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    • 2. 发明申请
    • Epoxy Resin Composition for Prepreg, Prepreg and Multilayered Printed Wiring Board
    • 预浸料,预浸料和多层印刷接线板的环氧树脂组合物
    • US20090008127A1
    • 2009-01-08
    • US11659408
    • 2004-11-30
    • Hidetsugu MotobeYoshihiko NakamuraTakeshi KoizumiRyuji Takahashi
    • Hidetsugu MotobeYoshihiko NakamuraTakeshi KoizumiRyuji Takahashi
    • C08L63/00C08L71/10C08K3/22C08K3/36H05K1/00
    • C08G59/3254C08G59/4071C08G59/621H05K1/0373H05K3/4626H05K2201/0209Y10T428/31511
    • Problems: To provide an epoxy resin composition for prepreg used in manufacturing a printed wiring board, particularly a multilayered printed wiring board, which does not generate toxic substance on combustion and excellent in ignition resistance, solder heat resistance after moisture absorption and high temperature rigidity, prepregs and multilayered printed wiring boards.Means for solving problems: A phosphorous compound comprising 1.8 or more but less than 3 phenolic hydroxyl groups on an average and 0.8 or more phosphorous atom on an average within a molecule is reacted in advance with a particular bifunctional epoxy resin (selected from biphenyl, naphthalene, dicylcopentadiene or other types) in a ratio of epoxy equivalent to phenolic hydroxyl equivalent to be 1.2 or more but less than 3 to 1 to yield a preliminarily reacted epoxy resin, of which 20% by mass to 55% by mass against the whole epoxy resin composition is formulated together with a multifunctional epoxy resin having 2.8 or more epoxy groups on an average within a molecule, a curing agent comprising dicyandiamide and/or multifunctional phenolic compound and an inorganic filler with thermal decomposition temperature of 400° C. or above, yielding, an epoxy resin composition which is used to prepare prepregs used in manufacturing a printed wiring board.
    • 问题:为了提供一种用于制造印刷线路板,特别是多层印刷线路板的预浸料用环氧树脂组合物,其不会在燃烧时产生有毒物质,具有优异的耐点火性,吸湿性和耐高温刚性之后的耐焊锡性, 预浸料和多层印刷线路板。 解决问题的手段:在分子内平均含有1.8个以上且小于3个的酚性羟基的磷化合物与平均0.8个以上的磷原子预先与特定的双官能环氧树脂(选自联苯,萘 ,二辛基戊二烯或其它类型的)环氧当量与酚羟基当量的比例为1.2以上且小于3比1,得到预反应的环氧树脂,相对于整个环氧树脂为20质量%〜55质量% 树脂组合物与分子内平均具有2.8个以上环氧基的多官能环氧树脂一起配制,含有双氰胺和/或多官能酚类化合物的固化剂和热分解温度为400℃以上的无机填料, 得到用于制备印刷线路板制造中使用的预浸料的环氧树脂组合物。