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    • 2. 发明申请
    • Negative photoresist composition
    • 负光致抗蚀剂组合物
    • US20060281023A1
    • 2006-12-14
    • US10556297
    • 2004-05-13
    • Takako HirosakiHiroshi Shimbori
    • Takako HirosakiHiroshi Shimbori
    • G03C1/00
    • G03F7/0045G03F7/0382G03F7/11
    • There is provided a negative photoresist composition, which is used in a method of forming a pattern in which an underlayer film is provided on a substrate, a photoresist film formed from the negative photoresist composition is provided on top of the underlayer film, the photoresist film is selectively exposed, and the underlayer film and the photoresist film are then simultaneously subjected to a developing treatment, and which enables favorable resolution to be achieved. This composition includes (A) an alkali-soluble resin, (B) an acid generator that generates acid on irradiation, and (C) a cross-linking agent, and the acid generator (B) includes an onium salt containing a cation with no hydrophilic groups.
    • 提供了一种负型光致抗蚀剂组合物,其用于形成其中在基板上设置下层膜的图案的方法,由底层光致抗蚀剂组合物形成的光致抗蚀剂膜设置在下层膜的顶部上,光致抗蚀剂膜 选择性地曝光,然后同时对下层膜和光致抗蚀剂膜进行显影处理,并且能够实现良好的分辨率。 该组合物包含(A)碱溶性树脂,(B)照射时产生酸的酸发生剂,(C)交联剂,酸产生剂(B)包含含有阳离子的鎓盐 亲水基团。
    • 3. 发明申请
    • NEGATIVE RESIST COMPOSITION AND PROCESS FOR FORMING RESIST PATTERNS
    • 负面影响组成和形成耐力模式的过程
    • US20090081590A1
    • 2009-03-26
    • US11914123
    • 2006-04-18
    • Hiroshi Shimbori
    • Hiroshi Shimbori
    • G03F7/004G03F7/20
    • G03F7/0382B82Y10/00G11B5/3163G11B5/3903
    • A negative resist composition is provided wherein the composition has the sensitivity to g-rays, i-rays, KrF excimer lasers and electron rays, and can be used for mix and match wherein exposure is conducted using at least two exposure light sources selected form g-rays, i-rays, KrF excimer lasers and electron rays. Furthermore, a negative resist composition and a resist pattern forming method are also proposed wherein a resist pattern having excellent high resolution and excellent plating resistance can be formed, and they can be used for manufacturing MEMS. That is, the present invention proposes: a negative resist composition which is used for a process in which at least two exposure light sources selected from g-rays, i-rays, KrF excimer lasers and electron rays are used and comprises an alkali-soluble resin component (A), acid generator component (B), which generates acid due to exposure to g-rays, i-rays, KrF excimer lasers and electron rays, and a crosslinking agent (C); and a negative resist composition which is used for manufacturing MEMS and comprises an alkali-soluble novolak resin (A), an acid generator component (B) which generates an acid due to the exposure of radiation and a crosslinking agent component (C).
    • 提供了一种负型抗蚀剂组合物,其中组合物具有对g射线,i射线,KrF准分子激光器和电子射线的敏感性,并且可以用于混合和匹配,其中使用至少两种选自形式的曝光光源进行曝光 射线,i射线,KrF准分子激光器和电子射线。 此外,还提出了负光刻胶组合物和抗蚀剂图案形成方法,其中可以形成具有优异的高分辨率和优异的电镀电阻的抗蚀剂图案,并且它们可以用于制造MEMS。 也就是说,本发明提出:使用负光刻胶组合物,其用于使用从g射线,i射线,KrF准分子激光器和电子射线中选出的至少两种曝光光源并且包含碱溶性 由于暴露于g射线,i射线,KrF准分子激光器和电子射线而产生酸的树脂组分(A),酸产生剂组分(B)和交联剂(C); 以及用于制造MEMS的负型抗蚀剂组合物,其包含碱溶性酚醛清漆树脂(A),由于辐射而产生酸的酸产生剂组分(B)和交联剂组分(C)。