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1. 发明申请

US20100006324A1 CURABLE RESIN COMPOSITION, HALOGEN-FREE RESIN SUBSTRATE, AND HALOGEN-FREE BUILD-UP PRINTED WIRING BOARD 有权
标题翻译：可固化树脂组合物，无卤素树脂基材和无卤素建筑印刷线路板
公开(公告)号：US20100006324A1
公开(公告)日：2010-01-14
申请号：US12494798
申请日：2009-06-30
申请人： Kazunori KITAMURA , Yukihiro Koga , Kiyoshi Sato
发明人： Kazunori KITAMURA , Yukihiro Koga , Kiyoshi Sato
IPC分类号： H05K1/03 , C08K3/30 , C08K3/26 , C08K3/36
CPC分类号： H05K3/0094 , C08K3/013 , C08K2201/003 , C08L63/00 , H05K3/4602 , H05K2201/0209 , H05K2201/0347 , H05K2201/068 , H05K2201/09536 , H05K2201/0959 , H05K2201/096 , Y10T428/24917
摘要： In a curable resin composition containing an inorganic filler, the average particle diameter of the inorganic filler is 1 μm or less and the content of the inorganic filler is 50 wt % or less. The curable resin composition can be preferably used for a halogen-free resin substrate and the like having a small load on an environment as a hole-plugging curable resin composition as well as used to provide a hole-plugging build-up printed wiring board having a via-on-via structure (in particular, a stacked via structure) having an excellent crack-resistant property, an excellent insulation/connection reliability, and the like.
摘要翻译：在含有无机填料的固化性树脂组合物中，无机填料的平均粒径为1μm以下，无机填料的含量为50重量％以下。固化性树脂组合物可以优选用于作为空穴堵塞固化性树脂组合物的环境负荷小的无卤素树脂基材等，并且用于提供具有孔堵塞积聚印刷线路板，其具有具有优异的抗裂性，优异的绝缘/连接可靠性等的通孔通孔结构（特别是堆叠通孔结构）。

2. 发明申请

US20110132639A1 PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME 有权
标题翻译：印刷线路板及其制造方法
公开(公告)号：US20110132639A1
公开(公告)日：2011-06-09
申请号：US12874755
申请日：2010-09-02
申请人： Takeshi SAITO , Kazunori KITAMURA , Yukihiro KOGA
发明人： Takeshi SAITO , Kazunori KITAMURA , Yukihiro KOGA
IPC分类号： H05K1/00 , G03F7/20
CPC分类号： G03F7/168 , H05K3/28 , H05K3/3452 , H05K2203/0278
摘要： A method produces an undercoat-covered smoothed printed wiring board, requiring no step of polishing the surface of the printed wiring board. A method for producing a solder-resist-covered printed wiring board causes no depression in an area between circuit traces. A printed wiring board so produced is also described. The method for producing a printed wiring board includes applying a photo- and heat-curable resin composition onto at least a part of a surface of a printed wiring substrate; placing an optically transparent smoothing member on the resin layer; moving a hard roller on the smoothing member to thin the applied resin layer to a thickness of interest; placing a negative-image mask on the smoothing member; exposing the applied resin layer to light via the negative-image mask; removing the optically transparent smoothing member; removing a light-unexposed portion of the applied resin layer through development; and completely heat-curing the cured light-exposed portion.
摘要翻译：一种方法产生底漆覆盖的平滑印刷线路板，不需要抛光印刷线路板的表面的步骤。用于制造阻焊覆盖印刷线路板的方法不会在电路迹线之间的区域中产生凹陷。还描述了如此制造的印刷线路板。印刷电路板的制造方法包括将光固化树脂组合物和热固化性树脂组合物涂布在印刷布线基板的表面的至少一部分上; 将光学透明的平滑部件放置在树脂层上; 在平滑构件上移动硬辊以将所施加的树脂层稀薄至感兴趣的厚度; 在平滑构件上放置负像掩模; 将所施加的树脂层经由负像掩模曝光; 去除光学透明平滑件; 通过显影去除涂布的树脂层的未曝光部分; 并使固化的光照部分完全热固化。

3. 发明申请

US20120168219A1 ACTIVE RESIN COMPOSITION, SURFACE MOUNTING METHOD AND PRINTED WIRING BOARD 审中-公开
标题翻译：活性树脂组合物，表面安装方法和印刷线路板
公开(公告)号：US20120168219A1
公开(公告)日：2012-07-05
申请号：US13339981
申请日：2011-12-29
申请人： Kazunori KITAMURA , Yasuhiro TAKASE , Kazuki HANADA
发明人： Kazunori KITAMURA , Yasuhiro TAKASE , Kazuki HANADA
IPC分类号： H05K1/11 , B23K31/02 , B23K1/20 , C09D163/04 , C09D163/02
CPC分类号： H05K3/305 , B23K1/0016 , B23K1/20 , C08G59/42 , C08L63/00 , H01L21/563 , H01L23/3135 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/131 , H01L2224/16238 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/81191 , H01L2224/81395 , H01L2224/81815 , H01L2224/8191 , H01L2224/83102 , H01L2224/83192 , H01L2224/83862 , H01L2224/92125 , H01L2924/01029 , H01L2924/13055 , H05K3/341 , H05K13/0465 , H05K2201/10977 , Y02P70/613 , H01L2924/00 , H01L2924/00012 , H01L2924/0665 , H01L2924/014
摘要： A surface mounting method includes applying an active resin composition to at least part of a surface of a printed wiring substrate; mounting a surface mount device on the substrate; performing reflow soldering; applying an under-filling resin into a space of interest; before and/or after applying the under-filling resin, performing a vacuum treatment and/or heating at a temperature lower than the curing reaction-initiating temperature of any of the applied active resin composition and the under-filling resin; and subsequently, thermally curing the resin composition and the under-filling resin. The active resin composition contains an epoxy resin in an amount of 100 parts by weight, a blocked carboxylic acid compound in an amount of 1-50 parts by weight and/or a carboxylic acid compound in an amount of 1-10 parts by weight, and a curing agent which can initiate curing reaction at 150° C. or higher, in an amount of 1-30 parts by weight.
摘要翻译：表面安装方法包括将活性树脂组合物施加到印刷布线基板的表面的至少一部分上; 将表面安装装置安装在基板上; 进行回流焊接; 将未充满的树脂施加到感兴趣的空间中; 在施加未充填树脂之前和/或之后，在低于所施加的活性树脂组合物和未充填树脂的固化反应引发温度的温度下进行真空处理和/或加热; 然后将树脂组合物和未填充树脂热固化。活性树脂组合物含有100重量份的环氧树脂，1-50重量份的封端羧酸化合物和/或1-10重量份的羧酸化合物，和可以在150℃以上引发固化反应的固化剂，其量为1-30重量份。

4. 发明申请

US20120153009A1 METHOD FOR SURFACE MOUNTING USING CLEANING-FREE ACTIVATED RESINOUS COMPOSITION 有权
标题翻译：使用无清洁活性树脂组合物的表面安装方法
公开(公告)号：US20120153009A1
公开(公告)日：2012-06-21
申请号：US13335015
申请日：2011-12-22
申请人： Kazunori KITAMURA , Yasuhiro TAKASE
发明人： Kazunori KITAMURA , Yasuhiro TAKASE
IPC分类号： B23K1/20
CPC分类号： C08G59/628 , C08G59/4021 , H01L2224/73204 , H01L2924/1305 , H01L2924/13055 , H01L2924/15311 , H01L2924/00
摘要： Activated resinous composition contains, on the basis of epoxy resin being solid at a room temperature of 100 parts by weight, carboxylic acid compound of 1 to 10 parts by weight, hardening agent of 1 to 30 parts by weight, a hardening reaction initiation temperature of said hardening agent being 150° C. or higher, and solvent of 10 to 300 parts by weight.
摘要翻译：活性树脂组合物在室温为100重量份的固体的环氧树脂的基础上，含有1〜10重量份的羧酸化合物，1〜30重量份的固化剂，硬化反应开始温度所述硬化剂为150℃以上，溶剂为10〜300重量份。

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