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1. 发明申请

US20140144375A1 EQUIPMENT FOR MANUFACTURING SEMICONDUCTOR 审中-公开
标题翻译：制造半导体设备
公开(公告)号：US20140144375A1
公开(公告)日：2014-05-29
申请号：US14235322
申请日：2012-07-31
申请人： Young Dae Kim , Jun Jin Hyon , Sang Ho Woo , Seung Woo Shin
发明人： Young Dae Kim , Jun Jin Hyon , Sang Ho Woo , Seung Woo Shin
IPC分类号： H01L21/67
CPC分类号： H01L21/67017 , H01L21/02046 , H01L21/02532 , H01L21/02576 , H01L21/02579 , H01L21/0262 , H01L21/67051 , H01L21/67178 , H01L21/67757
摘要： Provided is an equipment for manufacturing a semiconductor. The equipment for manufacturing a semiconductor includes a cleaning chamber in which a cleaning process is performed on substrates, an epitaxial chamber in which an epitaxial process for forming an epitaxial layer on each of the substrates is performed, and a transfer chamber to which the cleaning chamber and the epitaxial chamber are connected to sides surfaces thereof, the transfer chamber including a substrate handler for transferring the substrates, on which the cleaning process is completed, into the epitaxial chamber. The cleaning chamber includes a reaction chamber connected to a side surface of the transfer chamber to perform a reaction process on the substrates and a heating chamber connected to a side surface of the transfer chamber to perform a heating process on the substrates. The reaction chamber and the heating chamber are vertically stacked on each other.
摘要翻译：提供了一种用于制造半导体的设备。用于制造半导体的设备包括其中对基板进行清洁处理的清洁室，其中执行在每个基板上形成外延层的外延工艺的外延室，以及清洁室并且外延室连接到其侧表面，转移室包括用于将完成清洁处理的基板转移到外延室中的基板处理器。清洁室包括连接到传送室的侧表面的反应室，以对基板进行反应处理，以及连接到传送室的侧表面的加热室，以对基板进行加热处理。反应室和加热室垂直地堆叠在一起。

2. 发明申请

US20140174357A1 EQUIPMENT FOR MANUFACTURING SEMICONDUCTOR 审中-公开
标题翻译：制造半导体设备
公开(公告)号：US20140174357A1
公开(公告)日：2014-06-26
申请号：US14235313
申请日：2012-07-31
申请人： Young Dae Kim , Jun Jin Hyon , Sang Ho Woo , Seung Woo Shin , Hai Won Kim
发明人： Young Dae Kim , Jun Jin Hyon , Sang Ho Woo , Seung Woo Shin , Hai Won Kim
IPC分类号： C30B25/02
CPC分类号： C30B25/02 , C23C16/0236 , C23C16/54 , C30B25/08 , C30B35/005 , H01L21/02046 , H01L21/67051 , H01L21/67178 , H01L21/67757
摘要： Provided is an equipment for manufacturing a semiconductor. The equipment for manufacturing a semiconductor includes a cleaning chamber in which a cleaning process is performed on substrates, an epitaxial chamber in which an epitaxial process for forming an epitaxial layer on each of the substrates is performed, and a transfer chamber to which the cleaning chamber and the epitaxial chamber are connected to sides surfaces thereof, the transfer chamber including a substrate handler for transferring the substrates, on which the cleaning process is completed, into the epitaxial chamber. The cleaning chamber is performed in a batch type with respect to the plurality of substrates.
摘要翻译：提供了一种用于制造半导体的设备。用于制造半导体的设备包括其中对基板进行清洁处理的清洁室，其中执行在每个基板上形成外延层的外延工艺的外延室，以及清洁室并且外延室连接到其侧表面，转移室包括用于将完成清洁处理的基板转移到外延室中的基板处理器。清洁室相对于多个基板以批式进行。

3. 发明申请

US20130149078A1 SUBSTRATE-PROCESSING APPARATUS AND SUBSTRATE-TRANSFERRING METHOD 审中-公开
标题翻译：基板处理装置和基板传输方法
公开(公告)号：US20130149078A1
公开(公告)日：2013-06-13
申请号：US13813985
申请日：2011-08-30
申请人： Sung Tae Je , Il Kwang Yang , Jun Jin Hyon
发明人： Sung Tae Je , Il Kwang Yang , Jun Jin Hyon
IPC分类号： H01L21/677
CPC分类号： H01L21/677 , H01L21/67745 , H01L21/68742
摘要： According to one embodiment of the present invention, a substrate-processing apparatus includes: first and second chambers parallel to each other; a plurality of first lift pins disposed in the first chamber, and supporting a first substrate transferred to the first chamber; a plurality of second lift pins disposed in the second chamber, and supporting a second substrate transferred into the second chamber; and a transfer robot transferring the first and second substrates into the first and second chambers. The transfer robot includes first and second blades that simultaneously elevate to transfer the first and second substrates to the upper sides of the first and second lift pins, respectively. The first and second blades can move to: a moving position higher than the upper ends of the first and second lift pins; a first loading position in which the first blade is lower than the upper ends of the first lift pins and the second blade is higher than the upper ends of the second lift pins; and a second loading position in which the first and second blades are lower than the upper ends of the first and second lift pins.
摘要翻译：根据本发明的一个实施例，一种基板处理装置包括：彼此平行的第一和第二腔; 设置在所述第一室中的多个第一提升销，并且支撑转移到所述第一室的第一基板; 多个第二提升销，设置在所述第二室中，并且支撑转移到所述第二室中的第二基板; 以及将第一和第二基板转移到第一和第二室中的传送机器人。传送机器人包括分别同时提升以将第一和第二基板分别传送到第一和第二提升销的上侧的第一和第二叶片。第一和第二叶片可以移动到：比第一和第二提升销的上端高的移动位置; 其中所述第一叶片低于所述第一提升销和所述第二叶片的上端的第一装载位置高于所述第二提升销的上端; 以及第二装载位置，其中第一和第二叶片比第一和第二提升销的上端低。

4. 发明申请

US20140190410A1 EQUIPMENT FOR MANUFACTURING SEMICONDUCTOR 审中-公开
标题翻译：制造半导体设备
公开(公告)号：US20140190410A1
公开(公告)日：2014-07-10
申请号：US14235896
申请日：2012-07-31
申请人： Young Dae Kim , Jun Jin Hyon , Sang Ho Woo , Seung Woo Shin , Hai Won Kim
发明人： Young Dae Kim , Jun Jin Hyon , Sang Ho Woo , Seung Woo Shin , Hai Won Kim
IPC分类号： C30B25/10
CPC分类号： C30B25/10 , C30B25/08 , C30B29/06 , C30B35/00 , H01L21/02046 , H01L21/67178 , H01L21/67207 , H01L21/67757
摘要： Provided is an equipment for manufacturing a semiconductor. The equipment for manufacturing a semiconductor includes a cleaning chamber in which a cleaning process is performed on substrates, an epitaxial chamber in which an epitaxial process for forming an epitaxial layer on each of the substrates is performed, and a transfer chamber to which the cleaning chamber and the epitaxial chamber are connected to sides surfaces thereof, the transfer chamber including a substrate handler for transferring the substrates, on which the cleaning process is completed, into the epitaxial chamber.
摘要翻译：提供了一种用于制造半导体的设备。用于制造半导体的设备包括其中对基板进行清洁处理的清洁室，其中执行在每个基板上形成外延层的外延工艺的外延室，以及清洁室并且外延室连接到其侧表面，转移室包括用于将完成清洁处理的基板转移到外延室中的基板处理器。

5. 发明申请

US20140209024A1 EQUIPMENT FOR MANUFACTURING SEMICONDUCTOR 审中-公开
标题翻译：制造半导体设备
公开(公告)号：US20140209024A1
公开(公告)日：2014-07-31
申请号：US14235901
申请日：2012-07-31
申请人： Young Dae Kim , Jun Jin Hyon , Sang Ho Woo , Seung Woo Shin , Hai Won Kim
发明人： Young Dae Kim , Jun Jin Hyon , Sang Ho Woo , Seung Woo Shin , Hai Won Kim
IPC分类号： H01L21/67
CPC分类号： H01L21/67184 , C30B25/08 , C30B29/06 , C30B35/005 , H01L21/02046 , H01L21/67051 , H01L21/67178 , H01L21/67757
摘要： Provided is an equipment for manufacturing a semiconductor. The equipment for manufacturing a semiconductor includes a cleaning chamber in which a cleaning process is performed on substrates, an epitaxial chamber in which an epitaxial process for forming an epitaxial layer on each of the substrates is performed, a buffer chamber having a storage space for storing the substrates, and a transfer chamber to which the cleaning chamber, the buffer chamber, and the epitaxial chamber are connected to side surfaces thereof, the transfer chamber comprising a substrate handler for transferring the substrates between the cleaning chamber, the buffer chamber, and the epitaxial chamber. The substrate handler successively transfers the substrates, on which the cleaning process is completed, into the buffer chamber, transfers the substrates stacked within the buffer chamber the epitaxial chamber, and successively transfers the substrates, on which the epitaxial layers are respectively formed, into the buffer chamber.
摘要翻译：提供了一种用于制造半导体的设备。用于制造半导体的设备包括其中对基板进行清洁处理的清洁室，其中执行在每个基板上形成外延层的外延工艺的外延室，具有用于存储的存储空间的缓冲室所述基板和所述清洁室，所述缓冲室和所述外延室连接到其侧表面的传送室，所述传送室包括用于在所述清洁室，所述缓冲室和所述缓冲室之间传送所述基板的基板处理器外延室。衬底处理器将完成清洁处理的衬底连续地传送到缓冲室中，将堆叠在缓冲室内的衬底传送到外延室，并且将分别形成有外延层的衬底依次传送到缓冲室。

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