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    • 3. 发明授权
    • Self-aligned split-gate NAND flash memory and fabrication process
    • 自对准分闸门NAND闪存和制造工艺
    • US06992929B2
    • 2006-01-31
    • US10803183
    • 2004-03-17
    • Chiou-Feng ChenCaleb Yu-Sheng ChoMing-Jer ChenDer-Tsyr FanPrateep Tuntasood
    • Chiou-Feng ChenCaleb Yu-Sheng ChoMing-Jer ChenDer-Tsyr FanPrateep Tuntasood
    • G11C16/04
    • G11C16/0483G11C2216/04H01L27/115H01L27/11521H01L27/11524
    • Self-aligned split-gate NAND flash memory cell array and process of fabrication in which rows of self-aligned split-gate cells are formed between a bit line diffusion and a common source diffusion in the active area of a substrate. Each cell has control and floating gates which are stacked and self-aligned with each other, and erase and select gates which are split from and self-aligned with the stacked gates, with select gates at both ends of each row which partially overlap the bit line the source diffusions. The channel regions beneath the erase gates are heavily doped to reduce the resistance of the channel between the bit line and source diffusions, and the floating gates are surrounded by the other gates in a manner which provides significantly enhanced high voltage coupling to the floating gates from the other gates. The memory cells are substantially smaller than prior art cells, and the array is biased so that all of the memory cells in it can be erased simultaneously, while programming is bit selectable.
    • 自对准分裂栅极NAND闪速存储单元阵列及其制造工艺,其中自对准分裂栅极单元行在衬底的有源区域中的位线扩散与公共源极扩散之间形成。 每个单元具有彼此堆叠和自对准的控制和浮置栅极,并且擦除和选择与层叠栅极分离并与堆叠栅极自对准的栅极,每行的两端的选择栅极部分地重叠位 排列源扩散。 擦除栅极下面的沟道区域是重掺杂的,以减小位线和源极扩散之间的沟道电阻,并且浮置栅极以其它栅极包围,从而提供显着增强的与浮栅的高电压耦合 其他大门。 存储器单元比现有技术的单元小得多,并且阵列被偏置,使得其中的所有存储单元可以被同时擦除,而编程是位可选择的。
    • 5. 发明授权
    • Self-aligned split-gate NAND flash memory and fabrication process
    • 自对准分闸门NAND闪存和制造工艺
    • US07217621B2
    • 2007-05-15
    • US11281182
    • 2005-11-16
    • Chiou-Feng ChenCaleb Yu-Sheng ChoMing-Jer ChenDer-Tsyr FanPrateep Tuntasood
    • Chiou-Feng ChenCaleb Yu-Sheng ChoMing-Jer ChenDer-Tsyr FanPrateep Tuntasood
    • H01L21/336
    • G11C16/0483G11C2216/04H01L27/115H01L27/11521H01L27/11524
    • Self-aligned split-gate NAND flash memory cell array and process of fabrication in which rows of self-aligned split-gate cells are formed between a bit line diffusion and a common source diffusion in the active area of a substrate. Each cell has control and floating gates which are stacked and self-aligned with each other, and erase and select gates which are split from and self-aligned with the stacked gates, with select gates at both ends of each row which partially overlap the bit line the source diffusions. The channel regions beneath the erase gates are heavily doped to reduce the resistance of the channel between the bit line and source diffusions, and the floating gates are surrounded by the other gates in a manner which provides significantly enhanced high voltage coupling to the floating gates from the other gates. The memory cells are substantially smaller than prior art cells, and the array is biased so that all of the memory cells in it can be erased simultaneously, while programming is bit selectable.
    • 自对准分裂栅极NAND闪速存储单元阵列及其制造工艺,其中自对准分裂栅极单元行在衬底的有源区域中的位线扩散与公共源极扩散之间形成。 每个单元具有彼此堆叠和自对准的控制和浮置栅极,并且擦除和选择与层叠栅极分离并与堆叠栅极自对准的栅极,每行的两端的选择栅极部分地重叠位 排列源扩散。 擦除栅极下面的沟道区域是重掺杂的,以减小位线和源极扩散之间的沟道电阻,并且浮置栅极以其它栅极包围,从而提供显着增强的与浮栅的高电压耦合 其他大门。 存储器单元比现有技术的单元小得多,并且阵列被偏置,使得其中的所有存储单元可以被同时擦除,而编程是位可选择的。
    • 8. 发明申请
    • Self-aligned split-gate NAND flash memory and fabrication process
    • 自对准分闸门NAND闪存和制造工艺
    • US20050207225A1
    • 2005-09-22
    • US10803183
    • 2004-03-17
    • Chiou-Feng ChenCaleb ChoMing-Jer ChenDer-Tsyr FanPrateep Tuntasood
    • Chiou-Feng ChenCaleb ChoMing-Jer ChenDer-Tsyr FanPrateep Tuntasood
    • G11C16/00G11C16/04H01L21/8247H01L27/105H01L27/115
    • G11C16/0483G11C2216/04H01L27/115H01L27/11521H01L27/11524
    • Self-aligned split-gate NAND flash memory cell array and process of fabrication in which rows of self-aligned split-gate cells are formed between a bit line diffusion and a common source diffusion in the active area of a substrate. Each cell has control and floating gates which are stacked and self-aligned with each other, and erase and select gates which are split from and self-aligned with the stacked gates, with select gates at both ends of each row which partially overlap the bit line the source diffusions. The channel regions beneath the erase gates are heavily doped to reduce the resistance of the channel between the bit line and source diffusions, and the floating gates are surrounded by the other gates in a manner which provides significantly enhanced high voltage coupling to the floating gates from the other gates. The memory cells are substantially smaller than prior art cells, and the array is biased so that all of the memory cells in it can be erased simultaneously, while programming is bit selectable.
    • 自对准分裂栅极NAND闪速存储单元阵列及其制造工艺,其中自对准分裂栅极单元行在衬底的有源区域中的位线扩散与公共源极扩散之间形成。 每个单元具有彼此堆叠和自对准的控制和浮置栅极,并且擦除和选择与层叠栅极分离并与堆叠栅极自对准的栅极,每行的两端的选择栅极部分地重叠位 排列源扩散。 擦除栅极下面的沟道区域是重掺杂的,以减小位线和源极扩散之间的沟道电阻,并且浮置栅极以其它栅极包围,从而提供显着增强的与浮栅的高电压耦合 其他大门。 存储器单元比现有技术的单元小得多,并且阵列被偏置,使得其中的所有存储单元可以被同时擦除,而编程是位可选择的。
    • 9. 发明授权
    • Cross-coupled capacitors for improved voltage coefficient
    • 交叉耦合电容,提高电压系数
    • US06222221B1
    • 2001-04-24
    • US09439356
    • 1999-11-15
    • Chin-Shan HouMing-Jer Chen
    • Chin-Shan HouMing-Jer Chen
    • H01L27108
    • H01L27/0805
    • A capacitor having a low voltage coefficient, even though one electrode is a semiconductor and one is a metal, is described. Two parallel plate capacitors are formed side by side and then cross-connected. The bottom plate of one of the capacitors is connected to the top plate of the other capacitor, and vice versa. This arrangement causes the two capacitors to be polarized in opposite directions at all times so that the individual voltage coefficients cancel each other and give the combined structure a value that is about 2 ppm V. A process for manufacturing this capacitor is also described.
    • 即使一个电极是半导体,也是一个是金属,具有低电压系数的电容器被描述。 两个平行的平板电容器并排形成,然后交叉连接。 一个电容器的底板连接到另一个电容器的顶板,反之亦然。 这种布置使得两个电容器总是在相反的方向上被极化,使得各个电压系数相互抵消,并使组合结构的值为大约2ppm V.还描述了制造该电容器的工艺。
    • 10. 发明授权
    • Electrostatic discharge protective circuit formed by use of a silicon
controlled rectifier
    • 使用可控硅整流器形成的静电放电保护电路
    • US6072677A
    • 2000-06-06
    • US184897
    • 1998-11-03
    • Mainn-Gwo ChenMing-Jer ChenChuan H. Liu
    • Mainn-Gwo ChenMing-Jer ChenChuan H. Liu
    • H01L27/02H02H9/04
    • H01L27/0259H01L27/0251
    • An electrostatic discharge protective circuit formed by use of a silicon controller rectifier is coupled to an input port and an internal circuit for discharging electrostatic charges on the input port to ground. When the electrostatic charges are applied on the input port, a punch-through effect is created between a first P-type diffusion region and a second N-type diffusion region to turn on a parasitic NPN bipolar junction transistor. At the same time, a voltage is applied on a gate of the MOS transistor via a small-signal equivalent capacitor to turn on itself, thereby discharging the electrostatic charges. Accordingly, the trigger voltage of the silicon controller rectifier can be efficiently lowered to improve the electrostatic discharge protective capability of the silicon control rectifier.
    • 通过使用硅控制器整流器形成的静电放电保护电路耦合到输入端口和内部电路,用于将输入端口上的静电电荷排放到地。 当静电电荷施加到输入端口时,在第一P型扩散区域和第二N型扩散区域之间产生穿透效应,以接通寄生NPN双极结型晶体管。 同时,通过小信号等效电容器在MOS晶体管的栅极上施加电压以使其自身导通,从而放电静电电荷。 因此,可以有效地降低硅控制整流器的触发电压,以提高硅控整流器的静电放电保护能力。