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1. 发明申请

US20180318367A1 MORINGA EXTRACT 审中-公开
公开(公告)号：US20180318367A1
公开(公告)日：2018-11-08
申请号：US15770620
申请日：2016-10-21
申请人： Kazuhiko SUGIURA , Aditya KULKARNI
发明人： Kazuhiko SUGIURA , Aditya KULKARNI
IPC分类号： A61K36/185 , A23L33/105 , A23L2/54 , A23G3/48 , A23G4/06 , A23F5/46 , A23G9/42 , A23L9/10 , A61K31/7034
摘要： A moringa extract containing a benzyl glucosinolate in a content of 6% by mass or more, calculated as a dry solid content of the extract, wherein the extract does not substantially contain an alkaloid. The moringa extract of the present invention for solving a first aspect is useful in the field of foodstuff or the like. Also, the PPAR activator of the present invention for solving a second aspect has excellent PPAR activation action, and has no disadvantages in side effects, so that it can be ingested for long term, which can be preferably used in foodstuff and the like. Therefore, the PPAR activator of the present invention for solving a second aspect can be expected to be used as a food, a supplement or a medicament not only for prevention of disease such as insulin resistance, hyperinsulinism, Type 2 diabetes, hypertension, hyperlipidemia, arterial sclerosis and obesity, but also for fatigue recovery or endurance improvement by improving basal metabolism. In addition, a benzyl glucosinolate-containing composition for solving a third aspect is useful in the field of foodstuff or the like.

2. 发明授权

US08349634B2 Semiconductor device with sealed cap 有权
标题翻译：带密封盖的半导体器件
公开(公告)号：US08349634B2
公开(公告)日：2013-01-08
申请号：US12801845
申请日：2010-06-29
申请人： Tetsuo Fujii , Kazuhiko Sugiura
发明人： Tetsuo Fujii , Kazuhiko Sugiura
IPC分类号： H01L21/00
CPC分类号： B81B7/007 , H01L21/76898 , H01L23/481 , H01L2924/0002 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor device includes: a first substrate made of semiconductor and having first regions, which are insulated from each other and disposed in the first substrate; and a second substrate having electric conductivity and having second regions and insulation trenches. Each insulation trench penetrates the second substrate so that the second regions are insulated from each other. The first substrate provides a base substrate, and the second substrate provides a cap substrate. The second substrate is bonded to the first substrate so that a sealed space is provided between a predetermined surface region of the first substrate and the second substrate. The second regions include an extraction conductive region, which is coupled with a corresponding first region.
摘要翻译：半导体器件包括：由半导体制成的第一衬底，其具有彼此绝缘并设置在第一衬底中的第一区域; 以及具有导电性并具有第二区域和绝缘沟槽的第二基板。每个绝缘沟槽穿透第二衬底，使得第二区域彼此绝缘。第一衬底提供基底，第二衬底提供盖衬底。第二基板被接合到第一基板，使得在第一基板的预定表面区域和第二基板之间设置密封空间。第二区域包括与对应的第一区域耦合的引出导电区域。

3. 发明申请

US20100270630A1 Semiconductor device and method for manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US20100270630A1
公开(公告)日：2010-10-28
申请号：US12801845
申请日：2010-06-29
申请人： Tetsuo FUJII , Kazuhiko SUGIURA
发明人： Tetsuo FUJII , Kazuhiko SUGIURA
IPC分类号： H01L29/66 , H01L21/70
CPC分类号： B81B7/007 , H01L21/76898 , H01L23/481 , H01L2924/0002 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor device includes: a first substrate made of semiconductor and having first regions, which are insulated from each other and disposed in the first substrate; and a second substrate having electric conductivity and having second regions and insulation trenches. Each insulation trench penetrates the second substrate so that the second regions are insulated from each other. The first substrate provides a base substrate, and the second substrate provides a cap substrate. The second substrate is bonded to the first substrate so that a sealed space is provided between a predetermined surface region of the first substrate and the second substrate. The second regions include an extraction conductive region, which is coupled with a corresponding first region.
摘要翻译：半导体器件包括：由半导体制成的第一衬底，其具有彼此绝缘并设置在第一衬底中的第一区域; 以及具有导电性并具有第二区域和绝缘沟槽的第二基板。每个绝缘沟槽穿透第二衬底，使得第二区域彼此绝缘。第一衬底提供基底，第二衬底提供盖衬底。第二基板被接合到第一基板，使得在第一基板的预定表面区域和第二基板之间设置密封空间。第二区域包括与对应的第一区域耦合的引出导电区域。

4. 发明授权

US07662668B2 Method for separating a semiconductor substrate into a plurality of chips along with a cutting line on the semiconductor substrate 有权
标题翻译：将半导体衬底与半导体衬底上的切割线分离成多个芯片的方法
公开(公告)号：US07662668B2
公开(公告)日：2010-02-16
申请号：US11591496
申请日：2006-11-02
申请人： Kazuhiko Sugiura , Kenichi Yokoyama , Muneo Tamura , Tetsuo Fujii , Makoto Asai
发明人： Kazuhiko Sugiura , Kenichi Yokoyama , Muneo Tamura , Tetsuo Fujii , Makoto Asai
IPC分类号： H01L21/00
CPC分类号： H01L21/78 , B23K26/16 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , H01L21/6835 , H01L21/6836 , H01L2221/68318 , H01L2221/68327 , H01L2221/68336 , H01L2924/3025
摘要： A separating device for separating a semiconductor substrate includes: a cutting element for cutting the semiconductor substrate into a plurality of chips along with a cutting line on the semiconductor substrate; an adsorbing element for adsorbing a dust on a surface of the semiconductor substrate by using electrostatic force; and a static electricity generating element for generating static electricity and for controlling the static electricity in order to remove the dust from the adsorbing element.
摘要翻译：用于分离半导体衬底的分离装置包括：用于将半导体衬底与半导体衬底上的切割线一起切割成多个芯片的切割元件; 用于通过使用静电力吸附在所述半导体衬底的表面上的灰尘的吸附元件; 以及用于产生静电并用于控制静电以便从吸附元件去除灰尘的静电发生元件。

5. 发明授权

US07547642B2 Micro-structure manufacturing method 有权
标题翻译：微结构制造方法
公开(公告)号：US07547642B2
公开(公告)日：2009-06-16
申请号：US11296466
申请日：2005-12-08
申请人： Kazuhiko Sugiura
发明人： Kazuhiko Sugiura
IPC分类号： H01L21/302
CPC分类号： B81C1/00476
摘要： A method of manufacturing a micro-structure includes dry-etching a sacrificial layer provided to a silicon substrate to form structures the sacrificial layer reacting with etching gas to generate reaction products including H2O, wherein the dry-etching includes etching the sacrificial layer and removing H2O as one of the reaction products generated through the etching step of the sacrificial layer, wherein the etching and the removing of H2O are repetitively performed.
摘要翻译：制造微结构的方法包括干法蚀刻提供给硅衬底的牺牲层，以形成牺牲层与蚀刻气体反应以产生包括H 2 O的反应产物的结构，其中干蚀刻包括蚀刻牺牲层并除去H 2 O 作为通过牺牲层的蚀刻步骤产生的反应产物之一，其中反复进行蚀刻和除去H 2 O。

6. 发明申请

US20090008728A1 Semiconductor device and manufacturing method of the same 有权
标题翻译：半导体器件及其制造方法相同
公开(公告)号：US20090008728A1
公开(公告)日：2009-01-08
申请号：US12213711
申请日：2008-06-24
申请人： Tetsuo Fujii , Kazuhiko Sugiura
发明人： Tetsuo Fujii , Kazuhiko Sugiura
IPC分类号： H01L29/84 , H01L21/58
CPC分类号： B81B7/007 , B81B2207/07 , B81B2207/097 , B81C2203/0118 , G01P15/0802 , H01L2224/05001 , H01L2224/05008 , H01L2224/05124 , H01L2224/05147 , H01L2224/05572 , H01L2224/05624 , H01L2224/16145 , H01L2924/00014
摘要： A semiconductor device includes: a sensor element having a plate shape with a surface and including a sensor structure disposed in a surface portion of the sensor element; and a plate-shaped cap element bonded to the surface of the sensor element. The cap element has a wiring pattern portion facing the sensor element. The wiring pattern portion connects an outer periphery of the surface of the sensor element and the sensor structure so that the sensor structure is electrically coupled with an external element via the outer periphery. The sensor element does not have a complicated multi-layered structure, so that the sensor element is simplified. Further, the dimensions of the device are reduced.
摘要翻译：半导体器件包括：传感器元件，其具有表面的板形，并且包括设置在传感器元件的表面部分中的传感器结构; 以及结合到传感器元件的表面的板状盖元件。盖元件具有面向传感器元件的布线图案部分。布线图形部分连接传感器元件的表面的外周和传感器结构，使得传感器结构经由外周与外部元件电耦合。传感器元件不具有复杂的多层结构，因此传感器元件被简化。此外，装置的尺寸减小。

7. 发明申请

US20080148467A1 Hanger loop on inner side of pocket for preventing portable telephone, or the like, from falling 审中-公开
标题翻译：用于防止便携式电话等的袋子的内侧的衣架环不会掉落
公开(公告)号：US20080148467A1
公开(公告)日：2008-06-26
申请号：US11983044
申请日：2007-11-07
申请人： Kazuhiko Sugiura
发明人： Kazuhiko Sugiura
IPC分类号： A41D27/22 , A45F5/02
CPC分类号： A41D27/205 , A41D27/20 , A45F5/02 , A45F2200/0516
摘要： Recently a portable telephone, a portable player or a compact digital camera is packed with various kinds of personal information. Since personal information is lost or flowed out when a portable telephone or the like is broken by a shock or picked up by a stranger as a result of falling to a ground or a floor, falling of a portable telephone or the like must be prevented positively. A hanger loop on inner side of a pocket is characterized in that falling of a portable telephone or the like can be prevented positively by sewing a loop cloth on inner side of a pocket and connecting a portable telephone or the like and a strap to the loop cloth.
摘要翻译：近来，便携式电话，便携式播放器或小型数码相机包装有各种个人信息。由于个人信息丢失或流出时，手机电话等因震撼而被陌生人摔倒，因地面或地板坠落，必须积极防止便携式电话等的掉落。口袋内侧的衣架环的特征在于，可以通过在口袋的内侧缝合环布并将便携式电话机等连接到环路上，从而可以有效地防止便携式电话等的掉落布。

8. 发明申请

US20080123162A1 IMAGE SCANNING DEVICE 有权
标题翻译：图像扫描装置
公开(公告)号：US20080123162A1
公开(公告)日：2008-05-29
申请号：US11947316
申请日：2007-11-29
申请人： Kazuhiko SUGIURA
发明人： Kazuhiko SUGIURA
IPC分类号： H04N1/04
CPC分类号： G06K9/2054 , G06K2209/01 , H04N1/00795 , H04N1/00801 , H04N1/00822
摘要： An image scanning device has a scanning unit, a first storage unit, a first determination unit, and a control unit. The scanning unit scans an original document to produce image data. The first storage unit stores a specific condition used by the scanning unit for scanning a specific document. The specific document requires a limited scanning condition. The first determination unit determines based on the image data whether the original document is the specific document. The control unit reads the specific condition from the first storage unit and causes the scanning unit to scan the original document with the specific condition if the first determination unit determines that the original document is the specific document.
摘要翻译：图像扫描装置具有扫描单元，第一存储单元，第一确定单元和控制单元。扫描单元扫描原始文档以产生图像数据。第一存储单元存储扫描单元用于扫描特定文档的特定条件。具体文件需要有限的扫描条件。第一确定单元基于图像数据确定原始文档是否是特定文档。控制单元从第一存储单元读取特定条件，并且如果第一确定单元确定原始文档是特定文档，则使扫描单元以特定条件扫描原始文档。

9. 发明申请

US20070111478A1 Semiconductor device and dicing method for semiconductor substrate 有权
标题翻译：半导体器件和半导体衬底的切割方法
公开(公告)号：US20070111478A1
公开(公告)日：2007-05-17
申请号：US11600136
申请日：2006-11-16
申请人： Atsushi Komura , Muneo Tamura , Kazuhiko Sugiura , Hirotsugu Funato , Yumi Maruyama , Tetsuo Fujii , Kenji Kohno
发明人： Atsushi Komura , Muneo Tamura , Kazuhiko Sugiura , Hirotsugu Funato , Yumi Maruyama , Tetsuo Fujii , Kenji Kohno
IPC分类号： H01L21/00
CPC分类号： B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D5/0011 , H01L21/78
摘要： A method for dicing a semiconductor substrate includes: forming a reforming layer in the substrate by irradiating a laser beam on the substrate; forming a groove on the substrate along with a cutting line; and applying a force to the substrate in order to cutting the substrate at the reforming layer as a starting point of cutting. The groove has a predetermined depth so that the groove is disposed near the reforming layer, and the force provides a stress at the groove.
摘要翻译：一种用于切割半导体衬底的方法包括：通过在衬底上照射激光束在衬底中形成重整层; 与切割线一起在基板上形成凹槽; 并向基板施加力以切割重整层处的基板作为切割的起点。槽具有预定的深度，使得槽设置在重整层附近，并且该力在槽处提供应力。

10. 发明授权

US07157781B2 Enhancement of membrane characteristics in semiconductor device with membrane 有权
标题翻译：用膜增强半导体器件膜特性
公开(公告)号：US07157781B2
公开(公告)日：2007-01-02
申请号：US10425663
申请日：2003-04-30
申请人： Eishi Kawasaki , Hisanori Yokura , Kazuhiko Sugiura
发明人： Eishi Kawasaki , Hisanori Yokura , Kazuhiko Sugiura
IPC分类号： H01L29/84 , H01L21/00
CPC分类号： B81C1/00047 , B81B2201/0264 , B81B2203/0127 , B81C2203/0145 , B81C2203/019 , G01L9/0042 , G01P15/0802 , G01P15/125
摘要： A semiconductor device having a membrane includes a semiconductor substrate, which has an active surface, and a membrane. A cavity is located between the active surface and the membrane and hermetically sealed. The membrane includes a first film, which has a through hole that extends through the first film, and a second film, which has been formed by reflowing a reflow layer made of a material that becomes viscous and reflows when heated. The through hole has been plugged by the second film.
摘要翻译：具有膜的半导体器件包括具有活性表面的半导体衬底和膜。空腔位于活性表面和膜之间并进行密封。膜包括具有延伸穿过第一膜的通孔的第一膜和通过回流由加热时粘稠并回流的材料制成的回流层而形成的第二膜。通孔已被第二个胶片堵住。

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