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1. 发明申请

US20170137564A1 NOVEL INCLUSION COMPOUND 审中-公开
公开(公告)号：US20170137564A1
公开(公告)日：2017-05-18
申请号：US15420924
申请日：2017-01-31
申请人： NIPPON SODA CO., LTD.
发明人： Kazuo ONO , Tomoya NOMURA
IPC分类号： C08G59/62 , C08G59/24 , C08G59/50
CPC分类号： C08G59/628 , C07C39/16 , C07C211/27 , C08G59/245 , C08G59/5093 , C08G59/62 , C08G59/621
摘要： A method includes mixing a clathrate compound with an epoxy resin to form a curable epoxy resin composition, and may further include heating the curable epoxy resin composition to cure the curable epoxy resin composition. The clathrate compound includes (a1) a carboxylic acid compound represented by the formula A(COOH)k; and (a2) a xylylene diamine compound. In the formula A(COOH)k, A represents a C1-C6 linear hydrocarbon group optionally having a substituent, a C3-C10 monocyclic hydrocarbon group optionally having a substituent, or a C6-C10 bicyclic hydrocarbon group optionally having a substituent; and k represents 2 or 3.

2. 发明申请

US20120153009A1 METHOD FOR SURFACE MOUNTING USING CLEANING-FREE ACTIVATED RESINOUS COMPOSITION 有权
标题翻译：使用无清洁活性树脂组合物的表面安装方法
公开(公告)号：US20120153009A1
公开(公告)日：2012-06-21
申请号：US13335015
申请日：2011-12-22
申请人： Kazunori KITAMURA , Yasuhiro TAKASE
发明人： Kazunori KITAMURA , Yasuhiro TAKASE
IPC分类号： B23K1/20
CPC分类号： C08G59/628 , C08G59/4021 , H01L2224/73204 , H01L2924/1305 , H01L2924/13055 , H01L2924/15311 , H01L2924/00
摘要： Activated resinous composition contains, on the basis of epoxy resin being solid at a room temperature of 100 parts by weight, carboxylic acid compound of 1 to 10 parts by weight, hardening agent of 1 to 30 parts by weight, a hardening reaction initiation temperature of said hardening agent being 150° C. or higher, and solvent of 10 to 300 parts by weight.
摘要翻译：活性树脂组合物在室温为100重量份的固体的环氧树脂的基础上，含有1〜10重量份的羧酸化合物，1〜30重量份的固化剂，硬化反应开始温度所述硬化剂为150℃以上，溶剂为10〜300重量份。

3. 发明申请

US20160017088A1 NOVEL INCLUSION COMPOUND 审中-公开
标题翻译：新包装化合物
公开(公告)号：US20160017088A1
公开(公告)日：2016-01-21
申请号：US14773542
申请日：2014-03-24
申请人： NIPPON SODA CO., LTD.
发明人： Kazuo ONO , Tomoya NOMURA
IPC分类号： C08G59/62 , C07C211/27
CPC分类号： C08G59/628 , C07C39/16 , C07C211/27 , C08G59/245 , C08G59/5093 , C08G59/62 , C08G59/621
摘要： An object of the present invention is to provide a novel curing agent or a curing accelerator for epoxy resin. The curing agent or a curing accelerator for epoxy resin of the present invention is a clathrate compound comprising the following (a1) and (a2): (a1) a tetrakis(hydroxyphenyl)ethane compound or a carboxylic acid compound represented by formula: A(COOH)k wherein, A represents a C1-C6 linear hydrocarbon group optionally having a substituent, a C3-C10 monocyclic hydrocarbon group optionally having a substituent, or a C6-C10 bicyclic hydrocarbon group optionally having a substituent, and k represents 2 or 3; and (a2) a xylylene diamine compound.
摘要翻译：本发明的目的是提供一种用于环氧树脂的新型固化剂或固化促进剂。本发明的固化剂或环氧树脂固化促进剂是包含以下（a1）和（a2）的包合化合物：（a1）四（羟基苯基）乙烷化合物或由式（A）表示的羧酸化合物： COOH）k，其中A表示任选具有取代基的C 1 -C 6直链烃基，任选具有取代基的C 3 -C 10单环烃基或任选具有取代基的C 6 -C 10双环烃基，k表示2或3 ; 和（a2）亚二甲苯二胺化合物。

4. 发明授权

US06562482B1 Liquid potting composition 有权
标题翻译：液体灌封组合物
公开(公告)号：US06562482B1
公开(公告)日：2003-05-13
申请号：US09630266
申请日：2000-08-01
申请人： Yushi Sakamoto
发明人： Yushi Sakamoto
IPC分类号： H01L2912
CPC分类号： C08G59/628 , Y10T428/12528
摘要： A liquid potting composition, a semiconductor device manufactured using such composition and a process for manufacturing a semiconductor device using such composition. The liquid potting composition comprises: (a) a liquid epoxy resin; (b) a hardener comprising a multi-hydroxy aromatic compound containing at least two hydroxy groups and at least one carboxyl group; and (c) an accelerator. Suitable hardening agents include 2,3-dihydroxybenzoic acid; 2,4-dihydroxybenzoic acid; 2,5-dihydroxybenzoic acid; 3,4-dihydroxybenzoic acid; gallic acid; 1,4-dihydroxy-2-naphthoic acid; 3,5-dihydroxy-2-naphthoic acid; phenolphthaline; diphenolic acid and mixtures thereof.
摘要翻译：液体灌封组合物，使用这种组合物制造的半导体器件和使用这种组合物制造半导体器件的方法。液体灌封组合物包括：（a）液体环氧树脂; （b）包含含有至少两个羟基和至少一个羧基的多羟基芳族化合物的固化剂; 和（c）加速器。合适的硬化剂包括2,3-二羟基苯甲酸; 2,4-二羟基苯甲酸; 2,5-二羟基苯甲酸; 3,4-二羟基苯甲酸没食子酸 1,4-二羟基-2-萘甲酸; 3,5-二羟基-2-萘甲酸; 酚酞; 二酚酸及其混合物。

5. 发明申请

US20110031300A1 CLEANING-FREE ACTIVATED RESINOUS COMPOSITION AND METHOD FOR SURFACE MOUNTING USING THE SAME 审中-公开
标题翻译：无清洁活性树脂组合物及其表面安装方法
公开(公告)号：US20110031300A1
公开(公告)日：2011-02-10
申请号：US12846496
申请日：2010-07-29
申请人： Kazunori Kitamura , Yasuhiro Takase
发明人： Kazunori Kitamura , Yasuhiro Takase
IPC分类号： B23K31/02 , C08G65/08
CPC分类号： C08G59/628 , C08G59/4021 , H01L2224/73204 , H01L2924/1305 , H01L2924/13055 , H01L2924/15311 , H01L2924/00
摘要： Activated resinous composition contains, on the basis of epoxy resin being solid at a room temperature of 100 parts by weight, carboxylic acid compound of 1 to 10 parts by weight, hardening agent of 1 to 30 parts by weight, a hardening reaction initiation temperature of said hardening agent being 150° C. or higher, and solvent of 10 to 300 parts by weight.
摘要翻译：活性树脂组合物在室温为100重量份的固体的环氧树脂的基础上，含有1〜10重量份的羧酸化合物，1〜30重量份的固化剂，硬化反应开始温度所述硬化剂为150℃以上，溶剂为10〜300重量份。

6. 发明授权

US07692318B2 Liquid epoxy resin composition and semiconductor device 有权
标题翻译：液体环氧树脂组合物和半导体器件
公开(公告)号：US07692318B2
公开(公告)日：2010-04-06
申请号：US11386776
申请日：2006-03-23
申请人： Hiroyuki Takenaka
发明人： Hiroyuki Takenaka
IPC分类号： H01L23/29 , C08L63/00 , B32B27/04 , B32B27/18 , B32B27/20 , B32B27/26 , B32B27/38
CPC分类号： C08G59/5033 , C08G59/188 , C08G59/628 , H01L21/563 , H01L23/293 , H01L24/31 , H01L2224/16225 , H01L2224/73203 , H01L2224/83951 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01019 , H01L2924/01027 , H01L2924/01033 , H01L2924/01045 , H01L2924/01077 , H01L2924/01082 , H01L2924/01087 , H01L2924/10253 , H01L2924/12044 , Y10T428/31511 , H01L2924/3512 , H01L2924/00 , H01L2224/0401
摘要： Better semiconductor encapsulation is achieved with a liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) a curing agent containing at least 5 wt % of an aromatic amine compound, (C) a microencapsulated catalyst containing a phenolic hydroxy-bearing benzoic acid derivative, and optionally, (D) an inorganic filler.
摘要翻译：使用液体环氧树脂组合物实现更好的半导体封装，所述液体环氧树脂组合物包含（A）液体环氧树脂，（B）含有至少5重量％芳族胺化合物的固化剂，（C）含有酚羟基的微胶囊化催化剂苯甲酸衍生物，和任选的（D）无机填料。

7. 发明申请

US20060217499A1 Liquid epoxy resin composition and semiconductor device 有权
标题翻译：液体环氧树脂组合物和半导体器件
公开(公告)号：US20060217499A1
公开(公告)日：2006-09-28
申请号：US11386776
申请日：2006-03-23
申请人： Hiroyuki Takenaka
发明人： Hiroyuki Takenaka
IPC分类号： C08L63/00 , C08K9/10 , C08G59/16
CPC分类号： C08G59/5033 , C08G59/188 , C08G59/628 , H01L21/563 , H01L23/293 , H01L24/31 , H01L2224/16225 , H01L2224/73203 , H01L2224/83951 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01019 , H01L2924/01027 , H01L2924/01033 , H01L2924/01045 , H01L2924/01077 , H01L2924/01082 , H01L2924/01087 , H01L2924/10253 , H01L2924/12044 , Y10T428/31511 , H01L2924/3512 , H01L2924/00 , H01L2224/0401
摘要： Better semiconductor encapsulation is achieved with a liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) a curing agent containing at least 5 wt % of an aromatic amine compound, (C) a microencapsulated catalyst containing a phenolic hydroxy-bearing benzoic acid derivative, and optionally, (D) an inorganic filler.
摘要翻译：使用液体环氧树脂组合物实现更好的半导体封装，所述液体环氧树脂组合物包含（A）液体环氧树脂，（B）含有至少5重量％芳族胺化合物的固化剂，（C）含有酚羟基的微胶囊化催化剂苯甲酸衍生物，和任选的（D）无机填料。

8. 发明公开

US20240192597A1 POLYMER, PHOTOSENSITIVE COMPOSITION, DRY FILM PHOTORESIST, AND LITHOGRAPHY METHOD 审中-公开
公开(公告)号：US20240192597A1
公开(公告)日：2024-06-13
申请号：US18493972
申请日：2023-10-25
申请人： INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
发明人： Yu-Ying HSU , Yao-Jheng HUANG , Ming-Tzung WU , Chin-Hua CHANG , Te-Yi CHANG
IPC分类号： G03F7/039 , C08G59/16 , C08G59/24 , C08G59/42 , C08G59/62 , G03F7/32
CPC分类号： G03F7/0392 , C08G59/1455 , C08G59/245 , C08G59/4238 , C08G59/628 , G03F7/322
摘要： A polymer is formed by a reaction of phenolic epoxy resin or bisphenol epoxy resin and carboxylic acid, wherein the phenolic epoxy resin has a chemical structure of

wherein W is H, alkyl group, or halogen. R1 is methylene, methylene diphenyl, dimethylene benzene, tetrahydrodicyclopentadiene, or

n=1 to 8. The bisphenol epoxy resin has a chemical structure of

wherein Z is H or alkyl group; R4 is methylene, methylmethylene, dimethylmethylene, ethylmethylmethylene, bi(trifluoromethyl)methylene, fluorenylidene, or sulfonyl group; and p=1 to 10. The carboxylic acid has a chemical structure of HOOC—Ar—(—X)m, HOOC—R2, or a combination thereof, wherein Ar is benzene or naphthalene; X is hydroxy group, alkoxy group, or alkyl group, and at least one X is hydroxy group; m=1 to 3, wherein R2 is C3-7 alkyl group.

9. 发明授权

US08551819B2 Method for surface mounting using cleaning-free activated resinous composition 有权
标题翻译：使用无清洁活性树脂组合物进行表面贴装的方法
公开(公告)号：US08551819B2
公开(公告)日：2013-10-08
申请号：US13335015
申请日：2011-12-22
申请人： Kazunori Kitamura , Yasuhiro Takase
发明人： Kazunori Kitamura , Yasuhiro Takase
IPC分类号： H01L21/58 , C08L63/00 , C09J163/00
CPC分类号： C08G59/628 , C08G59/4021 , H01L2224/73204 , H01L2924/1305 , H01L2924/13055 , H01L2924/15311 , H01L2924/00
摘要： Activated resinous composition contains, on the basis of epoxy resin being solid at a room temperature of 100 parts by weight, carboxylic acid compound of 1 to 10 parts by weight, hardening agent of 1 to 30 parts by weight, a hardening reaction initiation temperature of said hardening agent being 150° C. or higher, and solvent of 10 to 300 parts by weight.
摘要翻译：活性树脂组合物在室温为100重量份的固体的环氧树脂的基础上，含有1〜10重量份的羧酸化合物，1〜30重量份的固化剂，硬化反应开始温度所述硬化剂为150℃以上，溶剂为10〜300重量份。

10. 发明申请

US20050064336A1 Unsaturated group-containing multi-branched compounds, curable compositions containing the same, and cured products thereof 审中-公开
标题翻译：不饱和基团的多支链化合物，含有其的可固化组合物及其固化产物
公开(公告)号：US20050064336A1
公开(公告)日：2005-03-24
申请号：US10951698
申请日：2004-09-29
申请人： Hidekazu Miyabe
发明人： Hidekazu Miyabe
IPC分类号： C08F283/10 , C08F290/06 , C08G59/14 , C08G59/16 , C08G59/42 , C08G59/62 , G03F7/038 , H05K3/28 , G03C1/73
CPC分类号： C08G59/4292 , C08F283/10 , C08F290/06 , C08F290/064 , C08G59/1461 , C08G59/1494 , C08G59/621 , C08G59/628 , G03F7/038 , G03F7/0388 , H05K3/287
摘要： A curable composition is obtained by mixing a polymerization initiator (B) or further a thermosetting component with an unsaturated group-containing multi-branched compound (A-1)-(A-4) obtained by the reaction of (a) a compound containing at least two epoxy groups in its molecule with (b) a compound containing at least two (but at least three when the component (a) mentioned above is a polyfunctional epoxy compound containing two epoxy groups) carboxyl groups and/or phenolic hydroxyl groups in its molecule and (c) an unsaturated monocarboxylic acid or a compound containing at least one unsaturated double bond-containing group, or an unsaturated group-containing multi-branched compound (A-5)-(A-8) having a carboxyl group and obtained by further causing (d) a polybasic acid anhydride to react with a hydroxyl group of the unsaturated group-containing multi-branched compound mentioned above.
摘要翻译：通过将聚合引发剂（B）或热固性组分与通过（a）含有（C 1 -C 6）的化合物的反应得到的不饱和基团的多支化化合物（A-1） - （A-4）其分子中的至少两个环氧基与（b）含有至少两个的化合物（但当上述组分（a）为含有两个环氧基的多官能环氧化合物时），至少三个）羧基和/或酚羟基在其分子和（c）不饱和一元羧酸或含有至少一个不饱和双键的基团的化合物或具有羧基的不饱和基团的多支化化合物（A-5） - （A-8）和通过进一步使（d）多元酸酐与上述不饱和基团的多支化合物的羟基反应而得到。

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