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    • 2. 发明授权
    • Active matrix display
    • 主动矩阵显示
    • US07158109B2
    • 2007-01-02
    • US10236033
    • 2002-09-04
    • Graham CairnsMichael Brownlow
    • Graham CairnsMichael Brownlow
    • G09G5/00
    • G09G3/36G09G3/3648
    • An active matrix display comprises an active matrix array of pixels divided into first and second sets, the pixels 35 of the first set are refreshed in the conventional active matrix way by a first refreshing arrangement M1, 6, 7. Pixels 36 for displaying a graphical feature such as an icon overlaid on the active matrix display image have a second refreshing arrangement M2, 6, 37 to allow the icon pixels of each icon to be switched to the same state, such as maximum back or maximum white. The icon pixels 36 may also have the first refreshing arrangement M1, 6, 7 so that they can be used either as part of the active matrix for displaying arbitrary data or when selected as such, for overlaying the icon image on the arbitrary image data.
    • 有源矩阵显示器包括被划分为第一和第二组的像素的有源矩阵阵列,第一组的像素35通过第一刷新装置M1,6,7以常规有源矩阵方式刷新。 用于显示诸如重叠在有源矩阵显示图像上的图标的图形特征的像素36具有第二刷新装置M 2,6,37,以允许每个图标的图标像素切换到相同的状态,诸如最大背面或 最大白。 图标像素36还可以具有第一刷新装置M 1,6,7,使得它们可以用作用于显示任意数据的有源矩阵的一部分,或者当被选择时,用于将图标图像叠加在任意图像数据上 。
    • 4. 发明申请
    • Integrated MEMS packaging
    • 集成MEMS封装
    • US20060148137A1
    • 2006-07-06
    • US11178148
    • 2005-07-08
    • John HartzellHarry WaltonMichael Brownlow
    • John HartzellHarry WaltonMichael Brownlow
    • H01L21/84
    • B81C1/0023H01L27/1214
    • An integrated MEMS package and associated packaging method are provided. The method includes: forming an electrical circuit, electrically connected to the first substrate; integrating a MEMS device on a first substrate region, electrically connected to the first substrate; providing a second substrate overlying the first substrate; and, forming a wall along the first region boundaries, between the first and second substrate. In one aspect, the electrical circuit is formed using thin-film processes; and, wherein integrating the MEMS device on the first substrate region includes forming the MEMS using thin-film processes, simultaneous with the formation of the electrical device. Alternately, the MEMS device is formed in a separate process, attached to the first substrate, and electrical interconnections are formed to the first substrate using thin-film processes.
    • 提供集成MEMS封装和相关封装方法。 该方法包括:形成电连接到第一基板的电路; 将MEMS器件集成在电连接到第一衬底的第一衬底区域上; 提供覆盖所述第一基板的第二基板; 以及沿所述第一区域边界在所述第一和第二基板之间形成壁。 在一个方面,使用薄膜工艺形成电路; 并且其中将MEMS器件集成在第一衬底区域上包括使用薄膜工艺形成MEMS,同时形成电子器件。 或者,MEMS器件以独立的工艺形成,附接到第一衬底,并且使用薄膜工艺将电互连形成到第一衬底。
    • 6. 发明申请
    • Method for integrated MEMS packaging
    • 集成MEMS封装的方法
    • US20070099327A1
    • 2007-05-03
    • US11640592
    • 2006-12-18
    • John HartzellHarry WaltonMichael Brownlow
    • John HartzellHarry WaltonMichael Brownlow
    • H01L21/00
    • B81C1/0023H01L27/1214
    • An integrated MEMS package and associated packaging method are provided. The method includes: forming an electrical circuit, electrically connected to the first substrate; integrating a MEMS device on a first substrate region, electrically connected to the first substrate; providing a second substrate overlying the first substrate; and, forming a wall along the first region boundaries, between the first and second substrate. In one aspect, the electrical circuit is formed using thin-film processes; and, wherein integrating the MEMS device on the first substrate region includes forming the MEMS using thin-film processes, simultaneous with the formation of the electrical device. Alternately, the MEMS device is formed in a separate process, attached to the first substrate, and electrical interconnections are formed to the first substrate using thin-film processes.
    • 提供集成MEMS封装和相关封装方法。 该方法包括:形成电连接到第一基板的电路; 将MEMS器件集成在电连接到第一衬底的第一衬底区域上; 提供覆盖所述第一基板的第二基板; 以及沿所述第一区域边界在所述第一和第二基板之间形成壁。 在一个方面,使用薄膜工艺形成电路; 并且其中将MEMS器件集成在第一衬底区域上包括使用薄膜工艺形成MEMS,同时形成电子器件。 或者,MEMS器件以独立的工艺形成,附接到第一衬底,并且使用薄膜工艺将电互连形成到第一衬底。