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    • 1. 发明授权
    • Photoresists for visible light imaging
    • 用于可见光成像的光致抗蚀剂
    • US07354692B2
    • 2008-04-08
    • US11125971
    • 2005-05-09
    • Gregory BreytaDaniel Joseph DawsonCarl E. LarsonGregory Michael Wallraff
    • Gregory BreytaDaniel Joseph DawsonCarl E. LarsonGregory Michael Wallraff
    • G03F7/031G03F7/038G03F7/039
    • G03F7/0392G03F7/001G03F7/031G03F7/2004Y10S430/115Y10S430/127
    • A class of lithographic photoresist combinations is disclosed which is suitable for use with visible light and does not require a post-exposure bake step. The disclosed photoresists are preferably chemical amplification photoresists and contain a photosensitizer having the structure of formula (I): where Ar1 and Ar2 are independently selected from monocyclic aryl and monocyclic heteroaryl, R1 and R2 may be the same or different, and have the structure —X—R3 where X is O or S and R3 is C1-C6 hydrocarbyl or heteroatom-containing C1-C6 hydrocarbyl, and R4 and R5 are independently selected from the group consisting of hydrogen and —X—R3, or, if ortho to each other, may be taken together to form a five- or six-membered aromatic ring, with the proviso that any heteroatom contained within Ar1, Ar2, or R3 is O or S. The use of the disclosed photoresists, particularly for the manufacture of holographic diffraction gratings, is also disclosed.
    • 公开了一类光刻抗蚀剂组合物,其适用于可见光并且不需要曝光后烘烤步骤。 所公开的光致抗蚀剂优选是化学放大光致抗蚀剂,并含有具有式(I)结构的光敏剂:其中Ar 1和Ar 2独立地选自单环芳基和单环杂芳基 R 1和R 2可以相同或不同,并且具有结构-XR 3,其中X是O或S,R“ SUP> 3是C 1 -C 6烃基或含杂原子的C 1 -C 6 N >烃基,R 4和R 5独立地选自氢和-XR 3 O 3,或者如果各自的邻位 另一个可以一起形成五元或六元芳环,条件是含有Ar 1,Ar 2或R 0的任何杂原子 > 3 是O或S.还公开了所公开的光致抗蚀剂的使用,特别是用于制造全息衍射光栅。
    • 3. 发明授权
    • Composition for photoimaging
    • 光成像用组合物
    • US06180317B2
    • 2001-01-30
    • US07793889
    • 1991-11-18
    • Robert David AllenRichard Allen DayDonald Herman GlatzelWilliam Dinan HinsbergJohn Richard MertzDavid John RussellGregory Michael Wallraff
    • Robert David AllenRichard Allen DayDonald Herman GlatzelWilliam Dinan HinsbergJohn Richard MertzDavid John RussellGregory Michael Wallraff
    • G03C1725
    • G03F7/038
    • An improved photoimagable cationically polymerizable epoxy based coating material is provided, that is suitable for use on a variety of substrates including epoxy-glass laminate boards cured with dicyandiamide. The material includes an epoxy resin system consisting essentially of between about 10% and about 80% by weight of a polyol resin which is a condensation product of epichlorohydrin and bisphenol A having a molecular weight of between about 40,000 and 130,000; and between about 35% and 72% by weight of an epoxidized glycidyl ether of a brominated bisphenol A having a softening point of between about 60° C. and about 110° C. and a molecular weight of between about 600 and 2,500. Optionally, a third resin may be added to the resin system. To this resin system is added about 0.1 to about 15 parts by weight per 100 parts of resin of a cationic photoinitiator capable of initiating polymerization of said epoxidized resin system upon exposure to actinic radiation; the system being further characterized by having an absorbance of light in the 330 to 700 nm region of less than 0.1 for a 2.0 mil thick film. Optionally a photosensitizer such as perylene and its derivatives or anthracene and its derivatives may be added.
    • 提供了一种改进的可光成像的可阳离子聚合的环氧基涂料,适用于各种基材,包括用双氰胺固化的环氧玻璃层压板。 该材料包括基本上由约10重量%至约80重量%的多元醇树脂组成的环氧树脂体系,多元醇树脂是分子量为约40,000至130,000的表氯醇和双酚A的缩合产物; 和约35重量%至72重量%的软化点在约60℃至约110℃之间且分子量为约600至2,500之间的溴化双酚A的环氧化缩水甘油醚。 任选地,可以向树脂体系中加入第三树脂。 向该树脂体系中添加约0.1〜约15重量份/ 100份阳离子光引发剂的树脂,其能够在暴露于光化辐射下引发所述环氧化树脂体系的聚合; 该系统的特征还在于,对于2.0密耳厚的膜,在330至700nm区域中的光的吸光度小于0.1。 任选地,可加入光敏剂如苝及其衍生物或蒽及其衍生物。
    • 5. 发明授权
    • Composition for photoimaging
    • 光成像用组合物
    • US5747223A
    • 1998-05-05
    • US677230
    • 1996-07-09
    • Robert D. AllenRichard Allen DayDonald Herman GlatzelWilliam Dinan HinsbergJohn Richard MertzDavid John RussellGregory Michael Wallraff
    • Robert D. AllenRichard Allen DayDonald Herman GlatzelWilliam Dinan HinsbergJohn Richard MertzDavid John RussellGregory Michael Wallraff
    • G03C5/00G03F7/038H05K3/28
    • G03F7/038H05K3/287
    • An improved photoimagable cationically polymerizable epoxy based coating material is provided, that is suitable for use on a variety of substrates including epoxy-glass laminate boards cured with dicyandiamide. The material includes an epoxy resin system consisting essentially of between about 10% and about 80% by weight of a polyol resin which is a condensation product of epichlorohydrin and bisphenol A having a molecular weight of between about 40,000 and 130,000; and between about 35% and 72% by weight of an epoxidized glycidyl ether of a brominated bisphenol A having a softening point of between about 60.degree. C. and about 110.degree. C. and a molecular weight of between about 600 and 2,500. Optionally, a third resin may be added to the resin system. To this resin system is added about 0.1 to about 15 parts by weight per 100 parts of resin of a cationic photoinitiator capable of initiating polymerization of said epoxidized resin system upon exposure to actinic radiation; the system being further characterized by having an absorbance of light in the 330 to 700 nm region of less than 0.1 for a 2.0 mil thick film. Optionally a photosensitizer such as perylene and its derivatives or anthracene and its derivatives may be added.
    • 提供了一种改进的可光成像的可阳离子聚合的环氧基涂料,适用于各种基材,包括用双氰胺固化的环氧玻璃层压板。 该材料包括基本上由约10重量%至约80重量%的多元醇树脂组成的环氧树脂体系,多元醇树脂是分子量为约40,000至130,000的表氯醇和双酚A的缩合产物; 和约35重量%至72重量%的软化点为约60℃至约110℃,分子量为约600至2,500的溴化双酚A的环氧化缩水甘油醚。 任选地,可以向树脂体系中加入第三树脂。 向该树脂体系中添加约0.1〜约15重量份/ 100份阳离子光引发剂的树脂,其能够在暴露于光化辐射下引发所述环氧化树脂体系的聚合; 该系统的特征还在于,对于2.0密耳厚的膜,在330至700nm区域中的光的吸光度小于0.1。 任选地,可加入光敏剂如苝及其衍生物或蒽及其衍生物。