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1. 发明申请

US20130075980A1 Annular Elastic Gasket 失效
标题翻译：环形弹性垫片
公开(公告)号：US20130075980A1
公开(公告)日：2013-03-28
申请号：US13702715
申请日：2011-06-10
申请人： Keita Yamamoto , Kazuhiro Takahashi , Kenji Matsumoto
发明人： Keita Yamamoto , Kazuhiro Takahashi , Kenji Matsumoto
IPC分类号： F02F11/00
CPC分类号： F02F11/00 , B29C45/0001 , B29C45/14065 , B29C2045/14122 , B29K2021/006 , B29L2031/265 , F16J15/025 , F16J15/122 , F16J15/3224 , F16L5/025 , F16L5/10
摘要： An annular elastic gasket adapted to be disposed between an insertion hole formed in a housing and a cylindrical body which is inserted into the housing via the insertion hole in such a manner that the annular elastic gasket elastically contacts an inner surface of the insertion hole and an outer circumferential surface of the cylindrical body. The annular elastic gasket comprises a hollow cylindrical gasket base body comprised of a molded body made of an elastic material, to be compressedly fitted and retained in the insertion hole, an annular seal lip portion extending in the centripetal direction from the gasket base body and an elastic extending portion which constitutes an extending base portion at an end of a tip side portion of the annular seal lip portion, being bent in such a manner that the end directs in the centripetal direction. The elastic extending portion elastically expands in the diametrical direction together with the tip side portion when the cylindrical body is inserted into the insertion hole, thereby the elastic extending portion elastically contacts the outer circumferential surface of the cylindrical body while maintaining elastic restoring force in the contracting direction.
摘要翻译：一种环形弹性垫片，其适于设置在形成在壳体中的插入孔和经由插入孔插入到壳体中的圆柱体之间，使得环形弹性垫片弹性地接触插入孔的内表面，并且圆柱体的外圆周表面。环形弹性垫圈包括中空圆柱形垫片基体，该中空圆柱形垫片基体由弹性材料制成的模制体压缩并保持在插入孔中，环形密封唇部分沿着向心方向从垫圈基体延伸，弹性延伸部分构成在环形密封唇部分的末端侧部分的端部处的延伸基部，以使端部沿向心方向引导的方式弯曲。当圆柱体插入到插入孔中时，弹性延伸部分在直径方向上与末端侧部分弹性膨胀，从而弹性延伸部分弹性地接触圆柱体的外圆周表面，同时保持收缩中的弹性恢复力方向。

2. 发明申请

US20120313331A1 Gasket and Seal Structure 审中-公开
标题翻译：垫圈和密封结构
公开(公告)号：US20120313331A1
公开(公告)日：2012-12-13
申请号：US13490988
申请日：2012-06-07
申请人： Keita Yamamoto
发明人： Keita Yamamoto
IPC分类号： F16J15/10
CPC分类号： F16J15/121 , F01L1/053 , F01L1/46 , F16J15/062
摘要： A gasket and a gasket seal structure in which the gasket is adapted to be inserted into a cutout recess part formed on a wall part of a box-shaped member with an opening part on at least one surface, the cutout recess part communicating with the opening part. The gasket and the structure thereof are characterized by the followings; the cutout recess part has a chamfered surface at the corner part on the opening part side; the gasket comprises an exterior rubber part having a seal surface part elastically contacting the cutout recess part and a core body having higher rigidity than that of the exterior rubber part and covered with the exterior rubber part; and the seal surface part has at a region corresponding to the corner part on the opening part side of the cutout recess part a projecting part formed along the corner part on the opening part side and projecting toward the corner part on the opening part side of the cutout recess part.
摘要翻译：一种垫圈和垫圈密封结构，其中所述垫圈适于插入到形成在盒形构件的壁部上的切口凹部中，在至少一个表面上具有开口部，所述切口凹部与所述开口部分。垫圈及其结构的特征如下：切口凹部在开口部侧的角部具有倒角面; 垫圈包括外部橡胶部分，其具有弹性地接触切口凹部的密封表面部分和具有比外部橡胶部分刚性更高并被外部橡胶部分覆盖的刚性的芯体; 并且所述密封面部具有与所述切口凹部的开口部侧的所述角部相对应的区域，所述突出部沿着所述开口部侧的所述角部形成并朝向所述开口部的所述开口部侧的所述角部突出切口凹部。

3. 发明申请

US20120244647A1 Pick-Up Method of Die Bonder and Die Bonder 有权
标题翻译：芯片焊接机和芯片焊接机的拾取方法
公开(公告)号：US20120244647A1
公开(公告)日：2012-09-27
申请号：US13224366
申请日：2011-09-02
申请人： Naoki OKAMOTO , Keita Yamamoto
发明人： Naoki OKAMOTO , Keita Yamamoto
IPC分类号： H01L21/66 , B32B38/10 , B32B37/00
CPC分类号： H01L21/67132 , H01L21/67271 , H01L2221/68322 , H01L2221/68336 , H01L2221/68354 , H01L2221/68381 , H01L2221/68386 , Y10S156/932 , Y10S156/943 , Y10T156/1132 , Y10T156/1179 , Y10T156/1944 , Y10T156/1983
摘要： The present invention provides a die bonder capable of stripping a die without fail, or a highly reliable die bonder or pick-up method using the die bonder.When a die to be stripped out of plural dies (semiconductor chips) bonded to a dicing film is to be tossed and stripped from the dicing film, the dicing film corresponding to predetermined positions out of the peripheral portion of the die is tossed to form stripping start points and then, the dicing film corresponding to portions other than the above predetermined positions is tossed to strip the die from the dicing film.
摘要翻译：本发明提供一种能够不经故障地剥离模具的芯片焊接机，或使用该芯片焊接机的高可靠性的芯片焊接机或拾取方法。当与切割膜结合的多个模具（半导体芯片）被剥离的模具被从切割膜上抛出并剥离时，将与模具的周边部分相对应的预定位置的切割薄膜折腾以形成剥离起始点，然后将与上述预定位置以外的部分相对应的切割膜被抛出，从切割膜剥离模具。

4. 发明授权

US09343338B2 Pick-up method of die bonder and die bonder 有权
标题翻译：贴片机和芯片焊接机的拾取方法
公开(公告)号：US09343338B2
公开(公告)日：2016-05-17
申请号：US13224366
申请日：2011-09-02
申请人： Naoki Okamoto , Keita Yamamoto
发明人： Naoki Okamoto , Keita Yamamoto
IPC分类号： H01L21/66 , B32B38/10 , H01L21/67
CPC分类号： H01L21/67132 , H01L21/67271 , H01L2221/68322 , H01L2221/68336 , H01L2221/68354 , H01L2221/68381 , H01L2221/68386 , Y10S156/932 , Y10S156/943 , Y10T156/1132 , Y10T156/1179 , Y10T156/1944 , Y10T156/1983
摘要： When a die to be stripped out of plural dies (semiconductor chips) bonded to a dicing film is to be tossed and stripped from the dicing film, the dicing film corresponding to predetermined positions out of the peripheral portion of the die is tossed to form stripping start points. The dicing film corresponding to portions other than the above predetermined positions is then tossed to strip the die from the dicing film.
摘要翻译：当与切割膜结合的多个模具（半导体芯片）被剥离的模具被从切割膜上抛出并剥离时，将与模具的周边部分相对应的预定位置的切割薄膜折腾以形成剥离起点然后将与上述预定位置以外的部分相对应的切割膜抛弃，从切割膜剥离模具。

5. 发明授权

US3255391A Electrochemical apparatus 失效
标题翻译：电化学仪器
公开(公告)号：US3255391A
公开(公告)日：1966-06-07
申请号：US15474961
申请日：1961-11-24
申请人： KEITA YAMAMOTO
发明人： KEITA YAMAMOTO
IPC分类号： H01G9/00 , H01G9/22 , H01G11/02 , H01G11/12 , H01G11/62 , H01G11/74 , H03B7/00
CPC分类号： H01G9/0029 , H01G9/22 , H01G11/02 , H01G11/12 , H01G11/62 , H01G11/74 , H03B7/00 , Y02E60/13

6. 发明授权

US08714563B2 Annular elastic gasket 失效
标题翻译：环形弹性垫片
公开(公告)号：US08714563B2
公开(公告)日：2014-05-06
申请号：US13702715
申请日：2011-06-10
申请人： Keita Yamamoto , Kazuhiro Takahashi , Kenji Matsumoto
发明人： Keita Yamamoto , Kazuhiro Takahashi , Kenji Matsumoto
IPC分类号： F16J15/32
CPC分类号： F02F11/00 , B29C45/0001 , B29C45/14065 , B29C2045/14122 , B29K2021/006 , B29L2031/265 , F16J15/025 , F16J15/122 , F16J15/3224 , F16L5/025 , F16L5/10
摘要： An annular elastic gasket adapted to be disposed between an insertion hole formed in a housing and a cylindrical body which is inserted into the housing via the insertion hole in such a manner that the annular elastic gasket elastically contacts an inner surface of the insertion hole and an outer circumferential surface of the cylindrical body. The annular elastic gasket comprises a hollow cylindrical gasket base body comprised of a molded body made of an elastic material, to be compressedly fitted and retained in the insertion hole, an annular seal lip portion extending in the centripetal direction from the gasket base body and an elastic extending portion which constitutes an extending base portion at an end of a tip side portion of the annular seal lip portion, being bent in such a manner that the end directs in the centripetal direction. The elastic extending portion elastically expands in the diametrical direction together with the tip side portion when the cylindrical body is inserted into the insertion hole, thereby the elastic extending portion elastically contacts the outer circumferential surface of the cylindrical body while maintaining elastic restoring force in the contracting direction.
摘要翻译：一种环形弹性垫片，其适于设置在形成在壳体中的插入孔和经由插入孔插入到壳体中的圆柱体之间，使得环形弹性垫片弹性地接触插入孔的内表面，并且圆柱体的外圆周表面。环形弹性垫圈包括中空圆柱形垫片基体，该中空圆柱形垫片基体由弹性材料制成的模制体压缩并保持在插入孔中，环形密封唇部分沿着向心方向从垫圈基体延伸，弹性延伸部分构成在环形密封唇部分的末端侧部分的端部处的延伸基部，以使端部沿向心方向引导的方式弯曲。当圆柱体插入到插入孔中时，弹性延伸部分在直径方向上与末端侧部分弹性膨胀，从而弹性延伸部分弹性地接触圆柱体的外圆周表面，同时保持收缩中的弹性恢复力方向。

7. 发明申请

US20110110037A1 DRIVER MODULE STRUCTURE 审中-公开
标题翻译：驱动器模块结构
公开(公告)号：US20110110037A1
公开(公告)日：2011-05-12
申请号：US12864644
申请日：2009-01-07
申请人： Toshiya Yamaguchi , Shigeo Yumoto , Hirofumi Kamikokuryou , Keita Yamamoto
发明人： Toshiya Yamaguchi , Shigeo Yumoto , Hirofumi Kamikokuryou , Keita Yamamoto
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L23/36 , H01L23/3675 , H01L23/4985 , H01L2924/0002 , H01L2924/14 , H01L2924/00
摘要： Provided is a driver module structure capable of ensuring high reliability.A PDP driver device 1 includes: a flexible substrate 2 having an interconnect pattern; a semiconductor device 3 placed on the flexible substrate 2; and a heat dissipating body 4 having a recess 41 configured to accommodate the semiconductor device 3. The heat dissipating body 4 is provided with four grooves 8 as airflow paths that connect a space in the recess 41 to the outside, and the grooves 8 have a substantially V-shaped cross section.
摘要翻译：提供能够确保高可靠性的驱动器模块结构。 PDP驱动器装置1包括：具有互连图案的柔性基板2; 放置在柔性基板2上的半导体装置3; 以及散热体4，其具有构造成容纳半导体装置3的凹部41.散热体4设置有四个凹槽8，其作为将凹部41中的空间连接到外部的气流路径，并且凹槽8具有大致V形横截面。

8. 发明授权

US4108946A Graft-polymer composition of rubber for reinforcing crosslinked resin 失效
标题翻译：用于增强交联树脂的橡胶接枝聚合物组合物
公开(公告)号：US4108946A
公开(公告)日：1978-08-22
申请号：US358932
申请日：1973-05-10
申请人： Kazumasa Kamada , Ryoji Handa , Norihisa Kusakawa , Keita Yamamoto
发明人： Kazumasa Kamada , Ryoji Handa , Norihisa Kusakawa , Keita Yamamoto
IPC分类号： C08F2/22 , C08F285/00 , C08L51/00 , C08L33/00
CPC分类号： C08F285/00
摘要： A thermoplastic graft polymer composition excellent in weather resistance, impact resistance and appearance is obtained by seed-polymerizing 50 to 95 parts by weight of a mixture (b) of 60% by weight or more of at least one acrylic ester, 39.9% by weight or less of at least one monomer copolymerizable therewith and 0.1 to 10% by weight of at least one crosslinking monomer having at least two non-conjugated C .dbd. C bonds in the presence of 5 to 50 parts by weight (solids) of a latex (particle size: 0.04 to 0.24 .mu.) of a crosslinked rigid resin (a) having a glass transition temperature of at least 50.degree. C., a decomposition temperature of at least 240.degree. C. and a gel content of at least 70% by weight or more to prepare two-layered crosslinked acrylic rubber particles (1) having a degree of swelling of 3 to 15, emulsion-graft-polymerizing 5 to 1,900 parts by weight of a monomer mixture (2) of 10 to 90% by weight of at least one aromatic vinyl compound and 90 to 10% by weight of at least one ethylenically unsaturated compound having the general formula CH.sub.2 = CRX, wherein R is H or CH.sub.3, and X is CN or COOR.sub.1 (wherein R.sub.1 is an alkyl group having 1 to 4 carbon atoms) in the presence of a latex containing 100 parts by weight of said two-layered crosslinked acrylic rubber particles (1) to obtain a graft polymer (3) and, if necessary, blending said graft polymer (3) with a rigid thermoplastic resin (4) so that 5 to 70% by weight of the two-layered crosslinked acrylic rubber particles (1) are contained in the resulting composition.
摘要翻译：通过将50至95重量份的60重量％或更多的至少一种丙烯酸酯，39.9重量％的丙烯酸酯的混合物（b）进行种子聚合，获得耐候性，耐冲击性和外观优异的热塑性接枝聚合物组合物或更少的至少一种可共聚的单体和0.1至10重量％的至少一种具有至少两个非共轭C = C键的交联单体，在5至50重量份（固体）胶乳的存在下粒径：0.04〜0.24μm）的玻璃化转变温度为至少50℃，分解温度为240℃以上，凝胶含量为70重量％以上的交联硬质树脂（a）或更多，以制备溶胀度为3至15的两层交联丙烯酸橡胶颗粒（1），乳液接枝聚合5至1,900重量份的单体混合物（2）为10至90重量％的单体混合物至少一种芳族乙烯基化合物和90至10重量％的至少o 具有通式CH 2 = CRX的N-烯键式不饱和化合物，其中R是H或CH 3，X是CN或COOR 1（其中R 1是具有1至4个碳原子的烷基）在含有100重量份的所述两层交联丙烯酸橡胶颗粒（1），以获得接枝聚合物（3），并且如果需要，将所述接枝聚合物（3）与刚性热塑性树脂（4）共混，使得5至70重量％在所得组合物中含有两层交联丙烯酸橡胶颗粒（1）。

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