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1. 发明授权

US08844124B2 Operation instruction display technique for an electronic component mounting system 有权
标题翻译：电子元件安装系统的操作说明显示技术
公开(公告)号：US08844124B2
公开(公告)日：2014-09-30
申请号：US12679065
申请日：2008-10-07
申请人： Kazuhiko Itose , Kenichiro Ishimoto , Yoshiaki Awata , Hideki Sumi
发明人： Kazuhiko Itose , Kenichiro Ishimoto , Yoshiaki Awata , Hideki Sumi
IPC分类号： H05K3/30 , H05K9/00
CPC分类号： H05K9/00 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/5313 , Y10T29/53187
摘要： An electronic component mounting system and method is disclosed that can provide accurate operation instruction to a machine operator. The electronic component mounting system comprises a plurality of machines interlinked in series. A main screen, making up an operation instruction screen, is displayed on a display panel belonging to an operation target machine to be operated by the machine operator while a first sub-screen and a second sub-screen of the operation instruction screen are respectively displayed on display panels belonging to two adjacent machines placed adjacently on both sides of the operation target machine among the plurality of machines. Thus, even when a unit device has a small width such that a size restriction is imposed a display panel, accurate operation instruction, with a sufficient amount of information, can be provided by displaying the operation instruction screen on multiple display panels.
摘要翻译：公开了一种电子部件安装系统和方法，其可以向机器操作者提供精确的操作指令。电子部件安装系统包括串联连接的多个机器。构成操作指示画面的主画面被显示在属于操作对象机器的显示面板上，以由机器操作者操作，同时分别显示操作指令画面的第一子画面和第二子画面在多台机器之间的属于操作对象机两侧相邻的两台相邻机器的显示面板上。因此，即使当单元设备具有小尺寸以使得对显示面板施加尺寸限制时，可以通过在多个显示面板上显示操作指令画面来提供具有足够量的信息的精确操作指令。

2. 发明授权

US08646174B2 Device and method for mounting electronic components 有权
标题翻译：用于安装电子元件的装置和方法
公开(公告)号：US08646174B2
公开(公告)日：2014-02-11
申请号：US13381245
申请日：2010-05-07
申请人： Kenichi Kaida , Hideki Sumi , Masahiro Kihara , Kenichirou Ishimoto , Noboru Higashi
发明人： Kenichi Kaida , Hideki Sumi , Masahiro Kihara , Kenichirou Ishimoto , Noboru Higashi
IPC分类号： H05K3/30 , H05K3/20
CPC分类号： H05K13/0452 , H01L23/552 , H01L25/50 , H01L2924/0002 , H05K13/0812 , Y10T29/49128 , Y10T29/4913 , Y10T29/49131 , Y10T29/53022 , H01L2924/00
摘要： An object is to provide an electronic component mounting method in which an adequate component mounting work to which a check result is correctly reflected is enabled and it is possible to satisfy both reduction of the failure occurrence rate and improvement of the working efficiency. An electronic component mounting apparatus in which an appearance checking section which checks a board to detect existence or non-existence of a failure item, and a component mounting section which transfers and mounts an allocated mounting object component to the board in which the check is ended are integrally disposed includes a mounting availability determination processing section 28d which determines an availability of an execution of an operation of mounting the mounting object component, based on a result of detection of a failure item. In a mounting availability determining process, an availability of an execution of a mounting operation for the mounting object component is automatically determined based on preset failure patterns of the detection result.
摘要翻译：本发明的目的是提供一种电子部件安装方法，其中能够正确反映检查结果的适当部件安装工作，并且可以同时满足故障发生率的降低和工作效率的提高。一种电子部件安装装置，其中检查板以检测故障项目的存在或不存在的外观检查部分以及将分配的安装对象部件传送并安装到检查结束的板的部件安装部分一体地设置有基于故障项目的检测结果的安装可用性判定处理部28d，其确定安装对象部件的安装的动作的可行性。在安装可用性确定过程中，基于检测结果的预设故障模式自动确定对安装对象部件的安装操作的执行的可用性。

3. 发明申请

US20100262276A1 SUBSTRATE TRANSPORT APPARATUS AND SUBSTRATE TRANSPORT METHOD 有权
标题翻译：基板运输装置和基板运输方法
公开(公告)号：US20100262276A1
公开(公告)日：2010-10-14
申请号：US12739585
申请日：2008-10-16
申请人： Hideki Sumi
发明人： Hideki Sumi
IPC分类号： H01L21/677 , H01L21/683
CPC分类号： H05K13/0061
摘要： To provide a substrate transport apparatus and a substrate transport method that enable curtailing of a mounting wait time incidental to movement of support pins.Height data pertaining to components 10 mounted on a back side of a substrate 1 are stored beforehand. During substrate carrying-in operation, support pins 7 are caused to descend according to component height data and wait at a height h1 where to be able to avoid interference with the components 10. During substrate carrying-out operation, the support pins 7 are caused to descend according to the component height data and recede to the height h1 where to be able to avoid interference with the components 10.
摘要翻译：提供一种能够抑制与支撑销的移动有关的安装等待时间的基板输送装置和基板输送方法。预先存储与安装在基板1的背面的部件10有关的高度数据。在基板输入操作期间，支撑销7根据部件高度数据下降，并且在能够避免与部件10干涉的高度h1处等待。在基板传送操作期间，引起支撑销7 根据部件高度数据下降并减小到能够避免与部件10干涉的高度h1。

4. 发明申请

US20090100672A1 ELECTRONIC COMPONENT PLACEMENT METHOD 有权
标题翻译：电子元件放置方法
公开(公告)号：US20090100672A1
公开(公告)日：2009-04-23
申请号：US11916473
申请日：2006-08-16
申请人： Hideki Sumi , Takahiro Noda
发明人： Hideki Sumi , Takahiro Noda
IPC分类号： B23P19/00 , H05K3/30
CPC分类号： H05K13/0452 , H05K13/0853 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/53174 , Y10T29/53178
摘要： In an electronic component placement method in which electronic components are picked up from a plurality of component supply sections which supply electronic components using a plurality of mounting heads which are provided corresponding to the respective component supply sections, and the electronic components are transferred and mounted on a substrate in a same placing stage, in performing the component transferring and mounting operations, head interference areas which constitute exclusive operating regions to which only the specified mounting heads are allowed to access are set for every placing turn. Due to such a constitution, in the component placement operation, it is possible to rationally set the accessible region without causing the interference of one mounting head with another mounting head thus shortening a placing tact time by excluding wasteful standby times of the mounting heads.
摘要翻译：在电子部件配置方法中，电子部件从使用与各部件供给部对应设置的多个安装头供给电子部件的多个部件供给部拾取，电子部件被传送并安装在在相同的放置台中的基板，在执行部件传送和安装操作时，对于每个放置转弯设置构成仅允许指定的安装头访问的专用操作区域的头部干涉区域。由于这样的结构，在部件配置动作中，可以合理地设定可接近区域而不会引起一个安装头与另一个安装头的干扰，从而通过排除安装头的浪费的待机时间来缩短放置时间。

5. 发明申请

US20050253596A1 Capacitance difference detecting circuit and MEMS sensor 有权
标题翻译：电容差分检测电路和MEMS传感器
公开(公告)号：US20050253596A1
公开(公告)日：2005-11-17
申请号：US10942127
申请日：2004-09-16
申请人： Mayo Kitano , Hideki Sumi , Tsuyoshi Moribe
发明人： Mayo Kitano , Hideki Sumi , Tsuyoshi Moribe
IPC分类号： G01C19/56 , G01D5/24 , G01D5/241 , G01P15/125 , G01R27/26
CPC分类号： G01C19/56 , G01D5/24 , G01P15/125 , G01P2015/084
摘要： Oscillators have capacitors, respectively, whose capacitances change according to an external force and generate first oscillating signals according to the capacitances. Each of the capacitors is disposed, for example, between a substrate and a mass body that is movably disposed to face the substrate and oscillates in a direction perpendicular to the substrate. A detecting unit detects a relative difference between the capacitances of the capacitors as a difference between frequencies of the first oscillating signals. An angular speed or acceleration applied in a horizontal direction of the substrate is calculated according to the frequency change detected by the detecting unit. Therefore, a capacitance difference detecting circuit and a MEMS sensor that detect a minute change in the capacitances of the two capacitors caused by the external force are formed.
摘要翻译：振荡器分别具有电容器，其电容根据外力而变化，并根据电容产生第一振荡信号。每个电容器例如设置在基板和可移动地设置成面对基板并在垂直于基板的方向上振荡的质量体之间。检测单元检测作为第一振荡信号的频率之间的差异的电容器的电容之间的相对差。根据由检测单元检测到的频率变化来计算在基板的水平方向上施加的角速度或加速度。因此，形成检测由外力引起的两个电容器的电容的微小变化的电容差检测电路和MEMS传感器。

6. 发明授权

US06918176B2 Mounting apparatus of electronic parts and mounting methods of the same 有权
标题翻译：电子零件的安装装置及其安装方法
公开(公告)号：US06918176B2
公开(公告)日：2005-07-19
申请号：US10087927
申请日：2002-03-05
申请人： Kazuhide Nagao , Takuya Tsutsumi , Takahiro Noda , Hideki Sumi
发明人： Kazuhide Nagao , Takuya Tsutsumi , Takahiro Noda , Hideki Sumi
IPC分类号： H05K13/00 , H05K13/04 , H05K3/30
CPC分类号： H05K13/0452 , H05K13/0069 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/49144 , Y10T29/53174 , Y10T29/53178
摘要： An apparatus and method for mounting electronic parts wherein a transfer width between a pair of transfer rails is changeable according to a size of a substrate. A mounting head picks up electronic parts at a parts supply member and keeps its stand-by position for mounting the electronic parts on the substrate. The stand-by position of the mounting head is determined according to the changed amount of the transfer width.
摘要翻译：一种用于安装电子部件的装置和方法，其中一对传送导轨之间的传送宽度可根据基板的尺寸而改变。安装头在零件供应构件上拾取电子部件，并保持其用于将电子部件安装在基板上的待机位置。安装头的待机位置根据传送宽度的变化量来确定。

7. 发明授权

US06578261B2 Part-mounting system comprising a plurality of part mounting devices and method of part mounting 有权
标题翻译：部件安装系统包括多个部件安装装置和部件安装方法
公开(公告)号：US06578261B2
公开(公告)日：2003-06-17
申请号：US09923897
申请日：2001-08-07
申请人： Hideki Sumi
发明人： Hideki Sumi
IPC分类号： H05K330
CPC分类号： H05K13/08 , Y10T29/49004 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144 , Y10T29/53174
摘要： In a part-mounting system formed by linking plural part-mounting devices which carry out respective process steps of part-mounting, when a production tact-time of one of the devices varies beyond a given variation range, a tact-time change signal is sent to other devices located at upstream and/or downstream of the device via a communicating section. The other devices receive the tact-time change signal and changes their own work tact-times from the ones corresponding to a productivity-oriented mode to a slower tact-pattern corresponding to a quality-oriented mode. Thus every device constituting the system can accommodate a tact-time variation due to a tact-time delay of any part-mounting device. As a result, the quality appropriate to the tact-time can be secured.
摘要翻译：在通过连接执行部件安装的各个工艺步骤的多个部件安装装置形成的部件安装系统中，当一个装置的生产节拍时间变化超过给定的变化范围时，节拍改变信号为经由通信部分发送到位于设备的上游和/或下游的其他设备。其他设备接收节拍时间改变信号，并将自己的工作生产时间从对应于生产力导向模式的工作时间改变为对应于质量导向模式的较慢的节拍模式。因此，构成系统的每个装置可以由于任何部件安装装置的触发时间延迟而适应节拍时间变化。结果，可以确保适合于节拍时间的质量。

8. 发明授权

US06550135B2 Method of part mounting 有权
标题翻译：零件安装方法
公开(公告)号：US06550135B2
公开(公告)日：2003-04-22
申请号：US09793458
申请日：2001-02-26
申请人： Kazuhiko Nakahara , Hideki Sumi , Takahiro Noda
发明人： Kazuhiko Nakahara , Hideki Sumi , Takahiro Noda
IPC分类号： H05K330
CPC分类号： H05K3/0008 , H05K1/0269 , H05K3/0097 , H05K3/30 , H05K13/08 , H05K2201/09918 , Y10T29/4913 , Y10T29/49131 , Y10T29/53009 , Y10T29/53087 , Y10T29/53178
摘要： When plural board blocks formed in one board undergo sequential part-mountings at plural mounting stages, particular recognition points and recognition points in the board blocks target of a downstream mounting stage are recognized at an upstream mounting stage. Relative positional data of each recognition point of the board block with respect to the particular recognition points are thus obtained at the upstream mounting stage. At the mounting stage on downstream side, only the particular recognition points are recognized thereby detecting a whole position of the board. Based on the whole position and the relative positional data, a positional deviation of the board block at the mounting stage can be detected, so that repeated recognition of the same recognition points is avoided thereby shortening a total time of position recognition.
摘要翻译：当形成在一个板上的多个板块在多个安装阶段进行顺序的部分安装时，在上游安装阶段可以识别出在下游安装阶段的板块目标中的特定识别点和识别点。因此，在上游安装阶段获得板块相对于特定识别点的每个识别点的相对位置数据。在下游侧的安装阶段，仅识别特定的识别点，从而检测电路板的整体位置。基于整个位置和相对位置数据，可以检测安装台上的板块的位置偏差，从而避免对相同识别点的反复识别，从而缩短位置识别的总时间。

9. 发明授权

US06356352B1 Component mounter and mounting method 失效
标题翻译：组件安装器和安装方法
公开(公告)号：US06356352B1
公开(公告)日：2002-03-12
申请号：US09631039
申请日：2000-08-01
申请人： Hideki Sumi , Takahiro Noda , Kazuhiko Nakahara
发明人： Hideki Sumi , Takahiro Noda , Kazuhiko Nakahara
IPC分类号： G01B1114
CPC分类号： H05K13/04 , Y10T29/53 , Y10T29/53091 , Y10T29/53178
摘要： A component mounter which includes a component feeder carriage; mounting head having two or more suction nozzles for picking up a component from the feeder carriage; image capturing means for taking an image of each component held by the suction nozzles; and a recognizer for recognizing each component based on image data obtained by the image capturing means according to a mounting sequence of each component. Each component is immediately and individually mounted on a mounting target after recognition. This configuration allows to eliminate wasteful standby time, thus offering efficient component mounting.
摘要翻译：一种组件安装机，包括一个组件供料架; 安装头具有两个或更多个用于从供给器托架拾取部件的吸嘴; 用于拍摄由吸嘴保持的每个部件的图像的图像捕获装置; 以及识别器，用于根据每个组件的安装顺序，基于由图像捕获装置获得的图像数据来识别每个组件。识别后，每个组件立即并单独安装在安装目标上。该配置可以消除浪费的待机时间，从而提供高效的部件安装。

10. 发明授权

US08046907B2 Electronic component placement method 有权
标题翻译：电子元件放置方法
公开(公告)号：US08046907B2
公开(公告)日：2011-11-01
申请号：US11916473
申请日：2006-08-16
申请人： Hideki Sumi , Takahiro Noda
发明人： Hideki Sumi , Takahiro Noda
IPC分类号： B23P19/00
CPC分类号： H05K13/0452 , H05K13/0853 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/53174 , Y10T29/53178
摘要： In an electronic component placement method in which electronic components are picked up from a plurality of component supply sections which supply electronic components using a plurality of mounting heads which are provided corresponding to the respective component supply sections, and the electronic components are transferred and mounted on a substrate in a same placing stage, in performing the component transferring and mounting operations, head interference areas which constitute exclusive operating regions to which only the specified mounting heads are allowed to access are set for every placing turn. Due to such a constitution, in the component placement operation, it is possible to rationally set the accessible region without causing the interference of one mounting head with another mounting head thus shortening a placing tact time by excluding wasteful standby times of the mounting heads.
摘要翻译：在电子部件配置方法中，电子部件从使用与各部件供给部对应设置的多个安装头供给电子部件的多个部件供给部拾取，电子部件被传送并安装在在相同的放置台中的基板，在执行部件传送和安装操作时，对于每个放置转弯设置构成仅允许指定的安装头访问的专用操作区域的头部干涉区域。由于这样的结构，在部件配置动作中，可以合理地设定可接近区域而不会引起一个安装头与另一个安装头的干扰，从而通过排除安装头的浪费的待机时间来缩短放置时间。

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