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    • 1. 发明申请
    • SURFACE INSPECTION APPARATUS
    • 表面检查装置
    • US20100066998A1
    • 2010-03-18
    • US12595699
    • 2008-04-25
    • Yoshinori HayashiMasao KawamuraHideki Mori
    • Yoshinori HayashiMasao KawamuraHideki Mori
    • G01N21/00
    • G01N21/9503
    • [Problem] To provide a surface inspection apparatus able to suitably inspect the outer circumference edge part of a semiconductor wafer or other plate-shaped member.[Technical Solution] A semiconductor wafer inspection apparatus 10 has a camera lens 22 arranged facing an outer circumference edge part 101 of a semiconductor wafer 100, an imaging surface 24 arranged facing an outer circumference end face of a semiconductor wafer 100 via the camera lens 22, a mirror 12 forming an image of a first outer circumference bevel surface 101b of the semiconductor wafer 100 on the imaging surface 24 via the camera lens 22, a mirror 14 forming an image of a second outer circumference bevel surface 101c of the semiconductor wafer 100 on the imaging surface 24 via the camera lens 22, a correction lens 26 forming an image of an outer circumference end face 101a of the semiconductor wafer 100 on the imaging surface 24 via the center part of the camera lens 22, and an illumination light guide lamp part 18 illuminating surfaces so that, compared with the outer circumference end face 101a, the first outer circumference bevel surface 101b and second outer circumference bevel surface 101c become brighter.
    • [问题]提供一种能够适当地检查半导体晶片或其他板状部件的外周缘部的表面检查装置。 技术方案半导体晶片检查装置10具有面向半导体晶片100的外周缘部101配置的摄像透镜22,经由照相机镜头22配置成与半导体晶片100的外周端面相对配置的摄像面24 ,通过照相机镜头22在成像面24上形成半导体晶片100的第一外周斜面101b的图像的反射镜12,形成半导体晶片100的第二外周斜面101c的图像的反射镜 通过照相机镜头22在成像表面24上,通过照相机镜头22的中心部分在成像表面24上形成半导体晶片100的外周端面101a的图像的校正透镜26和照明光导 灯部18照射表面,使得与外周端面101a相比,第一外周斜面101b和第二外圆周面 斜面101c变得更亮。
    • 2. 发明申请
    • ARTICLE MANAGEMENT SYSTEM AND ARTICLE MANAGEMENT METHOD
    • 文章管理系统与文章管理方法
    • US20090251294A1
    • 2009-10-08
    • US12295564
    • 2007-03-30
    • Masao KawamuraKou TakesakiKentaro Yamasaki
    • Masao KawamuraKou TakesakiKentaro Yamasaki
    • H04Q5/22
    • G06Q10/087
    • As an assembly 50 of articles of management targets, a serial number that becomes a consecutive number is recorded in each of RFID tags 1, 2, . . . , 12 attended to cardboard boxes 31, 32, . . . , 42 in which articles are stored and a flag, by which the total number of articles that becomes a management target of articles can be calculated, is recorded in at least one of RFID tags. For example, the serial numbers are consecutive numbers starting from one, and the total number of articles is recorded in the flags of all of the RFID tags, or an end flag indicating the last is recorded in the flag of the last RFID tag. The serial numbers are consecutive numbers starting an arbitrary number, a start flag indicating the first is recorded in the flag of the first RFID tag and an end flag indicating the last is recorded in the flag of the last RFID tag, or the total number is recorded in the flag of the last RFID tag.
    • 作为管理目标的组件50,在每个RFID标签1,2中记录成为连续数的序列号。 。 。 ,12人出席了纸箱31,32。 。 。 42,其中存储有物品,并且可以计算成为物品的管理目标物品的总数的标志,记录在至少一个RFID标签中。 例如,序列号是从1开始的连续数字,并且总数量记录在所有RFID标签的标志中,或者表示最后的标签的结束标记记录在最后的RFID标签的标志中。 序列号是从任意数字开始的连续数字,表示第一个的起始标志记录在第一RFID标签的标志中,表示最后一个的结束标志记录在最后一个RFID标签的标志中,或者总数是 记录在最后一个RFID标签的旗帜上。
    • 10. 发明授权
    • Surface inspection apparatus
    • 表面检查装置
    • US08023111B2
    • 2011-09-20
    • US12595699
    • 2008-04-25
    • Yoshinori HayashiMasao KawamuraHideki Mori
    • Yoshinori HayashiMasao KawamuraHideki Mori
    • G01N21/88
    • G01N21/9503
    • A semiconductor wafer inspection apparatus for inspecting an outer circumference edge part of a semiconductor wafer. The apparatus has a camera lens arranged facing an outer circumference edge part of a semiconductor wafer, an imaging surface arranged facing an outer circumference end face of a semiconductor wafer via the camera lens, a mirror forming an image of a first outer circumference bevel surface of the semiconductor wafer on the imaging surface via the camera lens, a mirror forming an image of a second outer circumference bevel surface of the semiconductor wafer on the imaging surface via the camera lens, a correction lens forming an image of an outer circumference end face of the semiconductor wafer on the imaging surface via the center part of the camera lens, and an illumination light guide lamp part illuminating the surfaces. With use of the apparatus the first outer circumference bevel surface and second outer circumference bevel surface become brighter compared with the outer circumference end face.
    • 一种用于检查半导体晶片的外周边缘部分的半导体晶片检查装置。 该装置具有面向半导体晶片的外周缘部的相机透镜,经由照相机透镜与半导体晶片的外周端面相对配置的摄像面,形成第一外周斜面的图像的反射镜 通过照相机镜头在成像表面上的半导体晶片,通过照相机镜头在成像表面上形成半导体晶片的第二外圆周斜面的图像的镜;校正透镜,其形成外周端面的图像 通过照相机镜头的中心部分的成像表面上的半导体晶片和照亮该表面的照明光导灯部分。 通过使用该装置,与外周端面相比,第一外周斜面和第二外圆周斜面变得更亮。