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1. 发明授权

US06178093B1 Information handling system with circuit assembly having holes filled with filler material 失效
标题翻译：具有电路组件的信息处理系统，其具有填充有填充材料的孔
公开(公告)号：US06178093B1
公开(公告)日：2001-01-23
申请号：US09033617
申请日：1998-03-03
申请人： Anilkumar Chinuprasad Bhatt , Donald Herman Glatzel , Allen F. Moring , Voya Rista Markovich , Kostas Papathomas , David John Russell
发明人： Anilkumar Chinuprasad Bhatt , Donald Herman Glatzel , Allen F. Moring , Voya Rista Markovich , Kostas Papathomas , David John Russell
IPC分类号： H05K111
CPC分类号： H05K3/4652 , H01L2224/48091 , H01L2224/73204 , H01L2924/12044 , H05K1/113 , H05K3/0023 , H05K3/0094 , H05K3/025 , H05K3/246 , H05K3/4069 , H05K3/429 , H05K3/4602 , H05K2201/0347 , H05K2201/0355 , H05K2201/092 , H05K2201/0959 , H05K2203/0191 , H05K2203/025 , H05K2203/0278 , H05K2203/0338 , H05K2203/0554 , Y10S428/901 , Y10T29/49126 , Y10T29/4913 , Y10T29/49139 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165 , Y10T428/24917 , Y10T428/24926 , Y10T428/24942 , Y10T428/249996 , H01L2924/00014 , H01L2924/00
摘要： An information handling system is provided which comprises: a metal enclosure; at least one circuit assembly positioned within said metal enclosure, said circuit assembly including a circuitized substrate having at least one dielectric interior layer including a first surface and at least one hole therein; means for providing electrical power to said circuitized substrate within said metal enclosure; a filler material, wherein said filler material substantially fills said at least one hole within said at least one dielectric interior layer; a first wiring layer positioned on said first surface of said at least one dielectric interior layer, wherein said first wiring layer substantially covers said at least one hole having said filler material therein, said first wiring layer assisting in retaining said filler material within said at least one hole in said at least one dielectric interior layer; a first dielectric photoresist layer positioned on said first wiring layer and on said first surface of said at least one dielectric interior layer, wherein said first dielectric photoresist layer also includes at least one hole therein, said filler material also substantially filling said at least one hole within said first dielectric photoresist layer; a second wiring layer positioned on said first dielectric photoresist layer; wherein said second wiring layer includes a plurality of conductive pads as part thereof; and at least one external component electrically coupled to said conductive pads of said second wiring layer.
摘要翻译：提供了一种信息处理系统，包括：金属外壳; 位于所述金属外壳内的至少一个电路组件，所述电路组件包括具有至少一个电介质内层的电路化基板，其包括第一表面和至少一个孔; 用于向所述金属外壳内的所述电路化基板提供电力的装置; 填充材料，其中所述填充材料基本上填充所述至少一个电介质内层中的所述至少一个孔; 位于所述至少一个电介质内层的所述第一表面上的第一布线层，其中所述第一布线层基本上覆盖其中具有所述填充材料的所述至少一个孔，所述第一布线层有助于将所述填充材料保持在所述至少一个在所述至少一个电介质内层中的一个孔; 位于所述第一布线层和所述至少一个电介质内层的所述第一表面上的第一电介质光致抗蚀剂层，其中所述第一电介质光致抗蚀剂层还包括至少一个孔，所述填充材料还基本上填充所述至少一个孔在所述第一电介质光致抗蚀剂层内; 位于所述第一电介质光致抗蚀剂层上的第二布线层; 其中所述第二布线层包括作为其一部分的多个导电焊盘; 以及电耦合到所述第二布线层的所述导电焊盘的至少一个外部部件。

2. 发明授权

US5665650A Method for manufacturing a high density electronic circuit assembly 失效
标题翻译：高密度电子电路组件的制造方法
公开(公告)号：US5665650A
公开(公告)日：1997-09-09
申请号：US675458
申请日：1996-05-30
申请人： John Matthew Lauffer , Donald Herman Glatzel , David John Russell
发明人： John Matthew Lauffer , Donald Herman Glatzel , David John Russell
IPC分类号： H01L21/48 , H01L23/498 , H05K1/11 , H05K3/00 , H05K3/28 , H05K3/40 , H05K3/46 , H01L21/60
CPC分类号： H01L21/4857 , H01L23/49894 , H05K1/113 , H05K3/0023 , H05K3/4652 , H05K3/4661 , H01L2924/0002 , H05K2201/0355 , H05K2201/09509 , H05K2201/0959 , H05K2203/1152 , H05K3/0094 , H05K3/28 , H05K3/4069
摘要： Photoimageable dielectric materials are coated on substrates, selectively exposed and developed, whereby small vias and interconnection openings are formed between adjacently spaced circuit layers. A conductive paste may be used to provide sequential layer interconnection and surface planarization. No adhesives are required in the manufacture of a circuit assembly having multiple circuit and dielectric layers, and the manufacturing method avoids the requirement for drilled through holes and blind vias.
摘要翻译：可光成像的电介质材料涂覆在基板上，选择性地暴露和显影，由此在相邻间隔开的电路层之间形成小通孔和互连开口。可以使用导电膏来提供顺序层互连和表面平坦化。在具有多个电路和电介质层的电路组件的制造中不需要粘合剂，并且制造方法避免了对钻孔和盲孔的要求。

3. 发明授权

US6022670A Process for high resolution photoimageable dielectric 失效
标题翻译：高分辨率可光成像电介质的工艺
公开(公告)号：US6022670A
公开(公告)日：2000-02-08
申请号：US48753
申请日：1998-03-26
申请人： David John Russell , Donald Herman Glatzel
发明人： David John Russell , Donald Herman Glatzel
IPC分类号： H01L21/48 , H01L23/498 , H05K3/00 , H05K3/46 , G03F7/00
CPC分类号： H05K3/4661 , H01L21/4857 , H01L23/49894 , H01L2924/0002 , H05K2203/1152 , H05K3/0023
摘要： A novel process for circuitizing a dielectric layer, particularly for adding wiring planes, which is employed in the fabrication of circuitized structures, that does not requiring drilling of vias, yet provides good adhesion of circuitization to dielectric layer. In its broadest sense the method comprises the following steps: a. providing: a substrate; a hydrophobic, uncured, photoimagable, dielectric film having a solvent content of from about 5 to 30%; metal foil; b. contacting the metal foil and the dielectric film so that a replicate image is formed in the dielectric film; c. disposing the dielectric film on the substrate either after step a or step b; d. etching the metal foil from the dielectric film after step c; e. after step d, photoimaging the dielectric film to form vias or through holes in the dielectric film; and then metallizing the film after step e, to provide circuitization atop the dielectric film. The invention also relates to the circuitized structures produce by the method.
摘要翻译：一种用于电路化电介质层的新颖方法，特别是用于添加用于制造电路化结构的布线平面的电介质层，其不需要钻孔，而是提供电介质层的良好粘合性。在最广泛的意义上，该方法包括以下步骤：a。提供：基材; 疏水的，未固化的，可光成像的介电膜，其溶剂含量为约5至30％; 金属箔 b。使金属箔和电介质膜接触，使得在电介质膜中形成复制图像; C。在步骤a或步骤b之后将电介质膜设置在衬底上; d。在步骤c之后从电介质膜上蚀刻金属箔; e。在步骤d之后，对电介质膜进行光成像以在电介质膜中形成通孔或通孔; 然后在步骤e之后对膜进行金属化，以在电介质膜的顶部提供电路。本发明还涉及通过该方法产生的电路化结构。

4. 发明授权

US06576382B2 Composition for photoimaging 有权
标题翻译：光成像用组合物
公开(公告)号：US06576382B2
公开(公告)日：2003-06-10
申请号：US10142018
申请日：2002-05-09
申请人： Richard Allen Day , David John Russell , Donald Herman Glatzel
发明人： Richard Allen Day , David John Russell , Donald Herman Glatzel
IPC分类号： G03F7004
CPC分类号： C08G59/38 , C08G59/687 , G03F7/038 , G03F7/0385 , H05K3/287 , Y10S428/901
摘要： An improved photoimagable cationically polymerizable epoxy based solder mask is provided that contains a non-brominated epoxy resin system and from about 0.1 to about 15 parts, by weight per 100 parts of resin system, of a cationic photoinitiator. The non-brominated epoxy-resin system has solids that are comprised of from about 10% to about 80% by weight, of a polyol resin having epoxy functionality; from about 0% to about 90% by weight of a polyepoxy resin; and from about 25% to about 85% by weight of a difunctional epoxy resin. The photosensitive cationically polymerizable epoxy based system is especially useful as a solder mask and does not contain bromine.
摘要翻译：提供了一种改进的可光成像的可阳离子聚合的环氧基焊料掩模，其包含非溴化环氧树脂体系和每100份树脂体系约0.1至约15重量份的阳离子光引发剂。非溴化环氧树脂体系具有由约10重量％至约80重量％的具有环氧官能团的多元醇树脂组成的固体; 约0重量％至约90重量％的聚环氧树脂; 和约25重量％至约85重量％的双官能环氧树脂。光敏阳离子聚合型环氧系统特别适用于焊接掩模，不含溴。

5. 发明授权

US06180317B2 Composition for photoimaging 失效
标题翻译：光成像用组合物
公开(公告)号：US06180317B2
公开(公告)日：2001-01-30
申请号：US07793889
申请日：1991-11-18
申请人： Robert David Allen , Richard Allen Day , Donald Herman Glatzel , William Dinan Hinsberg , John Richard Mertz , David John Russell , Gregory Michael Wallraff
发明人： Robert David Allen , Richard Allen Day , Donald Herman Glatzel , William Dinan Hinsberg , John Richard Mertz , David John Russell , Gregory Michael Wallraff
IPC分类号： G03C1725
CPC分类号： G03F7/038
摘要： An improved photoimagable cationically polymerizable epoxy based coating material is provided, that is suitable for use on a variety of substrates including epoxy-glass laminate boards cured with dicyandiamide. The material includes an epoxy resin system consisting essentially of between about 10% and about 80% by weight of a polyol resin which is a condensation product of epichlorohydrin and bisphenol A having a molecular weight of between about 40,000 and 130,000; and between about 35% and 72% by weight of an epoxidized glycidyl ether of a brominated bisphenol A having a softening point of between about 60° C. and about 110° C. and a molecular weight of between about 600 and 2,500. Optionally, a third resin may be added to the resin system. To this resin system is added about 0.1 to about 15 parts by weight per 100 parts of resin of a cationic photoinitiator capable of initiating polymerization of said epoxidized resin system upon exposure to actinic radiation; the system being further characterized by having an absorbance of light in the 330 to 700 nm region of less than 0.1 for a 2.0 mil thick film. Optionally a photosensitizer such as perylene and its derivatives or anthracene and its derivatives may be added.
摘要翻译：提供了一种改进的可光成像的可阳离子聚合的环氧基涂料，适用于各种基材，包括用双氰胺固化的环氧玻璃层压板。该材料包括基本上由约10重量％至约80重量％的多元醇树脂组成的环氧树脂体系，多元醇树脂是分子量为约40,000至130,000的表氯醇和双酚A的缩合产物; 和约35重量％至72重量％的软化点在约60℃至约110℃之间且分子量为约600至2,500之间的溴化双酚A的环氧化缩水甘油醚。任选地，可以向树脂体系中加入第三树脂。向该树脂体系中添加约0.1〜约15重量份/ 100份阳离子光引发剂的树脂，其能够在暴露于光化辐射下引发所述环氧化树脂体系的聚合; 该系统的特征还在于，对于2.0密耳厚的膜，在330至700nm区域中的光的吸光度小于0.1。任选地，可加入光敏剂如苝及其衍生物或蒽及其衍生物。

6. 发明授权

US6138350A Process for manufacturing a circuit board with filled holes 失效
标题翻译：用于制造具有填充孔的电路板的工艺
公开(公告)号：US6138350A
公开(公告)日：2000-10-31
申请号：US30587
申请日：1998-02-25
申请人： Anilkumar Chinuprasad Bhatt , Donald Herman Glatzel , Allen F. Moring , Voya Rista Markovich , Kostas Papathomas , David John Russell
发明人： Anilkumar Chinuprasad Bhatt , Donald Herman Glatzel , Allen F. Moring , Voya Rista Markovich , Kostas Papathomas , David John Russell
IPC分类号： H05K1/11 , H05K3/00 , H05K3/02 , H05K3/24 , H05K3/40 , H05K3/42 , H05K3/46 , H01K3/10
CPC分类号： H05K3/4652 , H05K1/113 , H05K3/4069 , H05K3/4602 , H01L2224/48091 , H01L2224/73204 , H01L2924/12044 , H05K2201/0347 , H05K2201/0355 , H05K2201/092 , H05K2201/0959 , H05K2203/0191 , H05K2203/025 , H05K2203/0278 , H05K2203/0338 , H05K2203/0554 , H05K3/0023 , H05K3/0094 , H05K3/025 , H05K3/246 , H05K3/429 , Y10S428/901 , Y10T29/49126 , Y10T29/4913 , Y10T29/49139 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165 , Y10T428/24917 , Y10T428/24926 , Y10T428/24942 , Y10T428/249996
摘要： A process for manufacturing circuit boards comprising providing a circuitized substrate having a dielectric surface, providing a peel apart structure including a metal layer and a peelable film, laminating the peel apart structure to the circuitized substrate with the metal layer positioned adjacent said dielectric surface, forming holes in the circuitized substrate through the peel apart structure, applying a filler material including an organic base to the peel apart structure, applying a sacrificial film onto the filler material, and applying sufficient heat and pressure to the sacrificial film to force the filler material into the holes to substantially fill the holes is provided.
摘要翻译：一种用于制造电路板的方法，包括提供具有电介质表面的电路化基板，提供包括金属层和可剥离膜的剥离结构，将剥离结构层压到电路化基板上，金属层位于邻近所述电介质表面，形成通过剥离结构在电路化基板中的孔，将包含有机基底的填充材料施加到剥离结构上，将牺牲膜施加到填充材料上，以及向牺牲膜施加足够的热和压力以迫使填充材料进入提供基本上填充孔的孔。

7. 发明授权

US5747223A Composition for photoimaging 失效
标题翻译：光成像用组合物
公开(公告)号：US5747223A
公开(公告)日：1998-05-05
申请号：US677230
申请日：1996-07-09
申请人： Robert D. Allen , Richard Allen Day , Donald Herman Glatzel , William Dinan Hinsberg , John Richard Mertz , David John Russell , Gregory Michael Wallraff
发明人： Robert D. Allen , Richard Allen Day , Donald Herman Glatzel , William Dinan Hinsberg , John Richard Mertz , David John Russell , Gregory Michael Wallraff
IPC分类号： G03C5/00 , G03F7/038 , H05K3/28
CPC分类号： G03F7/038 , H05K3/287
摘要： An improved photoimagable cationically polymerizable epoxy based coating material is provided, that is suitable for use on a variety of substrates including epoxy-glass laminate boards cured with dicyandiamide. The material includes an epoxy resin system consisting essentially of between about 10% and about 80% by weight of a polyol resin which is a condensation product of epichlorohydrin and bisphenol A having a molecular weight of between about 40,000 and 130,000; and between about 35% and 72% by weight of an epoxidized glycidyl ether of a brominated bisphenol A having a softening point of between about 60.degree. C. and about 110.degree. C. and a molecular weight of between about 600 and 2,500. Optionally, a third resin may be added to the resin system. To this resin system is added about 0.1 to about 15 parts by weight per 100 parts of resin of a cationic photoinitiator capable of initiating polymerization of said epoxidized resin system upon exposure to actinic radiation; the system being further characterized by having an absorbance of light in the 330 to 700 nm region of less than 0.1 for a 2.0 mil thick film. Optionally a photosensitizer such as perylene and its derivatives or anthracene and its derivatives may be added.
摘要翻译：提供了一种改进的可光成像的可阳离子聚合的环氧基涂料，适用于各种基材，包括用双氰胺固化的环氧玻璃层压板。该材料包括基本上由约10重量％至约80重量％的多元醇树脂组成的环氧树脂体系，多元醇树脂是分子量为约40,000至130,000的表氯醇和双酚A的缩合产物; 和约35重量％至72重量％的软化点为约60℃至约110℃，分子量为约600至2,500的溴化双酚A的环氧化缩水甘油醚。任选地，可以向树脂体系中加入第三树脂。向该树脂体系中添加约0.1〜约15重量份/ 100份阳离子光引发剂的树脂，其能够在暴露于光化辐射下引发所述环氧化树脂体系的聚合; 该系统的特征还在于，对于2.0密耳厚的膜，在330至700nm区域中的光的吸光度小于0.1。任选地，可加入光敏剂如苝及其衍生物或蒽及其衍生物。

8. 发明授权

US6114019A Circuit board assemblies having filled vias free from bleed-out 失效
标题翻译：电路板组件具有没有渗出的通孔
公开(公告)号：US6114019A
公开(公告)日：2000-09-05
申请号：US33456
申请日：1998-03-02
申请人： Anilkumar Chinuprasad Bhatt , Donald Herman Glatzel , Allen F. Moring , Voya Rista Markovich , Kostas Papathomas , David John Russell
发明人： Anilkumar Chinuprasad Bhatt , Donald Herman Glatzel , Allen F. Moring , Voya Rista Markovich , Kostas Papathomas , David John Russell
IPC分类号： H05K1/11 , H05K3/00 , H05K3/02 , H05K3/24 , H05K3/40 , H05K3/42 , H05K3/46 , B32B3/00
CPC分类号： H05K3/4652 , H05K1/113 , H05K3/4069 , H05K3/4602 , H01L2224/48091 , H01L2224/73204 , H01L2924/12044 , H05K2201/0347 , H05K2201/0355 , H05K2201/092 , H05K2201/0959 , H05K2203/0191 , H05K2203/025 , H05K2203/0278 , H05K2203/0338 , H05K2203/0554 , H05K3/0023 , H05K3/0094 , H05K3/025 , H05K3/246 , H05K3/429 , Y10S428/901 , Y10T29/49126 , Y10T29/4913 , Y10T29/49139 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165 , Y10T428/24917 , Y10T428/24926 , Y10T428/24942 , Y10T428/249996
摘要： A circuit assembly that includes a circuitized substrate having a dielectric interior layer with a first surface and at least one hole therein. A filler material substantially fills the hole within the dielectric interior layer. A first wiring layer is positioned on the first surface of the dielectric interior layer, wherein the first wiring layer substantially covers the hole and assists in retaining the filler material within the hole in the dielectric interior layer. A first dielectric photoresist layer is positioned on the first wiring layer and on the first surface of the dielectric interior layer. The first dielectric photoresist layer also includes at least one hole therein. The filler material also substantially fills the hole within the first dielectric photoresist layer. A second wiring layer is positioned on the first dielectric photoresist layer and includes a plurality of conductive pads as part thereof. At least one external component can be electrically coupled to the conductive pads of the second wiring layer.
摘要翻译：一种电路组件，其包括具有电介质内层的电路化衬底，其具有第一表面和至少一个孔。填充材料基本上填充电介质内层内的孔。第一布线层位于电介质内层的第一表面上，其中第一布线层基本上覆盖孔，并有助于将填料保持在电介质内层的孔内。第一电介质光致抗蚀剂层定位在第一布线层上和电介质内层的第一表面上。第一电介质光致抗蚀剂层还包括至少一个孔。填充材料还基本上填充第一介电光致抗蚀剂层内的孔。第二布线层位于第一电介质光致抗蚀剂层上，并且包括多个导电焊盘作为其一部分。至少一个外部部件可以电耦合到第二布线层的导电焊盘。

9. 发明授权

US5993945A Process for high resolution photoimageable dielectric 失效
公开(公告)号：US5993945A
公开(公告)日：1999-11-30
申请号：US853211
申请日：1997-05-08
申请人： David John Russell , Donald Herman Glatzel
发明人： David John Russell , Donald Herman Glatzel
IPC分类号： H01L21/48 , H01L23/498 , H05K1/11 , H05K3/00 , H05K3/28 , H05K3/40 , H05K3/46 , B32B3/00 , G03C3/00
CPC分类号： H01L21/4857 , H01L23/49894 , H05K1/113 , H05K3/0023 , H05K3/4652 , H05K3/4661 , H01L2924/0002 , H05K2201/0355 , H05K2201/09509 , H05K2201/0959 , H05K2203/1152 , H05K3/0094 , H05K3/28 , H05K3/4069 , Y10S428/901 , Y10T428/24917 , Y10T428/31529
摘要： A novel process for circuitizing a dielectric layer, particularly for adding wiring planes, which is employed in the fabrication of circuitized structures, that does not requiring drilling of vias, yet provides good adhesion of circuitization to dielectric layer. In its broadest sense the method comprises the following steps: a. providing: a substrate; a hydrophobic, uncured, photoimagable, dielectric film having a solvent content of from about 5 to 30%; metal foil; b. contacting the metal foil and the dielectric film so that a replicate image is formed in the dielectric film; c. disposing the dielectric film on the substrate either after step a or step b; d. etching the metal foil from the dielectric film after step c; e. after step d, photoimaging the dielectric film to form vias or through holes in the dielectric film; and then metallizing the film after step e, to provide circuitization atop the dielectric film. The invention also relates to the circuitized structures produce by the method.

10. 发明授权

US06210862B1 Composition for photoimaging 有权
标题翻译：光成像用组合物
公开(公告)号：US06210862B1
公开(公告)日：2001-04-03
申请号：US09150824
申请日：1998-09-10
申请人： Richard Allen Day , David John Russell , Donald Herman Glatzel
发明人： Richard Allen Day , David John Russell , Donald Herman Glatzel
IPC分类号： G03F7004
CPC分类号： C08G59/38 , C08G59/687 , G03F7/038 , G03F7/0385 , H05K3/287 , Y10S428/901
摘要： According to the present invention, an improved photoimagable cationically polymerizable epoxy based solder mask is provided that contains a non-brominated epoxy resin system and from about 0.1 to about 15 parts, by weight per 100 parts of resin system, of a cationic photoinitiator. The non-brominated epoxy-resin system has solids that are comprised of from about 10% to about 80% by weight, of a polyol resin having epoxy functionality; from about 0% to about 90% by weight of a polyepoxy resin; and from about 25% to about 85% by weight of an difunctional epoxy resin. Since the photosensitive cationically polymerizable epoxy based solder mask does not contain bromine, it is particularly advantageous halogens in waste processing chemicals or in incinerated scrap circuit boards are regulated by environmental concerns. The photosensitive cationically polymerizable non-brominated epoxy based solder mask has a glass transition temperature greater than about 100° C., preferably greater than about 110° C. The solder mask dries to a tack-free film; thus, artwork used in the photoimaging process will not stick to the dried soldermask film. The polyol resin which is a condensation product of epichlorohydrin and bisphenol A, has a weight average molecular weight of between about 40,000 and 130,000. The polyepoxy resin is an epoxidized multi-functional bisphenol A formaldehyde novolak resin having a weight average molecular weight of 4,000 to 10,000. The epoxidized diglycidyl ether of bisphenol A has two epoxide groups per molecule, a melting point of between about 80° C. and about 110° C. and a weight average molecular weight of between about 600 and 2,500. The invention also relates to a cationically polymerized solder mask.
摘要翻译：根据本发明，提供了一种改进的可光成像的可阳离子聚合的环氧基焊接掩模，其包含非溴化环氧树脂体系和每100份树脂体系约0.1至约15重量份的阳离子光引发剂。非溴化环氧树脂体系具有由约10重量％至约80重量％的具有环氧官能团的多元醇树脂组成的固体; 约0重量％至约90重量％的聚环氧树脂; 和约25重量％至约85重量％的双官能环氧树脂。由于光敏阳离子聚合型环氧基焊接掩模不含溴，所以特别有利的是废物处理化学品中的卤素或焚烧废料电路板中的卤素受到环境问题的限制。光敏阳离子聚合的非溴化环氧基焊料掩模具有大于约100℃，优选大于约110℃的玻璃化转变温度。焊料掩模干燥成无粘性膜; 因此，在光成像过程中使用的艺术品不会粘附在干燥的焊接膜上。作为表氯醇和双酚A的缩合物的多元醇树脂的重均分子量为约40,000〜130,000。聚环氧树脂是重均分子量为4000〜10000的环氧化多官能双酚A甲醛酚醛清漆树脂。双酚A的环氧化二缩水甘油醚每分子具有两个环氧基团，熔点在约80℃至约110℃之间，重均分子量约为600-2,500。本发明还涉及阳离子聚合的焊接掩模。

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