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1. 发明申请

US20100006324A1 CURABLE RESIN COMPOSITION, HALOGEN-FREE RESIN SUBSTRATE, AND HALOGEN-FREE BUILD-UP PRINTED WIRING BOARD 有权
标题翻译：可固化树脂组合物，无卤素树脂基材和无卤素建筑印刷线路板
公开(公告)号：US20100006324A1
公开(公告)日：2010-01-14
申请号：US12494798
申请日：2009-06-30
申请人： Kazunori KITAMURA , Yukihiro Koga , Kiyoshi Sato
发明人： Kazunori KITAMURA , Yukihiro Koga , Kiyoshi Sato
IPC分类号： H05K1/03 , C08K3/30 , C08K3/26 , C08K3/36
CPC分类号： H05K3/0094 , C08K3/013 , C08K2201/003 , C08L63/00 , H05K3/4602 , H05K2201/0209 , H05K2201/0347 , H05K2201/068 , H05K2201/09536 , H05K2201/0959 , H05K2201/096 , Y10T428/24917
摘要： In a curable resin composition containing an inorganic filler, the average particle diameter of the inorganic filler is 1 μm or less and the content of the inorganic filler is 50 wt % or less. The curable resin composition can be preferably used for a halogen-free resin substrate and the like having a small load on an environment as a hole-plugging curable resin composition as well as used to provide a hole-plugging build-up printed wiring board having a via-on-via structure (in particular, a stacked via structure) having an excellent crack-resistant property, an excellent insulation/connection reliability, and the like.
摘要翻译：在含有无机填料的固化性树脂组合物中，无机填料的平均粒径为1μm以下，无机填料的含量为50重量％以下。固化性树脂组合物可以优选用于作为空穴堵塞固化性树脂组合物的环境负荷小的无卤素树脂基材等，并且用于提供具有孔堵塞积聚印刷线路板，其具有具有优异的抗裂性，优异的绝缘/连接可靠性等的通孔通孔结构（特别是堆叠通孔结构）。

2. 发明授权

US5004516A Apparatus for bonding adhesive rubber tape to both edges of a steel cord fabric 失效
标题翻译：用于将胶粘胶带粘合到钢帘线织物的两个边缘上的装置
公开(公告)号：US5004516A
公开(公告)日：1991-04-02
申请号：US334547
申请日：1989-04-07
申请人： Yukihiro Koga , Yukio Koyama
发明人： Yukihiro Koga , Yukio Koyama
IPC分类号： B29D30/38 , B29C53/04 , B29C53/36 , B29C63/00
CPC分类号： B29C53/043 , B29C63/0039 , B29C2791/003 , B29C53/36 , B29K2021/00 , B29K2105/246 , B29L2030/003
摘要： There is disclosed an apparatus for bonding an adhesive rubber tape to both ends of a steel cord fabric. The apparatus comprises a unit for carrying the fabric, a unit for supplying the tape, and unit for folding and bonding the tape to both ends of the fabric. The folding/bonding unit includes a press rollers for bonding a widthwise half of the tape to upper end surfaces of the fabric, oblique rollers for folding an unbonded portion of the tape at both ends of the fabric, and taper rollers for bonding the folded tape to the fabric. The surfaces of oblique rollers are formed of transformable elastic materials, these rollers on each side of the steel cord fabric being disposed at different inclined angles.
摘要翻译：公开了一种用于将粘合橡胶带粘合到钢帘线织物的两端的装置。该装置包括用于承载织物的单元，用于供应带的单元，以及用于将带折叠并粘合到织物的两端的单元。折叠/粘合单元包括用于将宽度方向一半的带粘合到织物的上端表面的压辊，用于在织物的两端折叠带的未粘合部分的倾斜辊和用于粘合折叠带的锥形辊到织物。倾斜辊的表面由可变形的弹性材料形成，钢帘线织物的每一侧上的这些辊以不同的倾斜角度设置。

3. 发明授权

US08758986B2 Printed wiring board and method for producing the same 有权
标题翻译：印刷电路板及其制造方法
公开(公告)号：US08758986B2
公开(公告)日：2014-06-24
申请号：US12874755
申请日：2010-09-02
申请人： Takeshi Saito , Kazunori Kitamura , Yukihiro Koga
发明人： Takeshi Saito , Kazunori Kitamura , Yukihiro Koga
IPC分类号： G03F7/26
CPC分类号： G03F7/168 , H05K3/28 , H05K3/3452 , H05K2203/0278
摘要： A method produces an undercoat-covered smoothed printed wiring board, requiring no step of polishing the surface of the printed wiring board. A method for producing a solder-resist-covered printed wiring board causes no depression in an area between circuit traces. A printed wiring board so produced is also described. The method for producing a printed wiring board includes applying a photo- and heat-curable resin composition onto at least a part of a surface of a printed wiring substrate; placing an optically transparent smoothing member on the resin layer; moving a hard roller on the smoothing member to thin the applied resin layer to a thickness of interest; placing a negative-image mask on the smoothing member; exposing the applied resin layer to light via the negative-image mask; removing the optically transparent smoothing member; removing a light-unexposed portion of the applied resin layer through development; and completely heat-curing the cured light-exposed portion.
摘要翻译：一种方法产生底漆覆盖的平滑印刷线路板，不需要抛光印刷线路板的表面的步骤。用于制造阻焊覆盖印刷线路板的方法不会在电路迹线之间的区域中产生凹陷。还描述了如此制造的印刷线路板。印刷电路板的制造方法包括将光固化树脂组合物和热固化性树脂组合物涂布在印刷布线基板的表面的至少一部分上; 将光学透明的平滑部件放置在树脂层上; 在平滑构件上移动硬辊以将所施加的树脂层稀薄至感兴趣的厚度; 在平滑构件上放置负像掩模; 将所施加的树脂层经由负像掩模曝光; 去除光学透明平滑件; 通过显影去除涂布的树脂层的未曝光部分; 并使固化的光照部分完全热固化。

4. 发明授权

US5290321A Process for preparation of granular .mu.-sulfur having improved flowability, as a vulcanizing agent of rubber composition 失效
标题翻译：作为橡胶组合物的硫化剂制备具有改善的流动性的颗粒状硫化物的方法
公开(公告)号：US5290321A
公开(公告)日：1994-03-01
申请号：US970878
申请日：1992-11-03
申请人： Yukihiro Koga , Tadahiko Matsuoka , Masatoshi Sasa
发明人： Yukihiro Koga , Tadahiko Matsuoka , Masatoshi Sasa
IPC分类号： C01B17/12 , C08K3/06 , C01B17/00
CPC分类号： C01B17/12 , C08K3/06
摘要： An organic solvent alone or together with a rubber process oil is added to a powder of .mu.-sulfur, the mixture is granulated, and the granulation product is heated at a temperature lower than 120.degree. C. to evaporate the organic solvent, whereby granular .mu.-sulfur having an improved flowability is obtained. This granular .mu.-sulfur is valuable as a rubber-vulcanizing agent.
摘要翻译：将单独或与橡胶加工油一起的有机溶剂加入到μ-硫的粉末中，将混合物造粒，并将造粒产物在低于120℃的温度下加热以蒸发有机溶剂，由此颗粒状得到具有改善的流动性的硫磺。这种颗粒状的硫磺作为橡胶硫化剂是有价值的。

5. 发明申请

US20110132639A1 PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME 有权
标题翻译：印刷线路板及其制造方法
公开(公告)号：US20110132639A1
公开(公告)日：2011-06-09
申请号：US12874755
申请日：2010-09-02
申请人： Takeshi SAITO , Kazunori KITAMURA , Yukihiro KOGA
发明人： Takeshi SAITO , Kazunori KITAMURA , Yukihiro KOGA
IPC分类号： H05K1/00 , G03F7/20
CPC分类号： G03F7/168 , H05K3/28 , H05K3/3452 , H05K2203/0278
摘要： A method produces an undercoat-covered smoothed printed wiring board, requiring no step of polishing the surface of the printed wiring board. A method for producing a solder-resist-covered printed wiring board causes no depression in an area between circuit traces. A printed wiring board so produced is also described. The method for producing a printed wiring board includes applying a photo- and heat-curable resin composition onto at least a part of a surface of a printed wiring substrate; placing an optically transparent smoothing member on the resin layer; moving a hard roller on the smoothing member to thin the applied resin layer to a thickness of interest; placing a negative-image mask on the smoothing member; exposing the applied resin layer to light via the negative-image mask; removing the optically transparent smoothing member; removing a light-unexposed portion of the applied resin layer through development; and completely heat-curing the cured light-exposed portion.
摘要翻译：一种方法产生底漆覆盖的平滑印刷线路板，不需要抛光印刷线路板的表面的步骤。用于制造阻焊覆盖印刷线路板的方法不会在电路迹线之间的区域中产生凹陷。还描述了如此制造的印刷线路板。印刷电路板的制造方法包括将光固化树脂组合物和热固化性树脂组合物涂布在印刷布线基板的表面的至少一部分上; 将光学透明的平滑部件放置在树脂层上; 在平滑构件上移动硬辊以将所施加的树脂层稀薄至感兴趣的厚度; 在平滑构件上放置负像掩模; 将所施加的树脂层经由负像掩模曝光; 去除光学透明平滑件; 通过显影去除涂布的树脂层的未曝光部分; 并使固化的光照部分完全热固化。

6. 发明授权

US08232477B2 Curable resin composition, halogen-free resin substrate, and halogen-free build-up printed wiring board 有权
标题翻译：可固化树脂组合物，无卤素树脂基材和无卤素堆积印刷线路板
公开(公告)号：US08232477B2
公开(公告)日：2012-07-31
申请号：US12494798
申请日：2009-06-30
申请人： Kazunori Kitamura , Yukihiro Koga , Kiyoshi Sato
发明人： Kazunori Kitamura , Yukihiro Koga , Kiyoshi Sato
IPC分类号： H05K1/03 , H01L23/053 , H01L23/12
CPC分类号： H05K3/0094 , C08K3/013 , C08K2201/003 , C08L63/00 , H05K3/4602 , H05K2201/0209 , H05K2201/0347 , H05K2201/068 , H05K2201/09536 , H05K2201/0959 , H05K2201/096 , Y10T428/24917
摘要： In a curable resin composition containing an inorganic filler, the average particle diameter of the inorganic filler is 1 μm or less and the content of the inorganic filler is 50 wt % or less. The curable resin composition can be preferably used for a halogen-free resin substrate and the like having a small load on an environment as a hole-plugging curable resin composition as well as used to provide a hole-plugging build-up printed wiring board having a via-on-via structure (in particular, a stacked via structure) having an excellent crack-resistant property, an excellent insulation/connection reliability, and the like.
摘要翻译：在含有无机填料的固化性树脂组合物中，无机填料的平均粒径为1μm以下，无机填料的含量为50重量％以下。固化性树脂组合物可以优选用于作为空穴堵塞固化性树脂组合物的环境负荷小的无卤素树脂基材等，并且用于提供具有孔堵塞积聚印刷线路板，其具有具有优异的抗裂性，优异的绝缘/连接可靠性等的通孔通孔结构（特别是堆叠通孔结构）。

7. 发明授权

US4971128A Automatic rim exchanger for use in a tire uniformity machine 失效
标题翻译：用于轮胎均匀机器的自动轮辋交换器
公开(公告)号：US4971128A
公开(公告)日：1990-11-20
申请号：US299685
申请日：1989-01-23
申请人： Yukihiro Koga , Naoyuki Miyazono
发明人： Yukihiro Koga , Naoyuki Miyazono
IPC分类号： B29D30/06 , G01M17/02
CPC分类号： B29D30/0662 , G01M17/021
摘要： An improved automatic rim exchanger for use in a tire uniformity machine includes an upper spindle adapted to be rotated about the same axis as an axis of a tire, a fitting portion provided at the bottom of the upper spindle and associated with a chuck for detachably supporting upper rim structure of an upper rim holding member and upper rim, a lower spindle associated with a lock mechanism, which spindle is rotatably disposed on a lower spindle assembly mounted on an elevator member, has lower rim structure of a lower rim holding member and a lower rim detachably fitted therein, and is raised and lowered in the axial direction on the same axis, a jointly movable support member projecting from the lower rim means and adapted to be detachably fitted in a holding hole of the upper rim structure for supporting the upper rim structure, and a conveyor for supporting the vertically fitted upper and lower rim structure to feed and eject them.
摘要翻译：一种用于轮胎均匀机器的改进的自动轮辋交换器包括适于围绕与轮胎的轴线相同的轴线旋转的上主轴，设置在上心轴的底部并与卡盘相关联的配合部分，该卡盘用于可拆卸地支撑上边缘保持构件和上边缘的上边缘结构，与锁定机构相关联的下主轴，该主轴可旋转地设置在安装在升降构件上的下主轴组件上，具有下边缘保持构件的下边缘结构，下边缘可拆卸地装配在其中，并且在同一轴线上在轴向方向上升下降，从下边缘装置突出的可共同移动的支撑构件，并且可拆卸地装配在上边缘结构的保持孔中，用于支撑上部边缘结构，以及用于支撑竖直安装的上边缘和下边缘结构以输送和弹出它们的输送机。

8. 发明授权

US4614485A Unloader for a tire curing machine 失效
标题翻译：轮胎硫化机卸料机
公开(公告)号：US4614485A
公开(公告)日：1986-09-30
申请号：US758793
申请日：1985-07-24
申请人： Katsuyoshi Sakaguchi , Yukihiro Koga
发明人： Katsuyoshi Sakaguchi , Yukihiro Koga
IPC分类号： B29C33/04 , B29C35/04 , B29D30/00 , B29D30/06 , B29H5/02
CPC分类号： B29D30/0603
摘要： An unloader for a tire curing machine is improved in that a tire gripping device in the unloader is composed of a chuck base for depressing an upper bladder clamp ring upon lowering an arm which supports the tire gripping device to form a space for inserting chuck claws between inner circumferential portions of a bladder and a cured tire, chuck claws mounted on the chuck base so as to be expansible and contractible, and a chuck claw expansion/contraction hydraulic cylinder mounted on the chuck base.
摘要翻译：用于轮胎硫化机的卸载机的改进在于，卸载机中的轮胎夹紧装置由用于在支撑轮胎夹持装置的臂下降时压下上部气囊夹紧环的卡盘基座构成，以形成用于将卡盘爪插入的空间气囊和固化轮胎的内圆周部分，安装在卡盘基座上以便可膨胀和收缩的卡盘爪和安装在卡盘基座上的卡盘爪膨胀/收缩液压缸。

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