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1. 发明申请

US20060216495A1 Resin composition for printed wiring board, prepreg laminate, and printed wiring board made with the same 有权
标题翻译：用于印刷线路板，预浸料层合板和由其制成的印刷线路板的树脂组合物
公开(公告)号：US20060216495A1
公开(公告)日：2006-09-28
申请号：US10565407
申请日：2004-03-31
申请人： Hidetsugu Motobe , Akinori Hibino , Katsuhiko Ito
发明人： Hidetsugu Motobe , Akinori Hibino , Katsuhiko Ito
IPC分类号： B32B5/16 , B32B18/00 , C08G59/14
CPC分类号： H05K1/0373 , C08G59/226 , C08G59/621 , C08G59/686 , C08J5/24 , C08J2363/00 , C08K3/36 , C08K7/00 , C08L61/06 , C08L63/00 , H05K2201/0209 , H05K2201/0245 , Y10T428/24994 , Y10T428/25 , Y10T428/252 , Y10T428/31522 , Y10T428/31529 , C08L2666/22 , C08L2666/16
摘要： An epoxy resin composition for printed wiring boards which comprises an epoxy resin, a phenolic novolak, a curing accelerator, and a silica filler, characterized in that the silica filler has a shape having at least two planes and has an average particle diameter of 0.3 to 10 μm and a specific surface area of 8 to 30 m2/g. The epoxy resin composition has a higher apparent viscosity than the resins and can hence be inhibited from sagging in a drying oven. This composition retains the intact property of infiltration into reinforcements because the viscosity of the resins themselves has not increased locally. The composition hence produces the effect of improving the appearance of a prepreg.
摘要翻译：一种用于印刷线路板的环氧树脂组合物，其包含环氧树脂，酚醛清漆，固化促进剂和二氧化硅填料，其特征在于，二氧化硅填料具有至少两个平面的形状，平均粒径为0.3〜 10微米，比表面积为8至30微米/克。环氧树脂组合物具有比树脂更高的表观粘度，因此可以在干燥炉中抑制下垂。由于树脂本身的粘度本身没有增加，所以这种组合物保持渗入增强物的完整性质。因此，该组合物产生改善预浸料坯外观的效果。

2. 发明申请

US20090008127A1 Epoxy Resin Composition for Prepreg, Prepreg and Multilayered Printed Wiring Board 有权
标题翻译：预浸料，预浸料和多层印刷接线板的环氧树脂组合物
公开(公告)号：US20090008127A1
公开(公告)日：2009-01-08
申请号：US11659408
申请日：2004-11-30
申请人： Hidetsugu Motobe , Yoshihiko Nakamura , Takeshi Koizumi , Ryuji Takahashi
发明人： Hidetsugu Motobe , Yoshihiko Nakamura , Takeshi Koizumi , Ryuji Takahashi
IPC分类号： C08L63/00 , C08L71/10 , C08K3/22 , C08K3/36 , H05K1/00
CPC分类号： C08G59/3254 , C08G59/4071 , C08G59/621 , H05K1/0373 , H05K3/4626 , H05K2201/0209 , Y10T428/31511
摘要： Problems: To provide an epoxy resin composition for prepreg used in manufacturing a printed wiring board, particularly a multilayered printed wiring board, which does not generate toxic substance on combustion and excellent in ignition resistance, solder heat resistance after moisture absorption and high temperature rigidity, prepregs and multilayered printed wiring boards.Means for solving problems: A phosphorous compound comprising 1.8 or more but less than 3 phenolic hydroxyl groups on an average and 0.8 or more phosphorous atom on an average within a molecule is reacted in advance with a particular bifunctional epoxy resin (selected from biphenyl, naphthalene, dicylcopentadiene or other types) in a ratio of epoxy equivalent to phenolic hydroxyl equivalent to be 1.2 or more but less than 3 to 1 to yield a preliminarily reacted epoxy resin, of which 20% by mass to 55% by mass against the whole epoxy resin composition is formulated together with a multifunctional epoxy resin having 2.8 or more epoxy groups on an average within a molecule, a curing agent comprising dicyandiamide and/or multifunctional phenolic compound and an inorganic filler with thermal decomposition temperature of 400° C. or above, yielding, an epoxy resin composition which is used to prepare prepregs used in manufacturing a printed wiring board.
摘要翻译：问题：为了提供一种用于制造印刷线路板，特别是多层印刷线路板的预浸料用环氧树脂组合物，其不会在燃烧时产生有毒物质，具有优异的耐点火性，吸湿性和耐高温刚性之后的耐焊锡性，预浸料和多层印刷线路板。解决问题的手段：在分子内平均含有1.8个以上且小于3个的酚性羟基的磷化合物与平均0.8个以上的磷原子预先与特定的双官能环氧树脂（选自联苯，萘，二辛基戊二烯或其它类型的）环氧当量与酚羟基当量的比例为1.2以上且小于3比1，得到预反应的环氧树脂，相对于整个环氧树脂为20质量％〜55质量％树脂组合物与分子内平均具有2.8个以上环氧基的多官能环氧树脂一起配制，含有双氰胺和/或多官能酚类化合物的固化剂和热分解温度为400℃以上的无机填料，得到用于制备印刷线路板制造中使用的预浸料的环氧树脂组合物。

3. 发明申请

US20060159928A1 Resin composition for printed wiring board, prepreg, and laminate obtained with the same 有权
公开(公告)号：US20060159928A1
公开(公告)日：2006-07-20
申请号：US10559556
申请日：2003-06-03
申请人： Hidetsugu Motobe , Akinori Hibino , Katsuhiko Ito
发明人： Hidetsugu Motobe , Akinori Hibino , Katsuhiko Ito
IPC分类号： B32B27/38 , B32B27/04
CPC分类号： C08G59/621 , C08G59/063 , C08G59/226 , C08G59/30 , C08G59/38 , C08G59/686 , H05K1/0326 , Y10T428/31511 , Y10T442/2713
摘要： An epoxy resin composition for use in producing a prepreg for printed wiring boards excellent in appearance, flame retardancy, etc., which comprises an epoxy resin, a phenolic novolak, and a curing accelerator. It is characterized in that the epoxy resin comprises an epoxy (a) and an epoxy (b), wherein the epoxy (a) is a brominated epoxy resin which is obtained by reacting/mixing a bisphenol A epoxy resin with tetrabromobisphenol A and has an epoxy equivalent of 350 to 470 g/eq and an n=0 component content of 20 to 35% in terms of areal percentage in a GPC chart, and the epoxy (b) is at least one bifunctional epoxy resin which is obtained by reacting any one selected from the group consisting of bisphenol A, bisphenol F, and tetrabromobisphenol A with epichlorohydrin and has an n=0 component content as determined from a GPC chart of 60% or higher.

4. 发明授权

US08470938B2 Resin composition for printed wiring board, prepreg, and laminate obtained with the same 有权
标题翻译：用于印刷线路板的树脂组合物，预浸料和用其制得的层合物
公开(公告)号：US08470938B2
公开(公告)日：2013-06-25
申请号：US10559556
申请日：2003-06-03
申请人： Hidetsugu Motobe , Akinori Hibino , Katsuhiko Ito
发明人： Hidetsugu Motobe , Akinori Hibino , Katsuhiko Ito
IPC分类号： C08F283/00 , B32B27/04 , B32B27/38
CPC分类号： C08G59/621 , C08G59/063 , C08G59/226 , C08G59/30 , C08G59/38 , C08G59/686 , H05K1/0326 , Y10T428/31511 , Y10T442/2713
摘要： An epoxy resin composition for use in producing a prepreg for printed wiring boards excellent in appearance, flame retardancy, etc., which comprises an epoxy resin, a phenolic novolak, and a curing accelerator. It is characterized in that the epoxy resin comprises an epoxy (a) and an epoxy (b), wherein the epoxy (a) is a brominated epoxy resin which is obtained by reacting/mixing a bisphenol A epoxy resin with tetrabromobisphenol A and has an epoxy equivalent of 350 to 470 g/eq and an n=0 component content of 20 to 35% in terms of areal percentage in a GPC chart, and the epoxy (b) is at least one bifunctional epoxy resin which is obtained by reacting any one selected from the group consisting of bisphenol A, bisphenol F, and tetrabromobisphenol A with epichlorohydrin and has an n=0 component content as determined from a GPC chart of 60% or higher.
摘要翻译：一种环氧树脂组合物，其用于制造外观，阻燃性等优异的印刷线路板用预浸料，其包含环氧树脂，酚醛清漆和固化促进剂。其特征在于环氧树脂包括环氧树脂（a）和环氧树脂（b），其中环氧（a）是通过使双酚A环氧树脂与四溴双酚A反应/混合获得的溴化环氧树脂，并且具有环氧当量为350〜470g / eq，n = 0成分含量为GPC图中的面积百分比为20〜35％，环氧（b）为至少一种双官能环氧树脂，其通过使任何一种选自双酚A，双酚F和四溴双酚A与表氯醇，并且由GPC图表确定为n = 0的成分含量为60％以上。

5. 发明授权

US07566501B2 Resin composition for printed wiring board, prepreg, laminate, and printed wiring board made with the same 有权
标题翻译：用于印刷线路板，预浸料，层压板和印刷线路板的树脂组合物
公开(公告)号：US07566501B2
公开(公告)日：2009-07-28
申请号：US10565407
申请日：2004-03-31
申请人： Hidetsugu Motobe , Akinori Hibino , Katsuhiko Ito
发明人： Hidetsugu Motobe , Akinori Hibino , Katsuhiko Ito
IPC分类号： B32B15/092 , B32B27/04 , B32B27/20 , B32B27/38 , C09J163/00 , C08L63/00
CPC分类号： H05K1/0373 , C08G59/226 , C08G59/621 , C08G59/686 , C08J5/24 , C08J2363/00 , C08K3/36 , C08K7/00 , C08L61/06 , C08L63/00 , H05K2201/0209 , H05K2201/0245 , Y10T428/24994 , Y10T428/25 , Y10T428/252 , Y10T428/31522 , Y10T428/31529 , C08L2666/22 , C08L2666/16
摘要： An epoxy resin composition for printed wiring boards which comprises an epoxy resin, a phenolic novolak, a curing accelerator, and a silica filler, characterized in that the silica filler has a shape having at least two planes and has an average particle diameter of 0.3 to 10 μm and a specific surface area of 8 to 30 m2/g. The epoxy resin composition has a higher apparent viscosity than the resins and can hence be inhibited from sagging in a drying oven. This composition retains the intact property of infiltration into reinforcements because the viscosity of the resins themselves has not increased locally. The composition hence produces the effect of improving the appearance of a prepreg.
摘要翻译：一种用于印刷线路板的环氧树脂组合物，其包含环氧树脂，酚醛清漆，固化促进剂和二氧化硅填料，其特征在于，二氧化硅填料具有至少两个平面的形状，平均粒径为0.3〜 10mum，比表面积为8〜30m2 / g。环氧树脂组合物具有比树脂更高的表观粘度，因此可以在干燥炉中抑制下垂。由于树脂本身的粘度本身没有增加，所以这种组合物保持渗入增强物的完整性质。因此，该组合物产生改善预浸料坯外观的效果。

6. 发明授权

US08062750B2 Epoxy resin composition for prepreg, prepreg and multilayered printed wiring board 有权
标题翻译：预浸料，预浸料和多层印刷线路板用环氧树脂组合物
公开(公告)号：US08062750B2
公开(公告)日：2011-11-22
申请号：US11659408
申请日：2004-11-30
申请人： Hidetsugu Motobe , Yoshihiko Nakamura , Takeshi Koizumi , Ryuji Takahashi
发明人： Hidetsugu Motobe , Yoshihiko Nakamura , Takeshi Koizumi , Ryuji Takahashi
IPC分类号： B32B27/38 , B32B27/04 , B32B27/20 , C08L63/00 , C08L85/02
CPC分类号： C08G59/3254 , C08G59/4071 , C08G59/621 , H05K1/0373 , H05K3/4626 , H05K2201/0209 , Y10T428/31511
摘要： An epoxy resin composition for a prepreg used in manufacturing a printed wiring board, particularly a multilayered printed wiring board, is provided. The composition features: (A) a multifunctional epoxy resin having on average 2.8 or more epoxy groups per molecule; (B) a reaction product of a phosphorous compound, a bifunctional epoxy resin, and an optional multifunctional epoxy resin, provided in an amount of 20% to 55% by mass, based on the total amount of epoxy resin, including (A) and (B); (C) a curing agent of dicyandiamide and/or a multifunctional phenolic compound; and (D) an inorganic filler blend containing an inorganic filler with a thermal decomposition temperature of 400° C. or above. The composition does not generate toxic substances when combusted and has excellent ignition resistance, solder heat resistance after moisture absorption, and high temperature rigidity.
摘要翻译：提供一种用于制造印刷线路板，特别是多层印刷线路板的预浸料的环氧树脂组合物。组合物的特征在于：（A）每分子平均具有2.8个或更多个环氧基团的多官能环氧树脂; （B）基于环氧树脂的总量，含有（A）和（B）的环氧树脂的总量，以磷化合物，双官能环氧树脂和任选的多官能环氧树脂的反应产物的量为20〜55质量％（B）; （C）双氰胺和/或多官能酚类化合物的固化剂; 和（D）含有热分解温度为400℃以上的无机填料的无机填料共混物。该组合物在燃烧时不产生有毒物质，具有优异的耐点火性，吸湿后的耐焊锡性和高温刚性。

7. 发明申请

US20060222856A1 Prepreg for printed wiring board and copper-clad laminated board 审中-公开
标题翻译：印刷线路板和覆铜层压板用预浸料
公开(公告)号：US20060222856A1
公开(公告)日：2006-10-05
申请号：US10559321
申请日：2003-06-02
申请人： Katsuhiko Itou , Akinori Hibino , Hidetsugu Motobe
发明人： Katsuhiko Itou , Akinori Hibino , Hidetsugu Motobe
IPC分类号： B32B15/092 , B32B27/38 , B32B27/26
CPC分类号： B32B27/04 , B32B5/024 , B32B15/08 , B32B15/14 , B32B15/20 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2307/306 , B32B2307/726 , B32B2307/748 , B32B2457/08 , C08J5/24 , C08J2363/00 , H05K1/0326 , Y10T428/31511 , Y10T428/31529
摘要： A prepreg for a printed wiring board characterized with use of a brominated epoxy resin, possessing a peak intensity of infrared absorption spectrum at 2100 to 2300 cm−1, which is 5% or lower than that of a benzene ring carbon-carbon double bond at 1600 cm−1 as measured with an infrared absorption spectrometer as well as having an inflection point between 120 and 150° C. in the cured product of said brominated epoxy resin as measured by means of a differential scanning calorimeter. The prepreg for the printed wiring board is superior in hygroscopicity, heat resistance, and desmear capability as a printed wiring board material and can be used to manufacture a copper-clad laminate board.
摘要翻译：一种用于印刷线路板的预浸料，其特征在于使用溴化环氧树脂，其在2100至2300cm -1处的红外吸收光谱的峰值强度为苯的5％或更低的5％或更低在红外吸收光谱仪中测量的1600cm -1的环碳 - 碳双键，并且在测量的所述溴化环氧树脂的固化产物中具有120-150℃的拐点通过差示扫描量热计。用于印刷线路板的预浸料坯作为印刷线路板材料具有优异的吸湿性，耐热性和去污性，并且可用于制造覆铜层压板。

8. 发明授权

US06231959B1 Prepreg of epoxy resin, hardener, and organodialkyurea promotor 失效
标题翻译：环氧树脂预浸料，固化剂和有机二元醇促进剂
公开(公告)号：US06231959B1
公开(公告)日：2001-05-15
申请号：US09225500
申请日：1999-01-06
申请人： Yoshihiko Nakamura , Masahiro Matsumura , Narimasa Iwamoto , Hidetsugu Motobe , Yukio Hatta
发明人： Yoshihiko Nakamura , Masahiro Matsumura , Narimasa Iwamoto , Hidetsugu Motobe , Yukio Hatta
IPC分类号： B32B1704
CPC分类号： C08G59/686 , C08G59/5086 , C08G59/621 , H05K1/0326 , Y10T428/24994 , Y10T428/31511
摘要： An epoxy resin composition featured in containing, in a matrix of an epoxy resin having more than two epoxy groups in each molecule, a phenolic hardening agent having more than two phenolic hydroxyl groups in each molecule, an organobis(N-dialkylurea) hardening promotion agent, a solvent for the hardening promotion agent, and a guanamine compound, and capable of obtaining a prepreg excellent in the preservation stability and, less causing a solvency errosion (halo phenomenon) due to an infiltration of plating solution along boundaries between a printed copper circuit formed in an inner-layered circuit board and a resin forming the prepreg, is realized.
摘要翻译：一种环氧树脂组合物，其特征在于，在每个分子中具有多于两个环氧基的环氧树脂的基质中含有每个分子中具有多于两个酚羟基的酚类硬化剂，有机双（N-二烷基脲）硬化促进剂，硬化促进剂的溶剂和胍胺化合物，并且能够获得保存稳定性优异的预浸料，并且由于电镀液沿着印刷铜电路之间的边界渗入而导致溶解性腐蚀（光晕现象）形成在内层电路板和形成预浸料的树脂中。

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