention provides alignment and support features remote from contact with the integrated circuit, and therefore provides support for the heat sink in a manner that does not place substantial stress on the integrated circuit.
    • 本发明提供一种改进的散热器保持组件,使得散热器由基座而不是由集成电路物理支撑。 传统的散热器具有对准特征,其通过特征与集成电路的接触来物理对准和支撑散热器,并且将施加到散热器的力传递到集成电路。 这种转移的力可以被看作是诸如针阵列的集成电路的引脚处的剪切应力,并且可能损坏集成电路的完整性或其与外部电路的连接。 本发明提供了远离与集成电路接触的对准和支撑特征,并因此以不会对集成电路施加相当大的应力的方式为散热器提供支撑。
    • 3. 发明授权
    • Processor EMI shielding
    • 处理器EMI屏蔽
    • US06243265B1
    • 2001-06-05
    • US09413417
    • 1999-10-06
    • Thomas WongNeal Ulen
    • Thomas WongNeal Ulen
    • H05K720
    • H05K9/0039H01L23/4093H01L23/552H01L2924/0002H01L2924/3011H01L2924/00
    • A heat sink retention module provides physical support for a heat sink while providing an electrical ground path for the heat sink. The retention module includes a ground strip that maintains an electrical contact with the heat sink while contacting a circuit board ground connection. In one embodiment, the ground strip includes upwardly extending spring members that contact the heat sink. In another embodiment, the ground strip includes a Faraday Cage formed from downwardly extending tabs. The retention module can be used in conjunction with an electrically conductive heat sink to provide a ground plane over an integrated circuit to shield the circuit from electromagnetic interference.
    • 散热器保持模块为散热器提供物理支撑,同时为散热器提供电接地路径。 保持模块包括接地条,其在接触电路板接地连接时保持与散热器的电接触。 在一个实施例中,接地条包括接触散热器的向上延伸的弹簧部件。 在另一个实施例中,接地条包括由向下延伸的突片形成的法拉第笼。 保持模块可以与导电散热器结合使用,以在集成电路上提供接地平面以屏蔽电路免受电磁干扰。