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    • 1. 发明授权
    • Air-fuel ratio control apparatus
    • 空燃比控制装置
    • US08015967B2
    • 2011-09-13
    • US12318116
    • 2008-12-22
    • Hiroshi MoritaKazuto Ikeda
    • Hiroshi MoritaKazuto Ikeda
    • F02D41/14F01L1/34
    • F01L13/0015F01L1/185F01L2001/0537F01L2105/00F01L2800/00F01N2560/025F01N2560/14F02D13/023F02D41/0002F02D41/1454F02D41/2454F02D41/2464F02D2041/001Y02T10/18Y02T10/42
    • An air-fuel ratio control apparatus is applied to an internal combustion engine including a variable lift mechanism which changes a lift amount of an intake valve. An oxygen sensor, which outputs a signal indicating an oxygen concentration in exhaust gas, is provided downstream of an exhaust gas purification catalyst in an exhaust passage of the internal combustion engine. Air-fuel ratio control is performed to correct the fuel injection amount command value using the correction amount that is set based on the value output from the oxygen sensor. The relationship among the deviation of the correction amount from its reference value, the learned small lift value, the learned medium lift value, and the lift amount is learned. The learned deviation value is calculated based on the lift amount, using the learned relationship. Then, the fuel injection amount command value is corrected by the correction amount including the calculated learned deviation value.
    • 空燃比控制装置被应用于包括改变进气门的升程量的可变升程机构的内燃机。 输出表示排气中的氧浓度的信号的氧传感器设置在内燃机的排气通路内的废气净化催化剂的下游。 执行空燃比控制,以使用基于从氧传感器输出的值设定的校正量来校正燃料喷射量指令值。 了解校正量与参考值的偏差,学习小升程值,学习介质升程值和提升量之间的关系。 使用学习关系,根据提升量计算学习偏差值。 然后,通过包括计算出的学习偏差值的校正量校正燃料喷射量指令值。
    • 5. 发明授权
    • Method of manufacturing semiconductor device having silicide layer
    • 制造具有硅化物层的半导体器件的方法
    • US07011734B2
    • 2006-03-14
    • US10685796
    • 2003-10-16
    • Kazuto Ikeda
    • Kazuto Ikeda
    • C23C14/34H01L21/336B05D3/02
    • H01L21/28518
    • A method of manufacturing a semiconductor device has the steps of: (a) evacuating a sputtering chamber to a pressure of 1.5×10−8 torr to 9×10−8 torr and heating a silicon substrate to a temperature of 330° C. to 395° C.; (b) sputtering Co on the heated silicon substrate; (c) after the step (b), forming a cap layer having a small oxygen transmission performance on the silicon substrate without exposing the silicon substrate in air; (d) after the step (c), performing primary annealing; (e) after the step (d), removing the cap layer and unreacted Co; and (f) after the step (e), performing secondary annealing by heating the silicon substrate to a temperature of 450° C. to 750° C.
    • 制造半导体器件的方法具有以下步骤:(a)将溅射室抽空至1.5×10 -8乇至9×10 -8乇的压力,并加热 硅衬底,温度为330℃至395℃。 (b)在加热的硅衬底上溅射Co; (c)在步骤(b)之后,在硅衬底上形成具有小氧传输性能的覆盖层,而不在硅衬底中暴露空气; (d)在步骤(c)之后进行一次退火; (e)在步骤(d)之后,除去盖层和未反应的Co; 和(f)在步骤(e)之后,通过将硅衬底加热至450℃至750℃的温度进行二次退火。