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1. 发明申请

US20130003308A1 POWER ELECTRONIC DEVICE HAVING HIGH HEAT DISSIPATION AND STABILITY 有权
标题翻译：具有高热量消耗和稳定性的电力电子设备
公开(公告)号：US20130003308A1
公开(公告)日：2013-01-03
申请号：US13534201
申请日：2012-06-27
申请人： Cristiano Gianluca Stella
发明人： Cristiano Gianluca Stella
IPC分类号： H05K7/20
CPC分类号： H01L23/4334 , H01L23/3672 , H01L23/49562 , H01L23/49575 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： An insulating body embeds at least one integrated circuit chip and a first and second exposed heat sink exposed on a free surface opposite a mounting surface of the body. An external heat-sink extends above the free surface. The external heat-sink includes a first dissipative portion and a second dissipative portion for contacting the first and second heat-sinks on the free surface, respectively, as well as an insulating portion for electrically insulating the first dissipative portion from the second dissipative portion. The first dissipative portion and the second dissipative portion are symmetrical with respect to the insulating portion. An extension of the external heat-sink may provide a stabilizing element. The extension of the external heat-sink may alternatively thermally and electrically interconnect two insulating bodies, each body embedding at least one integrated circuit chip.
摘要翻译：绝缘体嵌入至少一个集成电路芯片和暴露在与主体的安装表面相对的自由表面上的第一和第二暴露的散热器。外部散热器在自由表面上方延伸。外部散热器包括分别与自由表面上的第一和第二散热器接触的第一耗散部分和第二耗散部分，以及用于将第一耗散部分与第二耗散部分电绝缘的绝缘部分。第一耗散部分和第二耗散部分相对于绝缘部分是对称的。外部散热器的延伸可以提供稳定元件。外部散热器的延伸可替代地热和电互连两个绝缘体，每个主体嵌入至少一个集成电路芯片。

2. 发明申请

US20120014057A1 INTEGRATED POWER ADAPTER SYSTEM FOR PORTABLE COMPUTERS 有权
标题翻译：用于便携式计算机的集成电源适配器系统
公开(公告)号：US20120014057A1
公开(公告)日：2012-01-19
申请号：US13184761
申请日：2011-07-18
申请人： Cristiano Gianluca STELLA , Giuseppe Consentino
发明人： Cristiano Gianluca STELLA , Giuseppe Consentino
IPC分类号： H05K7/00 , H05K13/00
CPC分类号： G06F1/1637 , G06F1/1635 , Y10T29/49002
摘要： An integrated power adapter system for a portable computer may include a power adapter for providing power to the portable computer, extractable elements for connection to an external socket, and a dissipation grid for reducing the temperature of the cover screen. The power adapter system may be a slim power adapter system being removable from and integrated with the cover screen of the portable computer.
摘要翻译：用于便携式计算机的集成电力适配器系统可以包括用于向便携式计算机提供电力的电力适配器，用于连接到外部插座的可抽出元件以及用于降低盖屏幕的温度的耗散栅格。电源适配器系统可以是可移动并且与便携式计算机的盖屏幕集成的细长电源适配器系统。

3. 发明授权

US09275943B2 Power device having reduced thickness 有权
标题翻译：功率器件具有减小的厚度
公开(公告)号：US09275943B2
公开(公告)日：2016-03-01
申请号：US13535636
申请日：2012-06-28
申请人： Cristiano Gianluca Stella , Agatino Carmelo Minotti
发明人： Cristiano Gianluca Stella , Agatino Carmelo Minotti
IPC分类号： H01L23/34 , H01L23/495 , H01L23/433 , H01L23/31
CPC分类号： H01L21/52 , H01L21/56 , H01L23/3107 , H01L23/3114 , H01L23/3675 , H01L23/4334 , H01L23/49524 , H01L23/49562 , H01L2224/32245 , H01L2924/1301 , H01L2924/13055 , H01L2924/13062 , H01L2924/13091 , H01L2924/00
摘要： An electronic device includes at least one chip and an insulating body embedding the chip. The electronic device further includes a heat-sink in contact with the chip. The heat-sink includes a plate having a first thickness. A recess is provided in the plate that defines a central portion of the plate having a second thickness less than the first thickness. The chip is mounted to the central region of the heat-sink within the recess. The insulating body includes a surface, such as a mounting surface, including an opening exposing at least a portion of the heat-sink. The device may further include a reophore extending through a side surface of the insulating body, that reophore being in contact with the heat sink.
摘要翻译：电子设备包括至少一个芯片和嵌入芯片的绝缘体。电子设备还包括与芯片接触的散热器。散热器包括具有第一厚度的板。在板中设置有限定板的中心部分的凹部，其具有小于第一厚度的第二厚度。芯片安装在凹槽内的散热器的中心区域。绝缘体包括诸如安装表面的表面，其包括露出散热器的至少一部分的开口。该装置还可以包括延伸穿过绝缘体的侧表面的再浮标，该再浮标与散热器接触。

4. 发明授权

US09105598B2 Package/heatsink system for electronic device 有权
标题翻译：用于电子设备的封装/散热系统
公开(公告)号：US09105598B2
公开(公告)日：2015-08-11
申请号：US13537166
申请日：2012-06-29
申请人： Cristiano Gianluca Stella , Concetto Privitera
发明人： Cristiano Gianluca Stella , Concetto Privitera
IPC分类号： H05K7/20 , H01L23/367 , H01L23/40 , H01L23/36
CPC分类号： H01L23/3672 , H01L23/36 , H01L23/3677 , H01L23/40 , H01L2924/0002 , Y10T29/4913 , H01L2924/00
摘要： An insulating body embeds an integrated circuit and has a mounting surface, an opposite free surface, and at least one pin exposed along an edge of the mounting surface and electrically connected to a terminal of the integrated circuit. A heatsink configured to dissipate heat produced by the integrated circuit is provided in correspondence of the free surface. The heatsink includes at least one protruding element including a connection portion partly extending in contact with the free surface and partly protruding beyond a boundary of the free surface (the connection portion having a free end being distal from the insulating body), and a mounting portion extending from the free end at least up to a plane of the mounting surface. The heatsink is further electrically connected to a terminal of the integrated circuit chip. The protruding element is placed in correspondence of the at least one pin.
摘要翻译：绝缘体嵌入集成电路并且具有安装表面，相对的自由表面和沿安装表面的边缘暴露的至少一个销并且电连接到集成电路的端子。配置为散发由集成电路产生的热量的散热器对应于自由表面提供。散热器包括至少一个突出元件，该突出元件包括部分地与自由表面接触地延伸并且部分地突出超过自由表面的边界的连接部分（具有远离绝缘体的自由端的连接部分），以及安装部分从自由端至少延伸到安装表面的平面。散热器进一步电连接到集成电路芯片的端子。突出元件被放置成对应于至少一个销。

5. 发明申请

US20130001764A1 POWER DEVICE HAVING REDUCED THICKNESS 有权
标题翻译：具有减小厚度的电力设备
公开(公告)号：US20130001764A1
公开(公告)日：2013-01-03
申请号：US13535636
申请日：2012-06-28
申请人： Cristiano Gianluca Stella , Agatino Carmelo Minotti
发明人： Cristiano Gianluca Stella , Agatino Carmelo Minotti
IPC分类号： H01L23/34 , H01L21/50
CPC分类号： H01L21/52 , H01L21/56 , H01L23/3107 , H01L23/3114 , H01L23/3675 , H01L23/4334 , H01L23/49524 , H01L23/49562 , H01L2224/32245 , H01L2924/1301 , H01L2924/13055 , H01L2924/13062 , H01L2924/13091 , H01L2924/00
摘要： An electronic device includes at least one chip and an insulating body embedding the chip. The electronic device further includes a heat-sink in contact with the chip. The heat-sink includes a plate having a first thickness. A recess is provided in the plate that defines a central portion of the plate having a second thickness less than the first thickness. The chip is mounted to the central region of the heat-sink within the recess. The insulating body includes a surface, such as a mounting surface, including an opening exposing at least a portion of the heat-sink. The device may further include a reophore extending through a side surface of the insulating body, that reophore being in contact with the heat sink.
摘要翻译：电子设备包括至少一个芯片和嵌入芯片的绝缘体。电子设备还包括与芯片接触的散热器。散热器包括具有第一厚度的板。在板中设置有限定板的中心部分的凹部，其具有小于第一厚度的第二厚度。芯片安装在凹槽内的散热器的中心区域。绝缘体包括诸如安装表面的表面，其包括露出散热器的至少一部分的开口。该装置还可以包括延伸穿过绝缘体的侧表面的再浮标，该再浮标与散热器接触。

6. 发明授权

US08817475B2 System with shared heatsink 有权
标题翻译：具有共享散热器的系统
公开(公告)号：US08817475B2
公开(公告)日：2014-08-26
申请号：US13537812
申请日：2012-06-29
申请人： Concetto Privitera , Cristiano Gianluca Stella
发明人： Concetto Privitera , Cristiano Gianluca Stella
IPC分类号： H05K7/20 , H01L23/367 , H01L23/36 , H01L23/40
CPC分类号： H01L23/36 , H01L23/3672 , H01L23/40 , H01L2924/0002 , Y10T29/49826 , H01L2924/00
摘要： First and second electronic devices each include an insulating package embedding a chip of semiconductor material which integrates at least one electronic component. Each insulating package has a mounting surface for mounting the respective electronic device on a substrate and an opposite free surface. A heatsink is fixed to the free surfaces through respective first and second base portions. A connection element is configured to connect the first base portion to the second base portion. The heatsink also includes, for each electronic device, at least one stabilizing element extending from the respective base portion to make contact with a substrate to which the mounting surfaces of the first and second electronic devices are attached.
摘要翻译：第一和第二电子器件各自包括嵌入集成至少一个电子部件的半导体材料芯片的绝缘封装。每个绝缘封装具有用于将相应的电子器件安装在衬底和相对的自由表面上的安装表面。散热器通过相应的第一和第二基部固定到自由表面。连接元件构造成将第一基部连接到第二基部。对于每个电子设备，散热器还包括至少一个稳定元件，该稳定元件从相应的基部延伸以与第一和第二电子设备的安装表面附接到的基板接触。

7. 发明申请

US20130003311A1 SYSTEM WITH SHARED HEATSINK 有权
标题翻译：具有共享散热器的系统
公开(公告)号：US20130003311A1
公开(公告)日：2013-01-03
申请号：US13537812
申请日：2012-06-29
申请人： Concetto Privitera , Cristiano Gianluca Stella
发明人： Concetto Privitera , Cristiano Gianluca Stella
IPC分类号： H05K7/20 , B23P19/04
CPC分类号： H01L23/36 , H01L23/3672 , H01L23/40 , H01L2924/0002 , Y10T29/49826 , H01L2924/00
摘要： First and second electronic devices each include an insulating package embedding a chip of semiconductor material which integrates at least one electronic component. Each insulating package has a mounting surface for mounting the respective electronic device on a substrate and an opposite free surface. A heatsink is fixed to the free surfaces through respective first and second base portions. A connection element is configured to connect the first base portion to the second base portion. The heatsink also includes, for each electronic device, at least one stabilizing element extending from the respective base portion to make contact with a substrate to which the mounting surfaces of the first and second electronic devices are attached.
摘要翻译：第一和第二电子器件各自包括嵌入集成至少一个电子部件的半导体材料芯片的绝缘封装。每个绝缘封装具有用于将相应的电子器件安装在衬底和相对的自由表面上的安装表面。散热器通过相应的第一和第二基部固定到自由表面。连接元件构造成将第一基部连接到第二基部。对于每个电子设备，散热器还包括至少一个稳定元件，该稳定元件从相应的基部延伸以与第一和第二电子设备的安装表面附接到的基板接触。

8. 发明申请

US20080271812A1 ROTARY FILLING MACHINE FOR FILLING CONTAINERS WITH LIQUIDS 审中-公开
标题翻译：旋转式灌装机，用于充满液体的容器
公开(公告)号：US20080271812A1
公开(公告)日：2008-11-06
申请号：US12061473
申请日：2008-04-02
申请人： Stefano Stefanello , Dario Benetti , Gianluca Stella
发明人： Stefano Stefanello , Dario Benetti , Gianluca Stella
IPC分类号： B65B3/32 , B65B31/04
CPC分类号： B67C3/262 , B67C3/004 , B67C3/2637 , B67C2003/2651 , B67C2003/2668
摘要： Rotary filling machine for filling containers with liquids, which comprises a rotating carousel (4) having, mounted along its periphery, a plurality of filling valves (6). Each filling valve (6) has an outer pipe (7) for supplying the liquid from a storage tank (20) to a container (30) to be filled with said liquid, and an inner compensation pipe (8) for defining the liquid level inside said container (3) mounted concentrically with the outer pipe (7). Actuator means are envisaged for each filling valve (6) and, by means of transmission means (101), vary simultaneously and in an adjustable manner the vertical position of the compensation pipes (8) of all the filling valves (6) with respect to the position of a seal (13) mounted underneath the tank (20) so as to receive against it the mouth of the containers (3).
摘要翻译：旋转式灌装机，用于向液体填充容器，该旋转式灌装机包括沿其周边安装有多个填充阀（6）的旋转转盘（4）。每个灌装阀（6）具有用于将液体从储罐（20）供应到容器（30）以填充所述液体的外管（7）和用于限定液位的内补偿管（8）在与外管（7）同心安装的容器（3）内。对于每个灌装阀（6）设想致动器装置，并且借助于传动装置（101），可同时且以可调节的方式改变所有填充阀（6）的补偿管（8）相对于安装在罐（20）下方以便容纳容器（3）的口部的密封件（13）的位置。

9. 发明申请

US20150236745A1 HOUSING SYSTEM FOR PORTABLE ELECTRONIC DEVICES AND RELATED ACCESSORIES 审中-公开
标题翻译：便携式电子设备的住房系统及相关附件
公开(公告)号：US20150236745A1
公开(公告)日：2015-08-20
申请号：US14430180
申请日：2013-09-20
申请人： Andrea TRANCHIDA , Cristiano Gianluca STELLA
发明人： Andrea Tranchida , Cristiano Gianluca Stella
IPC分类号： H04B1/3888 , H04R1/10
CPC分类号： H04B1/3888 , A45C11/00 , A45C2011/001 , A45C2011/002 , A45C2011/003 , G06F1/1628 , G06F1/1632 , H04R1/1033
摘要： A system includes a housing for a portable electronic device and a housing dedicated to house a winding mechanism for an earphone cable. The winding mechanism comprises a hollow base element, a cover element, a central sliding element, a spring, and a groove. The base element centrally includes a protrusion and the cover element has a base with a central hole corresponding to the protrusion and configured to allow exit of a first portion of the cable. The sliding element allows sliding of the cable and includes a base with a central hole between the base element and the covering element to form a pocket in which second and third portions of the cable are wrapped. The second portion is wrapped around the edge of the sliding element and the third portion is fixed inside the sliding element between a first hole and a second hole in the groove.
摘要翻译：一种系统包括用于便携式电子设备的壳体和专用于容纳用于耳机线缆的绕线机构的壳体。卷绕机构包括中空基座元件，盖元件，中心滑动元件，弹簧和凹槽。所述基座元件集中地包括突起，并且所述盖元件具有基部，所述基部具有与所述突起对应的中心孔并且被配置为允许所述电缆的第一部分的退出。滑动元件允许电缆滑动并且包括具有位于基座元件和覆盖元件之间的中心孔的底座，以形成一个口袋，其中电缆的第二和第三部分被包裹。第二部分缠绕在滑动元件的边缘上，并且第三部分固定在滑动元件内部的凹槽中的第一孔和第二孔之间。

10. 发明授权

US08837154B2 System with stabilized heatsink 有权
标题翻译：具有稳定散热器的系统
公开(公告)号：US08837154B2
公开(公告)日：2014-09-16
申请号：US13537242
申请日：2012-06-29
申请人： Cristiano Gianluca Stella , Concetto Privitera
发明人： Cristiano Gianluca Stella , Concetto Privitera
IPC分类号： H05K7/20 , H01L23/367 , H01L23/40
CPC分类号： H01L23/3672 , H01L23/40 , H01L2924/0002 , H01L2924/00
摘要： An insulating body incorporates at least one integrated circuit chip and includes a mounting surface for mounting to a board and a free surface opposite the mounting surface. A heatsink is attached to the insulating body at the free surface. The heatsink includes at least one stabilizing element. The stabilizing element includes an attachment portion extending at least partially transversely to the free surface beyond a peripheral boundary of the free surface when considered in plan view. The attachment portion has a binding end bound to the free surface and a free end opposite the binding end. The stabilizing element also has a mounting portion extending from the free end of the attachment portion at least up to a plane of the mounting surface.
摘要翻译：绝缘体包括至少一个集成电路芯片，并且包括用于安装到板的安装表面和与安装表面相对的自由表面。散热片在自由表面附着在绝缘体上。散热器包括至少一个稳定元件。稳定元件包括在平面图中考虑时至少部分地横向于自由表面延伸超过自由表面的周边边界的附接部分。附接部分具有结合自由表面的结合端和与结合端相对的自由端。稳定元件还具有从附接部分的自由端至少延伸到安装表面的平面的安装部分。

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