会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 5. 发明授权
    • Cathode sputtering device
    • 阴极溅射装置
    • US5071535A
    • 1991-12-10
    • US567946
    • 1990-08-15
    • Klaus HartigJoachim Szczyrbowski
    • Klaus HartigJoachim Szczyrbowski
    • C23C14/34
    • C23C14/3407
    • Cathode sputtering apparatus with a high sputtering rate, including a cathode having a cathode base 1 and a target 6 disposed parallel thereto and being provided with a channel 5 in the cathode base which is passed through by a cooling agent 12. With respect to the target 6, 10 to be cooled, this channel 5 is bounded by a thin wall 2 configured as a membrane. The wall 2 has large contact surfaces exhibiting a good heat transfer to the target surface. The contact surface between the target 6 and the wall 2 is coated with a material, e.g. a graphite layer, which has a low sputtering rate in order to delay a sputtering through as long as possible.
    • 具有高溅射速率的阴极溅射装置,包括具有阴极基体1和平行设置的靶6的阴极,并且在阴极基体中设置有通过冷却剂12通过的通道5.相对于靶 6,10被冷却,该通道5被配置为膜的薄壁2界定。 壁2具有表现出对目标表面的良好热传递的大的接触表面。 目标6和壁2之间的接触表面涂覆有材料,例如, 石墨层,其溅射速率低,以便尽可能地延长溅射。
    • 7. 发明授权
    • Apparatus for coating a substrate with thin layers
    • 用于涂覆薄层的基材的设备
    • US6096174A
    • 2000-08-01
    • US990953
    • 1997-12-15
    • Gotz TeschnerJoachim Szczyrbowski
    • Gotz TeschnerJoachim Szczyrbowski
    • C23C14/34C23C14/35H01J37/34H01L21/316H01L21/318C23C14/32C23C14/54
    • H01J37/3444C23C14/3464C23C14/352H01J37/3408H01L21/31604H01L21/318
    • An apparatus is provided for coating a substrate (24) with thin layers from targets (12, 13) between which a gas discharge plasma is sustained in order to produce the ions necessary for the bombardment of the targets (12, 13) connected to alternating current. The process chamber (6) contains a gas under a specific partial pressure. The targets (12, 13) are connected to a power source in such a circuit so that they alternately form the cathode and anode of the gas discharge. The reversal of the current direction is performed through an H bridge (4) formed of four switches (16 to 19), the conductor (14) connecting the H bridge (4) to a first power source (3) being connected through a branch line (21) to a second power source which can be connected by a switch (20) to ground. All switches (19 to 20) are operated by a control circuit in a regular and variable mode, the ion energy being controlled by the level of the potential difference between the cathode and the coating and the number of ions through the duration of this potential
    • 提供了一种用于从其上维持气体放电等离子体的目标(12,13)的薄层涂覆基底(24)的装置,以产生用于轰击连接到交替的靶(12,13)所必需的离子 当前。 处理室(6)含有特定分压下的气体。 目标(12,13)在这种电路中连接到电源,使得它们交替地形成气体放电的阴极和阳极。 通过由四个开关(16至19)形成的H桥(4)进行电流方向的反转,将H桥(4)连接到第一电源(3)的导体(14)通过分支 线路(21)连接到能够通过开关(20)连接到地的第二电源。 所有的开关(19到20)由一个常规和可变模式的控制电路操作,离子能量由阴极和涂层之间的电位差水平控制,并且在该电位的持续时间内离子的数量
    • 9. 发明授权
    • Process and apparatus for reactive coating of a substrate
    • 用于基材的反应性涂布的方法和装置
    • US5427665A
    • 1995-06-27
    • US728562
    • 1991-07-11
    • Klaus HartigJoachim Szczyrbowski
    • Klaus HartigJoachim Szczyrbowski
    • C23C14/00C23C14/34H01J37/34
    • C23C14/0089C23C14/0068C23C14/3407C23C14/3414H01J37/3405H01J37/3408H01J37/3429H01J37/3438H01J37/3452
    • An apparatus for the reactive coating of a substrate 1, with silicon dioxide (SiO.sub.2) for example, comprises a power source 10, 37 connected to an electrode 5 which is disposed in an evacuable coating chamber 15, 15a and interacts with a target 3 which is sputtered and the sputtered particles of which are deposited on the substrate 1, wherein argon and oxygen, for example, are supplied to the coating chamber 15, 15a. The target to be sputtered is composed of several parts, for example. A center part 3a of the target 3 opposite the substrate 1 is made of silicon (Si) and the part 3b surrounding this center portion is made of zinc (Sn), for example. Provision is made for a diaphragm 24 between the substrate 1 on the one hand, and the target 3, on the other hand. The shape of the magnetic field of the electrode 5 during the sputtering generates a sputtering of the more reactive target material 3a in the oxidic mode and of the less reactive target material 3b in the metallic mode.
    • 用于二氧化硅(SiO 2)的基体1的反应性涂覆的装置包括连接到电极5的电源10,37,电极5设置在可抽出的涂覆室15,15a中并与靶3相互作用 被溅射并且其溅射的颗粒沉积在基底1上,其中例如氩和氧被提供给涂覆室15,15a。 例如,溅射的目标由几个部分组成。 靶3的与基板1相对的中心部3a由硅(Si)构成,围绕该中心部的部分3b例如由锌(Sn)构成。 另一方面,为了在一方面在基板1和目标3之间设置隔膜24。 在溅射期间电极5的磁场的形状在金属模式中产生更具反应性的目标材料3a在氧化模式中的溅射和较少反应性的目标材料3b的溅射。
    • 10. 发明授权
    • Coating, composed of an optically effective layer system, for
substrates, whereby the layer system has a high anti-reflective effect,
and method for the manufacturing of the coating
    • 涂层,组合有光学有效层系统,用于基板,由于层系具有高抗反射效应,以及制造涂层的方法
    • US5216542A
    • 1993-06-01
    • US599988
    • 1990-10-19
    • Joachim SzczyrbowskiKlaus HartigStephan RoegelsAnton Zmelty
    • Joachim SzczyrbowskiKlaus HartigStephan RoegelsAnton Zmelty
    • C03C17/34G02B1/10
    • G02B1/10C03C17/3423C03C17/3435C03C17/3452
    • A coating, composed of an optically effective layer system for substrates, whereby the layer system has a high antireflective effect. On a front side of the substrate, facing the observer, in sequence from the front side to the observer, a first layer is arranged on the substrate, functioning as dielectric and comprising metal oxide. Thereupon follows a second layer comprising nitride, preferably TiN.sub.x (x is equal to or greater than 1, preferably x=1.05). A third layer follows functioning as dielectric and comprising metal oxide. Thereupon a fourth layer follows comprising nitride, preferably TiN.sub.x (x is equal to or greater than 1, preferably x=1.05). A fifth layer follows functioning as dielectric comprising metal oxide. On a backside of the substrate a TiN.sub.x -layer (x.gtoreq.1, preferably x=1.05) is arranged. The adequate selection of certain materials for the individual layers, of certain layer thicknesses and of a certain sequence of the individual layers results in a surprisingly good antireflective coating, contrast increase and antistatic effect. These good optical features of the layer system are reached with a small number of layers and with thin layer thicknesses. This, in turn, leads to an extremely cost saving manufacturing of the coating.
    • 一种由用于基底的光学有效层系统组成的涂层,由此该层系统具有高的抗反射效果。 在基板的正面上,从观察者的正面向观察者方向依次排列有第一层,作为电介质并且包含金属氧化物而被布置在基板上。 因此,随后是包含氮化物的第二层,优选TiN x(x等于或大于1,优选x = 1.05)。 第三层的功能是电介质并包含金属氧化物。 因此,第四层包括氮化物,优选TiN x(x等于或大于1,优选x = 1.05)。 第五层的功能是包含金属氧化物的电介质。 在衬底的背面,布置TiNx层(x> / = 1,优选x = 1.05)。 对于各层,某些层厚度和各层的某个顺序的某些材料的适当选择导致出人意料的良好的抗反射涂层,对比度增加和抗静电效果。 层系统的这些良好的光学特征达到少量层和薄层厚度。 这又导致了涂层极其节省成本的制造。