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1. 发明授权

US07505251B2 Actuation mechanism for mating electronic card interconnect systems 有权
标题翻译：配电电子卡互连系统的启动机制
公开(公告)号：US07505251B2
公开(公告)日：2009-03-17
申请号：US11262047
申请日：2005-10-28
申请人： Shawn M. Canfield , John J. Loparco , Emanuele F. Lopergolo , Budy D. Notohardjono , Michael T. Peets , John G. Torok
发明人： Shawn M. Canfield , John J. Loparco , Emanuele F. Lopergolo , Budy D. Notohardjono , Michael T. Peets , John G. Torok
IPC分类号： G06F1/16
CPC分类号： H05K5/0217
摘要： An actuation assembly and method is provided for mating electronic unto a computer rack comprising a main housing engageably securable to a slide assembly. The slide assembly is capable of being secured to a side of the computer rack and having sliding features such that the slide assembly and the main housing when engaged can be telescoped out or returned to a closed position. The main housing having a vertical wedge for securing said assembly to said rack more securely and a drive wedge for moving the vertical wedge such that it can telescope into and out of said rack with said slide mechanism via a lead screw.
摘要翻译：提供了一种用于将电子装配到计算机机架的致动组件和方法，所述计算机机架包括可接合地固定到滑动组件的主壳体。滑动组件能够被固定到计算机机架的一侧并且具有滑动特征，使得当接合时滑动组件和主壳体可以伸缩或返回到关闭位置。主壳体具有用于将所述组件更牢固地固定到所述机架上的垂直楔块，以及用于移动垂直楔块的驱动楔块，使得其可以通过导螺杆用所述滑动机构望远镜进入和离开所述齿条。

2. 发明申请

US20110067910A1 COMPONENT SECURING SYSTEM AND ASSOCIATED METHOD 审中-公开
标题翻译：组件安全系统及相关方法
公开(公告)号：US20110067910A1
公开(公告)日：2011-03-24
申请号：US12562499
申请日：2009-09-18
申请人： Michael J. Domitrovits , Emanuele F. Lopergolo , Prabjit Singh
发明人： Michael J. Domitrovits , Emanuele F. Lopergolo , Prabjit Singh
IPC分类号： H05K1/18 , H05K3/30
CPC分类号： H05K3/3421 , H05K3/3452 , H05K2201/10189 , H05K2203/0191 , H05K2203/167 , Y02P70/613 , Y10T29/4913
摘要： A system to secure a component to a circuit board may include a printed circuit board, a surface mounted component, and a lead carried by the surface mounted component. The system may also include a stencil adhered between at least one of the printed circuit board and the surface mounted component, and the lead adjacent the stencil.
摘要翻译：将组件固定到电路板的系统可以包括印刷电路板，表面安装部件和由表面安装部件承载的引线。该系统还可以包括粘附在印刷电路板和表面安装部件中的至少一个之间的模板以及与模板相邻的引线。

3. 发明授权

US6051119A Plating structure for a pin grid array package 失效
标题翻译：针阵列封装的电镀结构
公开(公告)号：US6051119A
公开(公告)日：2000-04-18
申请号：US5873
申请日：1998-01-12
申请人： Paul F. Findeis , Kenneth R. Idler , Minkailu A. Jalloh , Thomas A. Kelly , Emanuele F. Lopergolo
发明人： Paul F. Findeis , Kenneth R. Idler , Minkailu A. Jalloh , Thomas A. Kelly , Emanuele F. Lopergolo
IPC分类号： C25D17/00 , H01L21/48 , C25D17/04
CPC分类号： H01L21/4889 , C25D17/005 , Y10T29/49117
摘要： Disclosed is a plating structure including a substrate having a plurality of pins to be plated and a metallic plating screen having a plurality of apertures, wherein each of the apertures has at least two tabs spaced apart from each other, wherein the metallic plating screen is placed over the pins so that at least two pins penetrate each aperture, each of the pins contacting a tab of the aperture. Also disclosed is a method of electrolytically plating a plurality of pins utilizing the above metallic plating screen.
摘要翻译：公开了一种电镀结构，包括具有多个要被电镀的引脚的基板和具有多个孔的金属电镀屏，其中每个孔具有彼此间隔开的至少两个突片，其中金属电镀屏被放置使得至少两个销穿过每个孔，每个销接触孔的突片。还公开了利用上述金属电镀屏幕对多个销进行电解电镀的方法。

4. 发明授权

US08672688B2 Land grid array interposer with compressible conductors 有权
标题翻译：具有可压缩导体的土地栅格阵列插入器
公开(公告)号：US08672688B2
公开(公告)日：2014-03-18
申请号：US13351731
申请日：2012-01-17
申请人： Robert F. Florence, Jr. , Emanuele F. Lopergolo , Prabjit Singh
发明人： Robert F. Florence, Jr. , Emanuele F. Lopergolo , Prabjit Singh
IPC分类号： H01R12/00
CPC分类号： H01R12/52 , H01R12/714
摘要： An electrical interconnect is provided for use within, for example, a land grid array (LGA) interposer such as a module-to-board connector. The electrical interconnect includes an electrically-conductive, compressible conductor which has a first conductor end portion and a second conductor end portion. The first and second conductor end portions physically contact in slidable relation each other with compression of the compressible conductor to facilitate inhibiting rotation of the compressible conductor. In one embodiment, the first end portion includes at least one first leg and the second end portion includes at least two second legs, and the at least one first leg and at least two second legs are interdigitated. Further, in one embodiment, the first end portion and the second end portion are each in slidable contact with an inner-facing surface of the compressible conductor.
摘要翻译：提供电互连以用于例如诸如模块到板连接器的平面栅格阵列（LGA）插入器。电互连包括导电的可压缩导体，其具有第一导体端部和第二导体端部。第一和第二导体端部通过压缩可压缩导体的压缩而以可滑动的关系彼此物理接触，以便于抑制可压缩导体的旋转。在一个实施例中，第一端部包括至少一个第一腿部，并且第二端部部分包括至少两个第二腿部，并且所述至少一个第一腿部和至少两个第二腿部交叉。此外，在一个实施例中，第一端部和第二端部各自与可压缩导体的内表面滑动接触。

5. 发明申请

US20110070775A1 DELAYED CONTACT ACTION CONNECTOR 失效
标题翻译：延迟接触动作连接器
公开(公告)号：US20110070775A1
公开(公告)日：2011-03-24
申请号：US12563351
申请日：2009-09-21
申请人： H. John Healey , Emanuele F. Lopergolo , Prabjit Singh
发明人： H. John Healey , Emanuele F. Lopergolo , Prabjit Singh
IPC分类号： H01R4/48 , H01R24/00
CPC分类号： H01R12/87 , H01R12/714 , H01R12/721 , H01R12/88 , H01R13/11 , H01R13/7036
摘要： A connector having a plurality of terminals for connecting to a circuit card and a method therefore are disclosed. The connector includes a socket having a casing with an aperture for receiving the circuit card therein and a plurality of terminals made of electrically conductive material. At least one of the plurality of terminals includes an elongated portion and a substantially L-shaped portion joined together by a U-shaped portion. The elongated portion has a proximal end and a distal end, and includes a support section and a bending section between the proximal end and the distal end. The terminal is secured to the casing by the support section at or near the proximal end of the elongated portion. The U-shaped portion is disposed at the distal end of the elongated portion. The terminal continues from the U-shaped portion to a region approximately halfway towards the proximal end of the elongated portion and turns away from the elongated portion thereby forming the substantially L-shaped portion. The L-shaped portion ends in a lip section curving towards the proximal end of the elongated portion.
摘要翻译：公开了一种具有用于连接到电路卡的多个端子的连接器及其方法。连接器包括具有壳体的插座，其具有用于在其中接收电路卡的孔，以及由导电材料制成的多个端子。多个端子中的至少一个端子包括由U形部分连接在一起的细长部分和大致L形部分。细长部分具有近端和远端，并且包括支撑部分和在近端和远端之间的弯曲部分。端子通过支撑部分在细长部分的近端处或附近固定到壳体。 U形部分设置在细长部分的远端处。端子从U形部分延伸到近似于长形部分的近端的一半的区域，并且远离细长部分，从而形成大致L形的部分。 L形部分在朝向细长部分的近端弯曲的唇部中终止。

6. 发明授权

US06197171B1 Pin contact mechanism for plating pin grid arrays 失效
标题翻译：电针针阵列引脚接触机构
公开(公告)号：US06197171B1
公开(公告)日：2001-03-06
申请号：US09282133
申请日：1999-03-31
申请人： Emanuele F. Lopergolo , Mark A. Brandon , Arden S. Lake , Joseph M. Sullivan, Jr.
发明人： Emanuele F. Lopergolo , Mark A. Brandon , Arden S. Lake , Joseph M. Sullivan, Jr.
IPC分类号： C25B900
CPC分类号： C25D17/06 , C25D7/00 , H01L21/4853
摘要： An apparatus and process for electroplating a pin grid array device having a plurality of pins, the pins having a side surface and an extremity. The apparatus comprises a contact plate defining a plane and having a plurality of electrically conductive flexible contact fingers extending from the contact plate away from the plane, the contact fingers adapted to flex when contacted by the pins. The process comprises contacting each of the plurality of pins with a flexible contact finger extending from a single electrically conductive plate, the conductive plate defining a plane, wherein the flexible contact fingers extend away from the plane.
摘要翻译：一种用于电镀具有多个引脚的引脚格栅阵列器件的装置和工艺，所述引脚具有侧表面和末端。该装置包括限定平面的接触板，并且具有从接触板远离平面延伸的多个导电的柔性接触指，该接触指适于当与销接触时弯曲。该过程包括使多个销中的每一个与从单个导电板延伸的柔性接触指状物接触，导电板限定平面，其中柔性接触指远离平面延伸。

7. 发明授权

US07758390B2 Large array surface mount technology connector cradle assembly 失效
标题翻译：大型阵列表面贴装技术连接器支架组件
公开(公告)号：US07758390B2
公开(公告)日：2010-07-20
申请号：US12036933
申请日：2008-02-25
申请人： Michael J. Domitrovits , Emanuele F. Lopergolo , Prabjit Singh , Joseph J. George
发明人： Michael J. Domitrovits , Emanuele F. Lopergolo , Prabjit Singh , Joseph J. George
IPC分类号： H01R9/22
CPC分类号： H01R13/514 , H01R12/712
摘要： A large array connector assembly for containing a plurality of wafers is disclosed. The large array connector assembly includes a plurality of guide blocks that includes first and second guide blocks. The first guide block being located at a first end of the assembly. The second guide block being located at a second end of the assembly. A first plate is mechanically coupled to a first portion of the first guide block and a first portion of the second guide block. The first plate includes a plurality of slots each for receiving a tab extending from a corresponding wafer so as to substantially prevent movement of the corresponding wafer in first and second directions while allowing a given degree of movement in a third direction. A second plate is mechanically coupled to a second portion of the first guide block and a second portion of the second guide block.
摘要翻译：公开了一种用于容纳多个晶片的大阵列连接器组件。大阵列连接器组件包括多个引导块，其包括第一和第二引导块。第一引导块位于组件的第一端。第二引导块位于组件的第二端。第一板被机械联接到第一引导块的第一部分和第二引导块的第一部分。第一板包括多个槽，每个槽用于接收从相应的晶片延伸的突出部，以便基本上防止相应的晶片在第一和第二方向上移动，同时允许沿第三方向的给定程度的运动。第二板机械地联接到第一引导块的第二部分和第二引导块的第二部分。

8. 发明申请

US20090215289A1 LARGE ARRAY SURFACE MOUNT TECHNOLOGY CONNECTOR CRADLE ASSEMBLY 失效
标题翻译：大阵列表面安装技术连接器组件
公开(公告)号：US20090215289A1
公开(公告)日：2009-08-27
申请号：US12036933
申请日：2008-02-25
申请人： MICHAEL J. DOMITROVITS , Emanuele F. Lopergolo , Prabjit Singh , Joseph J. George
发明人： MICHAEL J. DOMITROVITS , Emanuele F. Lopergolo , Prabjit Singh , Joseph J. George
IPC分类号： H01R12/00
CPC分类号： H01R13/514 , H01R12/712
摘要： A large array connector assembly for containing a plurality of wafers is disclosed. The large array connector assembly includes a plurality of guide blocks that includes first and second guide blocks. The first guide block being located at a first end of the assembly. The second guide block being located at a second end of the assembly. A first plate is mechanically coupled to a first portion of the first guide block and a first portion of the second guide block. The first plate includes a plurality of slots each for receiving a tab extending from a corresponding wafer so as to substantially prevent movement of the corresponding wafer in first and second directions while allowing a given degree of movement in a third direction. A second plate is mechanically coupled to a second portion of the first guide block and a second portion of the second guide block.
摘要翻译：公开了一种用于容纳多个晶片的大阵列连接器组件。大阵列连接器组件包括多个引导块，其包括第一和第二引导块。第一引导块位于组件的第一端。第二引导块位于组件的第二端。第一板被机械联接到第一引导块的第一部分和第二引导块的第一部分。第一板包括多个槽，每个槽用于接收从相应的晶片延伸的突出部，以便基本上防止相应的晶片在第一和第二方向上移动，同时允许沿第三方向的给定程度的运动。第二板机械地联接到第一引导块的第二部分和第二引导块的第二部分。

9. 发明授权

US06497805B2 Method for shorting pin grid array pins for plating 失效
标题翻译：短路针格阵列针电镀方法
公开(公告)号：US06497805B2
公开(公告)日：2002-12-24
申请号：US09758324
申请日：2001-01-12
申请人： Arden S. Lake , Emanuele F. Lopergolo , Joseph M. Sullivan
发明人： Arden S. Lake , Emanuele F. Lopergolo , Joseph M. Sullivan
IPC分类号： C25D500
CPC分类号： H01L23/58 , C25D7/00 , G01R3/00 , H01L21/4853 , H01L2924/0002 , H01L2924/00
摘要： A method, system and structure for a pin grid or pad grid array structure includes a plurality of pins connected to an electronic structure, a power plane within the electronic structure electrically connected to power pins, a ground plane within the electronic structure, and fuse portions electrically connecting the ground plane to ground pins and signal pins. The power plane and the ground plane create a charge in the pins during electroplating of the pins. The fuse portions disconnecting the signal pins from the ground plane after the electroplating.
摘要翻译：针栅格或焊盘格栅阵列结构的方法，系统和结构包括连接到电子结构的多个引脚，电连接到电源引脚的电子结构内的电源平面，电子结构内的接地平面和熔丝部分将接地层电连接到接地引脚和信号引脚。电源平面和接地平面在引脚电镀期间在引脚上产生电荷。保险丝部分在电镀之后将信号引脚与地平面断开。

10. 发明授权

US5729148A Probe assembly 失效
标题翻译：探头装配
公开(公告)号：US5729148A
公开(公告)日：1998-03-17
申请号：US672877
申请日：1996-06-28
申请人： Joseph M. Sullivan , Emanuele F. Lopergolo
发明人： Joseph M. Sullivan , Emanuele F. Lopergolo
IPC分类号： G01R1/04 , G01R1/073 , G01R31/02
CPC分类号： G01R1/04 , G01R1/07378
摘要： A probe assembly comprising a frame and at least one contact carrier within the frame wherein the carrier has a plurality of tie strips and a plurality of contacts and each contact is contiguous with a corresponding group of tie strips. Each contact becomes discontiguous from the corresponding group of tie strips when a force is applied to the tie strips. The probe assembly further comprising at least two rails attached to the frame. Each rail has a top portion for receiving the contacts and tie strips and a bottom portion having a plurality of regions for contacting the tie strips. The carrier is positioned between the top portion of one of the rails and the bottom portion of the other rail. When a compressive force is applied to the rails and carrier, the regions forcibly contact the tie strips such that all the contacts simultaneously become discontiguous from the tie strips.
摘要翻译：一种探针组件，包括框架和框架内的至少一个接触载体，其中所述载体具有多个连接条和多个触点，并且每个触点与相应的一组连接条相邻。当将力施加到连接条上时，每个接触件从相应的连接带组中变得不连续。所述探针组件还包括连接到所述框架的至少两个导轨。每个轨道具有用于接收触头和连接条的顶部部分和具有用于接合连接条带的多个区域的底部部分。载体位于轨道之一的顶部和另一个轨道的底部之间。当对轨道和载体施加压缩力时，区域强制地接触连接条，使得所有触点同时从连接带变得不连续。

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