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    • 1. 发明授权
    • Nonvolatile semiconductor memory element excellent in charge retention properties and process for producing the same
    • 电荷保持性优异的非挥发性半导体存储元件及其制造方法
    • US07820515B2
    • 2010-10-26
    • US12046763
    • 2008-03-12
    • Masaaki TakataMitsumasa Koyanagi
    • Masaaki TakataMitsumasa Koyanagi
    • H01L21/336
    • H01L21/28273H01L21/3105H01L21/316H01L21/31645H01L29/42332H01L29/66825H01L29/7881
    • A process for producing a nonvolatile semiconductor memory having a mixed or laminated structure of a hardly oxidizable material composed of a hardly oxidizable element having Gibbs' free energy for forming oxide higher than that of Si under the same temperature condition at 1 atm and in temperature range of 0° C. to 1,200° C. and an oxide of an easily oxidizable material composed of an element having Gibbs' free energy for forming oxide lower than that of Si under the same temperature condition at 1 atm in the temperature range and Si. The process includes forming a portion of the hardly oxidizable material and a portion of the oxide by physical forming method and carrying out heat treatment in oxidizing and reducing gas mixture. The ratio of the gases and the temperature are controlled so that the hardly oxidizable material is reduced and the oxide is oxidized in the temperature range.
    • 一种制造非易失性半导体存储器的方法,该非易失性半导体存储器具有在1atm和在温度范围内的相同温度条件下由具有吉布斯自由能的几乎不可氧化的元素组成的几乎不可氧化的材料的混合或层压结构,以形成高于Si的氧化物的氧化物 0℃〜1200℃的温度范围内的容易氧化材料的氧化物以及在相同的温度条件下在1atm的温度范围和Si下由具有吉布斯自由能的元素组成的氧化物,以形成低于Si的氧化物的氧化物。 该方法包括通过物理形成方法形成一部分难以氧化的材料和一部分氧化物,并在氧化和还原气体混合物中进行热处理。 控制气体和温度的比例,使得难以氧化的材料减少,氧化物在温度范围内被氧化。
    • 4. 发明申请
    • SYNTHETIC QUARTZ GLASS WITH RADIAL DISTRIBUTION OF FAST AXES OF BIREFRINGENCE AND PROCESS FOR PRODUCING THE SAME
    • US20080292881A1
    • 2008-11-27
    • US12182327
    • 2008-07-30
    • Masaaki TAKATANoriyuki AGATATomonori OGAWAKei IWATA
    • Masaaki TAKATANoriyuki AGATATomonori OGAWAKei IWATA
    • C03C3/06C03B37/00
    • C03C3/06C03B19/1453C03B2201/075C03B2201/23C03C2201/23Y02P40/57Y10T428/2982
    • The present invention provides a synthetic quartz glass having a diameter of 100 mm or more for using in an optical apparatus comprising a light source emitting a light having a wavelength of 250 nm or less, the synthetic quartz glass having, in a region located inward from the periphery thereof by 10 mm or more in a plane perpendicular to the optical axis of the synthetic quartz glass: a birefringence of 0.5 nm or less per thickness of 1 cm with respect to a light having a wavelength of 193 nm; an OH group concentration of 60 ppm or less; an averaged differential OH group concentration from the center of the synthetic quartz glass toward a peripheral direction thereof, normalized with respect to the radius of the synthetic quartz glass, of not less than −60 ppm and less than −8 ppm; and an unbiased standard deviation σ of a differential OH group concentration from the center of the synthetic quartz glass toward a peripheral direction thereof, normalized with respect to the radius of the synthetic quartz glass, of 10 ppm or less, the unbiased standard deviation σ being determined with the following formula (1): σ = ∑ i = 1 n  ( X i - X _ ) 2 n - 1   providing ;   X i = Δ   n _ OHi Δ   r i * = n _ OHi - n _ OHi + 1 r i * - r i + 1 * : ( 1 ) differential OH group concentration at measurement point i normalized with respect to the radius R of the synthetic quartz glass; n _ OHi = n OHi - 1 + n OHi + n OHi + 1 3 : OH group concentration at measurement point i in terms of moving average for three points including the two points before and after the measurement point i; r i * = r i R : radius at measurement point i normarized with respect to the radius R of the synthetic quartz glass; X: average of OH group concentrations Xi in the whole evaluation region; and n: number of measurement points in the evaluation region (integer of 2 or more).
    • 7. 发明授权
    • Synthesized silica glass for optical component
    • 用于光学部件的合成石英玻璃
    • US08498056B2
    • 2013-07-30
    • US13367780
    • 2012-02-07
    • Masaaki TakataLong ShaoKei IwataTomonori Ogawa
    • Masaaki TakataLong ShaoKei IwataTomonori Ogawa
    • G02B27/12C03B11/08C03B23/22
    • C03B19/1453C03B2201/04G03F7/70966Y02P40/57
    • The present invention provides a synthetic silica glass for an optical member in which not only a fast axis direction in an optical axis direction is controlled, and a birefringence in an off-axis direction is reduced, but a magnitude of a birefringence in the optical axis direction is controlled to an arbitrary value, such that an average value of a value BR cos2θxy defined from a birefringence BR and a fast axis direction θxy as measured from a parallel direction to the principal optical axis direction is defined as an average birefringence AveBR cos2θxy, and when a maximum value of a birefringence measured from a vertical direction to the principal optical axis direction of the optical member is defined as a maximum birefringence BRmax in an off-axis direction, the following expression (1-1) and expression (2-1) are established: −1.0≦AveBR cos2θxy
    • 本发明提供一种用于光学构件的合成石英玻璃,其不仅控制光轴方向上的快轴方向,并且减少偏轴双折射,而且在光轴上具有双折射的大小 方向被控制为任意值,使得从平行方向到主光轴方向测量的从双折射BR和快轴方向三角形定义的值BR cos2thetaxy的平均值被定义为平均双折射AveBR cos2thetaxy, 并且当将从光学构件的垂直方向到主光轴方向测量的双折射的最大值定义为离轴方向上的最大双折射BRmax时,下列表达式(1-1)和表达式(2- 1)建立:-1.0@AveBR cos2thetaxy <0.0(1-1)0.0 @ BRmax @ 1.0(2-1)。
    • 9. 发明申请
    • NONVOLATILE SEMICONDUCTOR MEMORY ELEMENT EXCELLENT IN CHARGE RETENTION PROPERTIES AND PROCESS FOR PRODUCING THE SAME
    • 非挥发性半导体存储元件在充电保持性方面的优异性及其制造方法
    • US20080171411A1
    • 2008-07-17
    • US12046763
    • 2008-03-12
    • Masaaki TAKATAMitsumasa Koyanagi
    • Masaaki TAKATAMitsumasa Koyanagi
    • H01L21/8234H01L21/336
    • H01L21/28273H01L21/3105H01L21/316H01L21/31645H01L29/42332H01L29/66825H01L29/7881
    • A nonvolatile semiconductor memory element enabling to improve insulation performance of an insulator around a floating gate and to decrease the ratio of oxidized metal ultrafine particles in the floating gate, are provided.In a process for producing nonvolatile semiconductor memory element comprising a floating gate made of a hardly oxidizable material having a Gibbs' formation free energy for forming its oxide higher than that of Si in a range of from 0° C. to 1,200° C., and an insulator made of an oxide of an easily oxidizable material surrounding the floating gate and having such an energy equivalent or lower than that of Si, the floating gate made of hardly oxidizable material is formed by using a physical forming method, the oxide of the easily oxidizable material is formed by using a physical forming method or a chemical forming method, and after a gate insulation film is formed, a heat treatment is carried out in a mixed atmosphere of an oxidizing gas and a reducing gas in a temperature range of from 0° C. to 1,200° C. while the mixture ratio of the mixed gas and the temperature are controlled so that only the hardly oxidizable material is reduced and only the oxide of the easily oxidizable material is oxidized.
    • 提供一种非易失性半导体存储元件,其能够提高浮动栅极周围的绝缘体的绝缘性能并降低浮栅中的氧化金属超微粒子的比例。 在制造非易失性半导体存储元件的方法中,所述非易失性半导体存储元件包括由几何可氧化材料制成的浮栅,所述浮栅具有Gibbs'形成自由能,用于在0℃至1200℃的范围内形成高于Si的氧化物, 以及由易于氧化的材料的氧化物构成的绝缘体,该氧化物围绕浮动栅极并且具有等于或低于Si的能量,由几何可氧化材料制成的浮栅是通过使用物理成形法形成的, 通过使用物理形成方法或化学成型方法形成易氧化材料,在形成栅极绝缘膜之后,在氧化气体和还原气体的混合气氛中,在 0℃至1200℃,同时控制混合气体和温度的混合比,使得只有几乎不可氧化的材料被还原,并且只有易氧化的氧化物 太阳能被氧化。