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1. 发明授权

US08378230B2 Printed wiring board and method for manufacturing the same 有权
标题翻译：印刷电路板及其制造方法
公开(公告)号：US08378230B2
公开(公告)日：2013-02-19
申请号：US12770820
申请日：2010-04-30
申请人： Masahiro Kaneko , Daiki Komatsu , Satoru Kose , Hirokazu Higashi
发明人： Masahiro Kaneko , Daiki Komatsu , Satoru Kose , Hirokazu Higashi
IPC分类号： H05K1/11
CPC分类号： H05K3/421 , H01L21/486 , H01L21/563 , H01L21/6835 , H01L23/3128 , H01L23/49816 , H01L23/49827 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0657 , H01L2221/68345 , H01L2224/32057 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48165 , H01L2224/48227 , H01L2224/48235 , H01L2224/484 , H01L2224/48599 , H01L2224/4911 , H01L2224/73203 , H01L2224/73265 , H01L2224/83385 , H01L2224/85385 , H01L2225/06506 , H01L2225/0651 , H01L2225/06568 , H01L2924/00014 , H01L2924/01006 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/078 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H05K1/113 , H05K3/007 , H05K3/284 , H05K3/328 , H05K3/4007 , H05K2201/0367 , H05K2201/0394 , H05K2201/09563 , H05K2203/016 , H05K2203/0361 , H05K2203/049 , H05K2203/1316 , Y10T29/49165 , H01L2924/00012 , H01L2924/00011 , H01L2924/00 , H01L2224/85399 , H01L2224/05599
摘要： A printed wiring board includes an interlayer resin insulation layer having the first surface, the second surface on the opposite side of the first surface, and a penetrating hole for a via conductor, a conductive circuit formed on the first surface of the interlayer resin insulation layer, a via conductor formed in the penetrating hole and connected to the conductive circuit on the first surface of the interlayer resin insulation layer, and a surface-treatment coating formed on the surface of the via conductor exposed from the second surface of the interlayer resin insulation layer through the penetrating hole. The via conductor is made of a first conductive layer formed on the side wall of the penetrating hole and a plated-metal filling the penetrating hole. The surface of the via conductor is recessed from the second surface of the interlayer resin insulation layer.
摘要翻译：印刷电路板包括具有第一表面，第一表面相对侧的第二表面和通孔导体的穿透孔的层间树脂绝缘层，形成在层间树脂绝缘层的第一表面上的导电电路，形成在所述贯通孔中并连接到所述层间树脂绝缘层的第一表面上的导电电路的通孔导体，以及形成在所述通孔导体的从所述层间树脂绝缘体的第二表面露出的表面上的表面处理涂层穿透穿孔。通孔导体由形成在穿透孔的侧壁上的第一导电层和填充穿透孔的电镀金属制成。通孔导体的表面从层间树脂绝缘层的第二表面凹陷。

2. 发明授权

US08410376B2 Printed wiring board and method for manufacturing the same 有权
标题翻译：印刷电路板及其制造方法
公开(公告)号：US08410376B2
公开(公告)日：2013-04-02
申请号：US12840696
申请日：2010-07-21
申请人： Masahiro Kaneko , Satoru Kose , Hirokazu Higashi
发明人： Masahiro Kaneko , Satoru Kose , Hirokazu Higashi
IPC分类号： H05K1/11
CPC分类号： H05K3/42 , H01L21/6835 , H01L23/49816 , H01L23/49827 , H01L23/49866 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L2221/68345 , H01L2224/32057 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48235 , H01L2224/484 , H01L2224/48599 , H01L2224/48644 , H01L2224/73265 , H01L2224/83385 , H01L2224/85001 , H01L2224/85385 , H01L2224/85444 , H01L2225/06506 , H01L2225/0651 , H01L2225/06562 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/12041 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H05K1/0313 , H05K1/113 , H05K1/115 , H05K3/007 , H05K3/108 , H05K3/22 , H05K3/388 , H05K2201/0344 , H05K2201/09509 , H05K2201/09527 , H05K2201/09563 , H05K2203/072 , H05K2203/1377 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , H01L2924/00012 , H01L2924/00011 , H01L2924/00 , H01L2224/05599
摘要： A printed wiring board includes an interlayer resin insulation layer having a penetrating hole for a via conductor, a conductive circuit formed on one surface of the interlayer resin insulation layer, a via conductor formed in the penetrating hole and having a protruding portion protruding from the other surface of the interlayer resin insulation layer, and a surface-treatment coating formed on the surface of the protruding portion of the via conductor. The via conductor is connected to the conductive circuit and has a first conductive layer formed on the side wall of the penetrating hole and a plated layer filling the penetrating hole.
摘要翻译：印刷电路板包括：具有用于通路导体的贯通孔的层间树脂绝缘层，形成在层间树脂绝缘层的一个表面上的导电电路;形成在该贯通孔中的通孔导体，并且具有从另一个突出的突出部层间树脂绝缘层的表面和形成在通孔导体的突出部分的表面上的表面处理涂层。通孔导体连接到导电电路，并且具有形成在穿透孔的侧壁上的第一导电层和填充穿透孔的镀层。

3. 发明申请

US20050031920A1 Catalysts for water gas shift reaction, method for removing carbon monoxide in hydrogen gas and fuel cell generation system 审中-公开
标题翻译：用于水煤气变换反应的催化剂，氢气中一氧化碳的去除方法和燃料电池生成系统
公开(公告)号：US20050031920A1
公开(公告)日：2005-02-10
申请号：US10823609
申请日：2004-04-14
申请人： Akira Igarashi , Hirokazu Higashi , Manabu Mizobuchi , Noboru Hashimoto , Kensaku Kinugawa
发明人： Akira Igarashi , Hirokazu Higashi , Manabu Mizobuchi , Noboru Hashimoto , Kensaku Kinugawa
IPC分类号： B01J21/06 , B01J23/42 , B01J23/54 , B01J23/58 , B01J23/63 , B01J23/652 , B01J23/656 , C01B3/16 , C01B3/48 , C10K3/04 , H01M8/06
CPC分类号： C10K3/04 , B01J21/06 , B01J21/063 , B01J21/066 , B01J23/42 , B01J23/54 , B01J23/58 , B01J23/63 , B01J23/652 , B01J23/6567 , C01B3/16 , C01B3/48 , C01B2203/0283 , C01B2203/066 , C01B2203/1041 , C01B2203/107 , C01B2203/1082 , H01M8/06 , H01M8/0662 , Y02P20/52
摘要： There is provided a catalyst for a water gas shift reaction in a hydrogen gas which is able to effectively remove CO in the hydrogen gas within a broader temperature range. Such a catalyst for the water gas shift reaction is characterized in that a metal oxide carrier supports at least platinum. The catalyst can be used for removing carbon monoxide in the hydrogen gas. Particularly, such a catalyst can be used in the water gas shift reaction for removing carbon monoxide in a reformed gas in a fuel cell generation system.
摘要翻译：提供了一种在氢气中进行水煤气变换反应的催化剂，其能够在更宽的温度范围内有效地除去氢气中的CO。这种用于水煤气变换反应的催化剂的特征在于金属氧化物载体至少支持铂。催化剂可用于除去氢气中的一氧化碳。特别地，这种催化剂可用于燃料电池生成系统中的重整气体中的一氧化碳的水煤气变换反应。

4. 发明申请

US20110067913A1 PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：印刷线路板及其制造方法
公开(公告)号：US20110067913A1
公开(公告)日：2011-03-24
申请号：US12770820
申请日：2010-04-30
申请人： Masahiro KANEKO , Daiki Komatsu , Satoru Kose , Hirokazu Higashi
发明人： Masahiro KANEKO , Daiki Komatsu , Satoru Kose , Hirokazu Higashi
IPC分类号： H05K1/11 , H01K3/10
CPC分类号： H05K3/421 , H01L21/486 , H01L21/563 , H01L21/6835 , H01L23/3128 , H01L23/49816 , H01L23/49827 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0657 , H01L2221/68345 , H01L2224/32057 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48165 , H01L2224/48227 , H01L2224/48235 , H01L2224/484 , H01L2224/48599 , H01L2224/4911 , H01L2224/73203 , H01L2224/73265 , H01L2224/83385 , H01L2224/85385 , H01L2225/06506 , H01L2225/0651 , H01L2225/06568 , H01L2924/00014 , H01L2924/01006 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/078 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H05K1/113 , H05K3/007 , H05K3/284 , H05K3/328 , H05K3/4007 , H05K2201/0367 , H05K2201/0394 , H05K2201/09563 , H05K2203/016 , H05K2203/0361 , H05K2203/049 , H05K2203/1316 , Y10T29/49165 , H01L2924/00012 , H01L2924/00011 , H01L2924/00 , H01L2224/85399 , H01L2224/05599
摘要： A printed wiring board includes an interlayer resin insulation layer having the first surface, the second surface on the opposite side of the first surface, and a penetrating hole for a via conductor, a conductive circuit formed on the first surface of the interlayer resin insulation layer, a via conductor formed in the penetrating hole and connected to the conductive circuit on the first surface of the interlayer resin insulation layer, and a surface-treatment coating formed on the surface of the via conductor exposed from the second surface of the interlayer resin insulation layer through the penetrating hole. The via conductor is made of a first conductive layer formed on the side wall of the penetrating hole and a plated-metal filling the penetrating hole. The surface of the via conductor is recessed from the second surface of the interlayer resin insulation layer.
摘要翻译：印刷电路板包括具有第一表面，第一表面相对侧的第二表面和通孔导体的穿透孔的层间树脂绝缘层，形成在层间树脂绝缘层的第一表面上的导电电路，形成在所述贯通孔中并连接到所述层间树脂绝缘层的第一表面上的导电电路的通孔导体，以及形成在所述通孔导体的从所述层间树脂绝缘体的第二表面露出的表面上的表面处理涂层穿透穿孔。通孔导体由形成在穿透孔的侧壁上的第一导电层和填充穿透孔的电镀金属制成。通孔导体的表面从层间树脂绝缘层的第二表面凹入。

5. 发明授权

US06777117B1 Catalysts for water gas shift reaction, method for removing carbon monoxide in hydrogen gas and electric power-generating system of fuel cell 有权
标题翻译：用于水煤气变换反应的催化剂，氢气中一氧化碳的去除方法和燃料电池的发电系统
公开(公告)号：US06777117B1
公开(公告)日：2004-08-17
申请号：US09720262
申请日：2001-02-06
申请人： Akira Igarashi , Hirokazu Higashi , Manabu Mizobuchi , Noboru Hashimoto , Kensaku Kinugawa
发明人： Akira Igarashi , Hirokazu Higashi , Manabu Mizobuchi , Noboru Hashimoto , Kensaku Kinugawa
IPC分类号： C01B316
CPC分类号： C10K3/04 , B01J21/06 , B01J21/063 , B01J21/066 , B01J23/42 , B01J23/54 , B01J23/58 , B01J23/63 , B01J23/652 , B01J23/6567 , C01B3/16 , C01B3/48 , C01B2203/0283 , C01B2203/066 , C01B2203/1041 , C01B2203/107 , C01B2203/1082 , H01M8/06 , H01M8/0662 , Y02P20/52
摘要： There is provided a catalyst for a water gas shift reaction in a hydrogen gas which is able to effectively remove CO in the hydrogen gas within a broader temperature range. Such a catalyst for the water gas shift reaction is characterized in that a metal oxide carrier supports at least platinum. The catalyst can be used for removing carbon monoxide in the hydrogen gas. Particularly, such a catalyst can be used in the water gas shift reaction for removing carbon monoxide in a reformed gas in a fuel cell generation system.
摘要翻译：提供了一种氢气中的水煤气变换催化剂，其能够在更宽的温度范围内有效地除去氢气中的CO。这种用于水煤气变换反应的催化剂的特征在于，金属氧化物载体支持至少白金。催化剂可用于除去氢气中的一氧化碳。特别地，这种催化剂可用于燃料电池生成系统中的重整气体中的一氧化碳的水煤气变换反应。

6. 发明授权

US6013407A Positive resist composition 失效
标题翻译：正抗蚀剂组成
公开(公告)号：US6013407A
公开(公告)日：2000-01-11
申请号：US875045
申请日：1997-07-08
申请人： Shoji Kawata , Hiroshi Hayashi , Hirokazu Higashi , Takeyoshi Kato , Masahiro Nakamura
发明人： Shoji Kawata , Hiroshi Hayashi , Hirokazu Higashi , Takeyoshi Kato , Masahiro Nakamura
IPC分类号： G03F7/022 , G03F7/023
CPC分类号： G03F7/0236 , G03F7/0226 , G03F7/0233
摘要： A positive resist composition is excellent in sensitivity, film loss after development, resolution, thermal-flow resistance, storage stability, exposure margin and focus margin and comprises in combination (A) an alkali-soluble phenol resin, (B) a quinonediazide sulfonate type photosensitive agent and (C) a phenolic compound, wherein the phenolic compound (C) is at least one phenolic compound selected from the group consisting of phenolic compounds (CX) having a structural unit represented by the following formula (I) and phenolic compounds (CD) having a structural unit represented by the following formula (II): ##STR1## wherein R.sup.1 to R.sup.3 are, independently of one another, a hydrogen atom, a hydroxyl group, a halogen atom, an alkyl group which may be substituted, a cycloalkyl group which may be substituted, an alkenyl group which may be substituted, an alkoxy group which may be substituted, or an aryl group which may be substituted, R.sup.4 to R.sup.11 are, independently of one another, a hydrogen atom, an alkyl group which may be substituted, a cycloalkyl group which may be substituted, an alkenyl group which may be substituted, an aryl group which may be substituted, or an alkoxy group which may be substituted, and n is a positive integer; and ##STR2## wherein R.sup.12 to R.sup.15 are, independently of one another, a hydrogen atom, a hydroxyl group, a halogen atom, an alkyl group which may be substituted, a cycloalkyl group which may be substituted, an alkenyl group which may be substituted, an alkoxy group which may be substituted, or an aryl group which may be substituted, with the proviso that at least one of R.sup.12 to R.sup.15 is a hydroxyl group, and m is a positive integer.
摘要翻译： PCT No.PCT / JP96 / 00061 Sec。 371日期1997年7月8日 102（e）日期1997年7月8日PCT 1996年1月17日PCT PCT。公开号WO96 / 22563 日期：1996年7月25日正性抗蚀剂组合物具有优异的敏感性，显影后的膜损耗，分辨率，耐热流动性，储存稳定性，曝光余量和聚焦余量，并且包括（A）碱溶性酚醛树脂（B ）醌二叠氮化物型光敏剂和（C）酚类化合物，其中所述酚类化合物（C）为选自具有由下式（I）表示的结构单元的酚类化合物（CX））组成的组中的至少一种酚类化合物）和具有由下式（II）表示的结构单元的酚类化合物（CD）：其中R 1至R 3彼此独立地为氢原子，羟基，卤素原子，可被取代的烷基可被取代的环烷基，可被取代的链烯基，可被取代的烷氧基或可被取代的芳基R4至R11彼此独立地是氢原子，可以被取代的烷基，可被取代的环烷基，可被取代的烯基，可被取代的芳基或可被取代的烷氧基，n是正的整数; 并且其中R12至R15彼此独立地为氢原子，羟基，卤素原子，可被取代的烷基，可被取代的环烷基，可被取代的烯基，烷氧基可以被取代的基团，或可以被取代的芳基，条件是R12至R15中的至少一个是羟基，m是正整数。

7. 发明申请

US20110048773A1 PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：印刷线路板及其制造方法
公开(公告)号：US20110048773A1
公开(公告)日：2011-03-03
申请号：US12840696
申请日：2010-07-21
申请人： Masahiro Kaneko , Satoru Kose , Hirokazu Higashi
发明人： Masahiro Kaneko , Satoru Kose , Hirokazu Higashi
IPC分类号： H05K1/09 , H05K1/11 , H05K3/10
CPC分类号： H05K3/42 , H01L21/6835 , H01L23/49816 , H01L23/49827 , H01L23/49866 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L2221/68345 , H01L2224/32057 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48235 , H01L2224/484 , H01L2224/48599 , H01L2224/48644 , H01L2224/73265 , H01L2224/83385 , H01L2224/85001 , H01L2224/85385 , H01L2224/85444 , H01L2225/06506 , H01L2225/0651 , H01L2225/06562 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/12041 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H05K1/0313 , H05K1/113 , H05K1/115 , H05K3/007 , H05K3/108 , H05K3/22 , H05K3/388 , H05K2201/0344 , H05K2201/09509 , H05K2201/09527 , H05K2201/09563 , H05K2203/072 , H05K2203/1377 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , H01L2924/00012 , H01L2924/00011 , H01L2924/00 , H01L2224/05599
摘要： A printed wiring board includes an interlayer resin insulation layer having a penetrating hole for a via conductor, a conductive circuit formed on one surface of the interlayer resin insulation layer, a via conductor formed in the penetrating hole and having a protruding portion protruding from the other surface of the interlayer resin insulation layer, and a surface-treatment coating formed on the surface of the protruding portion of the via conductor. The via conductor is connected to the conductive circuit and has a first conductive layer formed on the side wall of the penetrating hole and a plated layer filling the penetrating hole.
摘要翻译：印刷电路板包括：具有用于通路导体的贯通孔的层间树脂绝缘层，形成在层间树脂绝缘层的一个表面上的导电电路;形成在该贯通孔中的通孔导体，并且具有从另一个突出的突出部层间树脂绝缘层的表面和形成在通孔导体的突出部分的表面上的表面处理涂层。通孔导体连接到导电电路，并且具有形成在穿透孔的侧壁上的第一导电层和填充穿透孔的镀层。

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