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1. 发明授权

US08549816B2 Panel installation support apparatus 有权
标题翻译：面板安装支持设备
公开(公告)号：US08549816B2
公开(公告)日：2013-10-08
申请号：US13364402
申请日：2012-02-02
申请人： James F. Roberts
发明人： James F. Roberts
IPC分类号： E04D15/00 , E04F21/00 , E04G21/14
CPC分类号： E04F21/185
摘要： A panel installation support apparatus versatile and convenient for temporary attachment of the panel to a frame member includes an adjustable support surface for accommodating various panel thicknesses, a sloped surface to support the leading edge of the panel when positioning in place, and an alignment support shelf to properly align an edge of the panel with the joist or stud while supporting the edge of the panel. An accessory block may be used when standing a panel against a wall or when hanging drywall on sloped ceilings.
摘要翻译：一种面板安装支撑装置，其通用且方便地将面板临时附接到框架构件，包括用于容纳各种面板厚度的可调节支撑表面，当定位就位时支撑面板的前缘的倾斜表面和对准支撑架以在支撑面板的边缘的同时将面板的边缘与托梁或螺柱对准。当将面板靠在墙壁上或当将斜墙悬挂在倾斜的天花板上时，可以使用附件块。

2. 发明授权

US5421401A Compound clamp ring for semiconductor wafers 失效
标题翻译：用于半导体晶片的复合夹环
公开(公告)号：US5421401A
公开(公告)日：1995-06-06
申请号：US187231
申请日：1994-01-25
申请人： Semyon Sherstinsky , Mei Chang , Charles C. Harris , Alan F. Morrison , Virendra V. S. Rana , James F. Roberts , Ashok K. Sinha , Simon Tam
发明人： Semyon Sherstinsky , Mei Chang , Charles C. Harris , Alan F. Morrison , Virendra V. S. Rana , James F. Roberts , Ashok K. Sinha , Simon Tam
IPC分类号： C23C14/50 , C23C16/458 , H01L21/687 , F28F7/00 , C23C16/00
CPC分类号： H01L21/68721 , C23C14/50 , C23C16/4585 , Y10S269/903
摘要： A compound clamp ring secures a semiconductor wafer having a wafer flat portion to a wafer pedestal during wafer processing while maintaining a continuous seal between the wafer edges and the wafer pedestal to prevent leakage of coolant gases circulated at the backside of the wafer into the process environment. The clamp ring has an annular wafer clamp surface adapted to press a round portion of the wafer into sealing abutment with the wafer pedestal. A cavity formed in the clamp ring securely receives a comb-like array of resilient flexures that are adapted to apply a yieldable bias to the flat portion of the wafer to complete the seal between the wafer and the pedestal at the flat portion of the wafer; and encloses the flexures to shield the flexures from process gases.
摘要翻译：复合夹环在晶片处理期间将具有晶片平坦部分的半导体晶片固定到晶片基座，同时保持晶片边缘和晶片基座之间的连续密封，以防止在晶片背面循环的冷却剂气体泄漏到工艺环境中。夹紧环具有适于将晶圆的圆形部分压紧到与晶片基座密封抵接的环形晶片夹紧表面。形成在夹紧环中的空腔牢固地容纳弹性挠曲的梳状阵列，其适于对晶片的平坦部分施加可屈服的偏压，以在晶片的平坦部分处完成晶片和基座之间的密封; 并包围挠曲件以将工件气体的挠曲屏蔽。

3. 发明授权

US5326725A Clamping ring and susceptor therefor 失效
标题翻译：夹环和感受器
公开(公告)号：US5326725A
公开(公告)日：1994-07-05
申请号：US31259
申请日：1993-03-11
申请人： Semyon Sherstinsky , Charles C. Harris , Mei Chang , Dale R. Du Bois , James F. Roberts , Susan Telford , Ronald L. Rose , Meng C. Tseng , Karl A. Littau
发明人： Semyon Sherstinsky , Charles C. Harris , Mei Chang , Dale R. Du Bois , James F. Roberts , Susan Telford , Ronald L. Rose , Meng C. Tseng , Karl A. Littau
IPC分类号： C23C16/04 , C23C16/44 , C23C16/455 , C23C16/458 , H01L21/687 , C23C16/00
CPC分类号： C23C16/45521 , C23C16/042 , C23C16/4585 , H01L21/68721 , H01L21/68735
摘要： A clamping ring having a downwardly extending finger that mates with a pocket in the periphery of a susceptor for supporting a wafer in a chemical vapor deposition chamber, provides alignment of the clamping ring, the wafer and the susceptor. A source of inert gas connected to the pocket provides a positive pressure in the pocket that prevents reactive gas in the chamber from reaching the edge and backside of the wafer. A source of vacuum connected to the susceptor support surface ensures good contact between the wafer and the susceptor.The clamping ring also has a lip extending over the top surface of the wafer having a rear surface that has a negative angle with respect to the upper surface of the clamping ring, providing a knife edge seal to the wafer, reducing the area of contact between the clamping ring and the wafer and providing a reduced area of thermal contact between the clamping ring and the wafer.
摘要翻译：具有向下延伸的指状物的夹紧环，其与基座的周边中的口相配合，用于在化学气相沉积室中支撑晶片，提供夹紧环，晶片和基座的对准。连接到口袋的惰性气体源在口袋中提供正压力，防止腔室中的反应性气体到达晶片的边缘和背面。连接到基座支撑表面的真空源确保了晶片和基座之间良好的接触。夹紧环还具有在晶片的顶表面上延伸的唇缘，其具有相对于夹紧环的上表面具有负角度的后表面，为晶片提供刀刃密封，从而减小了夹紧环和晶片，并且在夹紧环和晶片之间提供减小的热接触面积。

4. 发明申请

US20130199124A1 PANEL INSTALLATION SUPPORT APPARATUS 有权
标题翻译：面板安装支持设备
公开(公告)号：US20130199124A1
公开(公告)日：2013-08-08
申请号：US13364402
申请日：2012-02-02
申请人： James F. Roberts
发明人： James F. Roberts
IPC分类号： E04F21/18
CPC分类号： E04F21/185
摘要： A panel installation support apparatus versatile and convenient for temporary attachment of the panel to a frame member includes an adjustable support surface for accommodating various panel thicknesses, a sloped surface to support the leading edge of the panel when positioning in place, and an alignment support shelf to properly align an edge of the panel with the joist or stud while supporting the edge of the panel. An accessory block may be used when standing a panel against a wall or when hanging drywall on sloped ceilings.
摘要翻译：一种面板安装支撑装置，其通用且方便地将面板临时附接到框架构件，包括用于容纳各种面板厚度的可调节支撑表面，当定位就位时支撑面板的前缘的倾斜表面和对准支撑架以在支撑面板的边缘的同时将面板的边缘与托梁或螺柱对准。当将面板靠在墙壁上或当将斜墙悬挂在倾斜的天花板上时，可以使用附件块。

5. 发明授权

US5328872A Method of integrated circuit manufacturing using deposited oxide 失效
标题翻译：使用沉积氧化物的集成电路制造方法
公开(公告)号：US5328872A
公开(公告)日：1994-07-12
申请号：US459167
申请日：1989-12-29
申请人： Ajit S. Manocha , Virendra V. S. Rana , James F. Roberts , Ankineedu Velaga
发明人： Ajit S. Manocha , Virendra V. S. Rana , James F. Roberts , Ankineedu Velaga
IPC分类号： H01L21/316 , C23C16/40 , C23C16/44 , C23C16/54 , H01L21/31 , H01L21/02
CPC分类号： C23C16/54 , C23C16/401 , C23C16/4412
摘要： Contamination of LPCVDBP TEOS films is reduced by preventing volatile compounds, resulting from reactions of the residue in the outlet of the furnace from reaching the deposition portion of the furnace where they would otherwise react with the deposition gases to produce chemically generated particles which contaminate the dielectric film.
摘要翻译： LPCVDBP TEOS膜的污染通过防止挥发性化合物的降低，这是由于炉子出口处的残余物的反应到达炉的沉积部分，否则它们将与沉积气体反应以产生污染电介质的化学产生的颗粒电影。

6. 发明授权

US5316278A Clamping ring apparatus for processing semiconductor wafers 失效
标题翻译：用于处理半导体晶圆的夹紧环装置
公开(公告)号：US5316278A
公开(公告)日：1994-05-31
申请号：US947212
申请日：1992-09-18
申请人： Semyon Sherstinsky , Mei Chang , Charles C. Harris , Alfred Mak , James F. Roberts , Simon W. Tam , Wen T. Chang
发明人： Semyon Sherstinsky , Mei Chang , Charles C. Harris , Alfred Mak , James F. Roberts , Simon W. Tam , Wen T. Chang
IPC分类号： H01L21/687 , B25B1/00
CPC分类号： H01L21/68721 , Y10S269/903
摘要： An improved clamping ring apparatus is disclosed comprising a clamping ring means for yieldably engaging a generally circular semiconductor wafer to peripherally clamp the wafer to a support pedestal to provide a peripheral seal between the wafer and the surface of the pedestal facing the wafer, adjacent the generally circular end edge of the wafer by providing a central generally circular opening in the clamping ring and a series of slots which radially extend outwardly from the central opening in the clamping ring means to thereby divide the inner portion of the clamping ring means into a series of yieldable fingers inwardly extending toward the central opening in the clamping ring means.In one embodiment, the sidewalls of the slots are slanted with respect to the planar surface of the clamping ring means at an angle sufficient, with respect to the thickness of the clamping ring means and the width of the slot,, to prevent a ray or a particle from a plasma, traveling in a direction perpendicular to the plane of the surface of the clamping ring means from striking surfaces underlying the clamping ring means, through the slot.
摘要翻译：公开了一种改进的夹紧环装置，其包括夹紧环装置，用于可屈服地接合大致圆形的半导体晶片以将晶片周边夹持到支撑基座，以在晶片与面对晶片的基座的表面之间提供周边密封，通过在夹紧环中提供中心大致圆形的开口，以及从夹紧环装置中的中心开口径向向外延伸的一系列槽，从而将夹紧环装置的内部分成一系列可伸缩的手指向内延伸朝向夹紧环装置中的中心开口。在一个实施例中，槽的侧壁相对于夹紧环装置的平坦表面以相对于夹紧环装置的厚度和槽的宽度足够的角度倾斜以防止光线或来自等离子体的颗粒通过狭槽从垂直于夹紧环装置的表面的平面的方向通过夹紧环装置下方的冲击表面行进。

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