专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US09232817B2 Method for the surface-pasteurization and-sterilization of pieces of food 有权
标题翻译：食品表面巴氏消毒灭菌方法
公开(公告)号：US09232817B2
公开(公告)日：2016-01-12
申请号：US12648067
申请日：2009-12-28
申请人： Rainer Perren , Jürgen Fischer
发明人： Rainer Perren , Jürgen Fischer
IPC分类号： A23L1/00 , A23L3/16 , A23B9/02 , A23L3/015
CPC分类号： A23L3/165 , A23B9/025 , A23L3/0155
摘要： A process for surface pasteurization/sterilization of particulate food products. Water uptake and qualitative changes of food products are minimized and pasteurization or sterilization conditions are optimized when food products are used preheated, wherein product temperature is selected a few degrees below the evaporation temperature of the pasteurization/sterilization system, in that the preheating temperature of food products is selected lower than the saturated steam temperature, preferably a few degrees below the saturated steam temperature at a predetermined pressure, in that treatment is performed in a moist, air-free atmosphere, wherein pasteurization occurs at temperatures between 55 and 99° C. at a low pasteurization pressure, or sterilization occurs at temperatures between 100° C. and 140° C. at a higher sterilization pressure, in that heat treatment occurs for 1 to 30 mins, and in that the water of condensation is removed from the surface of food products by a subsequent vacuum drying at a further reduced pressure.
摘要翻译：颗粒状食品的表面巴氏消毒/灭菌方法。食品的吸收和质量变化最小化，当食品被预热使用时，巴氏消毒或灭菌条件得到最佳化，其中产品温度选择在巴氏消毒/灭菌系统的蒸发温度以下几度，食品预热温度选择低于饱和蒸汽温度的产物，优选在预定压力下比饱和蒸汽温度低几度，因为处理在潮湿的无空气气氛中进行，其中巴氏杀菌在55至99℃的温度下进行。在低巴氏杀菌压力下，或者在更高的灭菌压力下在100℃至140℃的温度下进行灭菌，因为热处理发生1至30分钟，并且冷凝水从表面除去的食品通过随后的真空干燥进一步减压。

2. 发明申请

US20090223875A1 Extraction device having a centrifugal separator 有权
标题翻译：具有离心分离器的抽出装置
公开(公告)号：US20090223875A1
公开(公告)日：2009-09-10
申请号：US11916802
申请日：2006-06-27
申请人： Wolfgang Asal , Jürgen Fischer
发明人： Wolfgang Asal , Jürgen Fischer
IPC分类号： B04C5/13 , B04C9/00
CPC分类号： B04C5/13 , B04C9/00
摘要： In an extraction device comprising a suction apparatus (16) with an electric motor (32) and an centrifugal separator (14) exhibiting an inlet cylinder (22), a vertically arranged dip pipe (30) and a lateral suction nozzle (24) through which a laden gas stream enters the inlet cylinder (22), it is provided with a view to creating a low-cost and easy-to-handle extraction device of a compact design, having a centrifugal separator, that the electric motor (32) is arranged inside the dip pipe (30).
摘要翻译：在包括具有电动机（32）的抽吸装置（16）和呈现进气筒（22）的离心分离器（14）的抽取装置中，垂直设置的浸入管（30）和横向吸入喷嘴（24）通过其中负载气流进入进气筒（22），其设置有产生具有离心分离器的紧凑型设计的低成本且易于处理的提取装置，电动机（32）布置在浸入管（30）的内部。

3. 发明授权

US06557769B2 Smart card module, smart card with the smart card module, and method for producing the smart card module 有权
公开(公告)号：US06557769B2
公开(公告)日：2003-05-06
申请号：US10083039
申请日：2002-02-26
申请人： Frank Püschner , Erik Heinemann , Jürgen Fischer
发明人： Frank Püschner , Erik Heinemann , Jürgen Fischer
IPC分类号： G06K1906
CPC分类号： G06K19/07747 , G06K19/07743 , G06K19/07745 , H01L2224/05571 , H01L2224/05573 , H01L2224/16 , H01L2224/45144 , H01L2924/00014 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/00 , H01L2224/05599
摘要： Flip-chip bumps (solder bumps) are applied on the contact-connection points of a semiconductor chip. These bumps extend from there through a covering compound (mold) that is applied as a protective layer. The end of each one of the bumps that is remote from the semiconductor chip forms a pad. This pad lies approximately plane-parallel in the surface of the covering compound that is remote from the semiconductor chip. At least during the encapsulation process, the chips are preferably arranged on a carrier element, in particular a carrier strip.

4. 发明授权

US09179704B2 Method for roasting and surface-pasteurization of foods products 有权
标题翻译：食品的焙烧和表面巴氏杀菌方法
公开(公告)号：US09179704B2
公开(公告)日：2015-11-10
申请号：US12648023
申请日：2009-12-28
申请人： Rainer Perren , Jürgen Fischer
发明人： Rainer Perren , Jürgen Fischer
IPC分类号： A23L3/16 , A23N12/08 , A23B9/02 , A23L1/01 , A23L1/36
CPC分类号： A23N12/08 , A23B9/02 , A23L3/16 , A23L5/13 , A23L5/15 , A23L25/25
摘要： The disclosure relates to a process for roasting and surface pasteurization of particulate food products. The roasting and surface pasteurization can be combined and united to form one process wherein a treatment is carried out in a moist atmosphere at temperatures
摘要翻译：本公开内容涉及颗粒状食品的焙烧和表面巴氏灭菌的方法。焙烧和表面巴氏灭菌可以组合并结合在一起，其中在温度<100℃的潮湿环境中进行处理，在焙烧操作期间在焙烧系统中进行巴氏杀菌处理，巴氏灭菌阶段将产品表面的温度保持在建立的大气的露点温度以下几度，巴氏消毒进行1-30分钟，并且通过进行或继续焙烧冷凝水食品的表面被去除并且其吸收水被最小化。

5. 发明授权

US07710542B2 Imaging device in a projection exposure machine 失效
标题翻译：投影曝光设备中的成像装置
公开(公告)号：US07710542B2
公开(公告)日：2010-05-04
申请号：US11936768
申请日：2007-11-07
申请人： Wolfgang Hummel , Jürgen Fischer , Karl-Eugen Aubele , Erich Merz , Raoul Reiner , Klaus Rief , Stefan Schöngart , Markus Neumaier , Bärbel Trossbach , Ulrich Weber , Michael Mühlbeyer , Hubert Holderer , Alexander Kohl , Jochen Weber , Johannes Lippert , Thorsten Rassel
发明人： Wolfgang Hummel , Jürgen Fischer , Karl-Eugen Aubele , Erich Merz , Raoul Reiner , Klaus Rief , Stefan Schöngart , Markus Neumaier , Bärbel Trossbach , Ulrich Weber , Michael Mühlbeyer , Hubert Holderer , Alexander Kohl , Jochen Weber , Johannes Lippert , Thorsten Rassel
IPC分类号： G03B27/42 , G03B27/52
CPC分类号： G03F7/70258 , G03F7/70825
摘要： An imaging device in a projection exposure machine for microlithography has at least one optical element and at least one manipulator, having a linear drive, for manipulating the position of the optical element. The linear drive has a driven subregion and a nondriven subregion, which are movable relative to one another in the direction of a movement axis. The subregions are interconnected at least temporarily via functional elements with an active axis and via functional elements with an active direction at least approximately parallel to the movement axis.
摘要翻译：用于微光刻的投影曝光机中的成像装置具有至少一个光学元件和至少一个具有线性驱动的操纵器，用于操纵光学元件的位置。线性驱动器具有驱动区域和非驱动子区域，它们可以在运动轴线的方向上相对于彼此移动。至少临时地通过具有主动轴的功能元件和通过至少大致平行于运动轴的有源方向的功能元件临时地互相连接。

6. 发明申请

US20100047622A1 METAL POWDER 有权
标题翻译：金属粉
公开(公告)号：US20100047622A1
公开(公告)日：2010-02-25
申请号：US12441938
申请日：2007-09-21
申请人： Jürgen Fischer , Aloys Eiling , Frank Schrumpf , Stefan Zimmermann , Peter Thienel , Roland Scholl
发明人： Jürgen Fischer , Aloys Eiling , Frank Schrumpf , Stefan Zimmermann , Peter Thienel , Roland Scholl
IPC分类号： B32B9/00 , B22F1/00 , C23C4/06 , B22F3/12 , B22F7/02
CPC分类号： C22C29/02 , B22F2998/00 , C22C2204/00 , C23C4/06 , C22C1/1084
摘要： The invention provides for a cermet powder containing 75-90% by weight of at least one hard material powder, from 10 to 25% by weight of one or more matrix metal powders and up to 3% by weight of at least one modifier, wherein the matrix metal powder or powders contain from 0 to 38% by weight of cobalt, from 0 to 38% by weight of nickel, from 0 to 20% by weight of aluminum, from 0 to 90% by weight of iron and from 10 to 35% by weight of chromium and the sum of the contents of iron and chromium is in the range from 10 to 95% by weight and the sum of the contents of cobalt, nickel and iron is in the range from 65 to 95% by weight. The invention also relates to a cermet and a process to make the cermet containing the cermet powder and shaped article coated with the cermet powder and a process to make the shaped article.
摘要翻译：本发明提供一种金属陶瓷粉末，其包含75-90重量％的至少一种硬质材料粉末，10至25重量％的一种或多种基质金属粉末和至多3重量％的至少一种改性剂，其中基质金属粉末或粉末含有0至38重量％的钴，0至38重量％的镍，0至20重量％的铝，0至90重量％的铁和10至 35重量％的铬，铁和铬的含量之和为10〜95重量％，钴，镍和铁的含量之和为65〜95重量％。本发明还涉及一种金属陶瓷和使含有金属陶瓷粉末和金属陶瓷粉末的成形制品的金属陶瓷的制造方法以及制造成型制品的方法。

7. 外观设计

USD515759S1 Wet wiper 失效
标题翻译：湿雨刮器
公开(公告)号：USD515759S1
公开(公告)日：2006-02-21
申请号：US29192960
申请日：2003-10-29
申请人： Klaus Jürgen Fischer
设计人： Klaus Jürgen Fischer

8. 外观设计

USD474473S1 Multimedia chip card 失效
标题翻译：多媒体芯片卡
公开(公告)号：USD474473S1
公开(公告)日：2003-05-13
申请号：US29155827
申请日：2002-02-19
申请人： Jürgen Fischer , Harald Gundlach , Thomas Muench
设计人： Jürgen Fischer , Harald Gundlach , Thomas Muench

9. 发明授权

US06328349B2 Separable pipe joint, in particular for air-conducting pipes 失效
标题翻译：可分开的管接头，特别适用于导气管
公开(公告)号：US06328349B2
公开(公告)日：2001-12-11
申请号：US09216458
申请日：1998-12-18
申请人： Reiner Bandlow , Mehmet Haseki , Friedrich Schulz , Gerhard Blume , Georg Coermann , Jürgen Fischer , Jörg Rohde
发明人： Reiner Bandlow , Mehmet Haseki , Friedrich Schulz , Gerhard Blume , Georg Coermann , Jürgen Fischer , Jörg Rohde
IPC分类号： F16L3900
CPC分类号： F16L37/0985 , F02B29/045 , F02M35/10144 , Y10S285/921
摘要： A separable pipe joint has two pipe segments that can be inserted one into the another, a gasket-seal arranged between the pipe segments, and a collet which is arranged so as to be adjustable between a separated position and a clamped position, and which is provided with latching means for axially fixing the pipe segments. To indicate a wear-resistant separable pipe joint, which permits a variable assembly of pipe segments adjoining each other, provision is made that as latching means for fixing at least two axially spaced latching members, radially extending to the inside, are arranged on the collet, the latching members in the clamped position of the collet gripping from behind, in each case, a radially elevated clamping step on the external surface of each pipe segment.
摘要翻译：可分离的管接头具有两个可以一个插入到另一个中的管段，一个布置在管段之间的垫圈密封件和一个夹套，该夹头被布置成在分离位置和夹紧位置之间是可调节的，设置有用于轴向固定管段的闭锁装置。为了表示允许彼此相邻的管段可变组装的耐磨可分离管接头，提供作为用于固定至少两个轴向间隔开的闩锁构件的锁定装置，径向延伸到内侧布置在夹头上夹紧在夹紧位置的闩锁构件从后面夹紧，在每种情况下，在每个管段的外表面上具有径向提升的夹紧台阶。

10. 发明授权

US06313524B1 Chip module with a plurality of flat contact elements mountable on either an external printed circuit board or an external circuit board substrate 失效
标题翻译：芯片模块具有可安装在外部印刷电路板或外部电路板基板上的多个平面接触元件
公开(公告)号：US06313524B1
公开(公告)日：2001-11-06
申请号：US09274506
申请日：1999-03-23
申请人： Frank Pueschner , Michael Huber , Peter Stampka , Jürgen Fischer , Josef Heitzer
发明人： Frank Pueschner , Michael Huber , Peter Stampka , Jürgen Fischer , Josef Heitzer
IPC分类号： H01L2328
CPC分类号： G06K19/07747 , G06K19/07743 , H01L23/49855 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/10161 , H01L2924/14 , H01L2924/1532 , H01L2924/181 , H05K1/181 , H05K3/284 , H05K3/3426 , H05K2201/10977 , H05K2203/1316 , Y02P70/611 , Y02P70/613 , Y10T29/49146 , Y10T29/49172 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399
摘要： A chip module has a contact area disposed on its outer side formed of a plurality of essentially flat contact elements of electrically conductive material insulated from one another. At least one semiconductor chip having one or more integrated semiconductor circuits that are electrically connected to the contact elements of the contact area via bonding wires. The contact elements of the chip module are formed by a prefabricated lead frame for supporting the at least one semiconductor chip and have on two opposing sides of the chip module outwardly offset terminals arranged in rows next to one another. The outwardly offset terminals are provided for surface mounting the chip module on the mounting surface of an external printed circuit board or an external circuit board substrate.
摘要翻译：芯片模块具有设置在其外侧上的接触区域，该接触区域由彼此绝缘的导电材料的多个基本平坦的接触元件形成。至少一个具有一个或多个集成半导体电路的半导体芯片，其通过接合线与接触区域的接触元件电连接。芯片模块的接触元件由用于支撑至少一个半导体芯片的预制引线框架形成，并且在芯片模块的两个相对侧上向外偏移端子排列成彼此相邻的行。外部偏移端子用于将芯片模块表面安装在外部印刷电路板或外部电路板基板的安装表面上。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式