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1. 发明授权

US09105598B2 Package/heatsink system for electronic device 有权
标题翻译：用于电子设备的封装/散热系统
公开(公告)号：US09105598B2
公开(公告)日：2015-08-11
申请号：US13537166
申请日：2012-06-29
申请人： Cristiano Gianluca Stella , Concetto Privitera
发明人： Cristiano Gianluca Stella , Concetto Privitera
IPC分类号： H05K7/20 , H01L23/367 , H01L23/40 , H01L23/36
CPC分类号： H01L23/3672 , H01L23/36 , H01L23/3677 , H01L23/40 , H01L2924/0002 , Y10T29/4913 , H01L2924/00
摘要： An insulating body embeds an integrated circuit and has a mounting surface, an opposite free surface, and at least one pin exposed along an edge of the mounting surface and electrically connected to a terminal of the integrated circuit. A heatsink configured to dissipate heat produced by the integrated circuit is provided in correspondence of the free surface. The heatsink includes at least one protruding element including a connection portion partly extending in contact with the free surface and partly protruding beyond a boundary of the free surface (the connection portion having a free end being distal from the insulating body), and a mounting portion extending from the free end at least up to a plane of the mounting surface. The heatsink is further electrically connected to a terminal of the integrated circuit chip. The protruding element is placed in correspondence of the at least one pin.
摘要翻译：绝缘体嵌入集成电路并且具有安装表面，相对的自由表面和沿安装表面的边缘暴露的至少一个销并且电连接到集成电路的端子。配置为散发由集成电路产生的热量的散热器对应于自由表面提供。散热器包括至少一个突出元件，该突出元件包括部分地与自由表面接触地延伸并且部分地突出超过自由表面的边界的连接部分（具有远离绝缘体的自由端的连接部分），以及安装部分从自由端至少延伸到安装表面的平面。散热器进一步电连接到集成电路芯片的端子。突出元件被放置成对应于至少一个销。

2. 发明授权

US08817475B2 System with shared heatsink 有权
标题翻译：具有共享散热器的系统
公开(公告)号：US08817475B2
公开(公告)日：2014-08-26
申请号：US13537812
申请日：2012-06-29
申请人： Concetto Privitera , Cristiano Gianluca Stella
发明人： Concetto Privitera , Cristiano Gianluca Stella
IPC分类号： H05K7/20 , H01L23/367 , H01L23/36 , H01L23/40
CPC分类号： H01L23/36 , H01L23/3672 , H01L23/40 , H01L2924/0002 , Y10T29/49826 , H01L2924/00
摘要： First and second electronic devices each include an insulating package embedding a chip of semiconductor material which integrates at least one electronic component. Each insulating package has a mounting surface for mounting the respective electronic device on a substrate and an opposite free surface. A heatsink is fixed to the free surfaces through respective first and second base portions. A connection element is configured to connect the first base portion to the second base portion. The heatsink also includes, for each electronic device, at least one stabilizing element extending from the respective base portion to make contact with a substrate to which the mounting surfaces of the first and second electronic devices are attached.
摘要翻译：第一和第二电子器件各自包括嵌入集成至少一个电子部件的半导体材料芯片的绝缘封装。每个绝缘封装具有用于将相应的电子器件安装在衬底和相对的自由表面上的安装表面。散热器通过相应的第一和第二基部固定到自由表面。连接元件构造成将第一基部连接到第二基部。对于每个电子设备，散热器还包括至少一个稳定元件，该稳定元件从相应的基部延伸以与第一和第二电子设备的安装表面附接到的基板接触。

3. 发明申请

US20130003311A1 SYSTEM WITH SHARED HEATSINK 有权
标题翻译：具有共享散热器的系统
公开(公告)号：US20130003311A1
公开(公告)日：2013-01-03
申请号：US13537812
申请日：2012-06-29
申请人： Concetto Privitera , Cristiano Gianluca Stella
发明人： Concetto Privitera , Cristiano Gianluca Stella
IPC分类号： H05K7/20 , B23P19/04
CPC分类号： H01L23/36 , H01L23/3672 , H01L23/40 , H01L2924/0002 , Y10T29/49826 , H01L2924/00
摘要： First and second electronic devices each include an insulating package embedding a chip of semiconductor material which integrates at least one electronic component. Each insulating package has a mounting surface for mounting the respective electronic device on a substrate and an opposite free surface. A heatsink is fixed to the free surfaces through respective first and second base portions. A connection element is configured to connect the first base portion to the second base portion. The heatsink also includes, for each electronic device, at least one stabilizing element extending from the respective base portion to make contact with a substrate to which the mounting surfaces of the first and second electronic devices are attached.
摘要翻译：第一和第二电子器件各自包括嵌入集成至少一个电子部件的半导体材料芯片的绝缘封装。每个绝缘封装具有用于将相应的电子器件安装在衬底和相对的自由表面上的安装表面。散热器通过相应的第一和第二基部固定到自由表面。连接元件构造成将第一基部连接到第二基部。对于每个电子设备，散热器还包括至少一个稳定元件，该稳定元件从相应的基部延伸以与第一和第二电子设备的安装表面附接到的基板接触。

4. 发明授权

US08837154B2 System with stabilized heatsink 有权
标题翻译：具有稳定散热器的系统
公开(公告)号：US08837154B2
公开(公告)日：2014-09-16
申请号：US13537242
申请日：2012-06-29
申请人： Cristiano Gianluca Stella , Concetto Privitera
发明人： Cristiano Gianluca Stella , Concetto Privitera
IPC分类号： H05K7/20 , H01L23/367 , H01L23/40
CPC分类号： H01L23/3672 , H01L23/40 , H01L2924/0002 , H01L2924/00
摘要： An insulating body incorporates at least one integrated circuit chip and includes a mounting surface for mounting to a board and a free surface opposite the mounting surface. A heatsink is attached to the insulating body at the free surface. The heatsink includes at least one stabilizing element. The stabilizing element includes an attachment portion extending at least partially transversely to the free surface beyond a peripheral boundary of the free surface when considered in plan view. The attachment portion has a binding end bound to the free surface and a free end opposite the binding end. The stabilizing element also has a mounting portion extending from the free end of the attachment portion at least up to a plane of the mounting surface.
摘要翻译：绝缘体包括至少一个集成电路芯片，并且包括用于安装到板的安装表面和与安装表面相对的自由表面。散热片在自由表面附着在绝缘体上。散热器包括至少一个稳定元件。稳定元件包括在平面图中考虑时至少部分地横向于自由表面延伸超过自由表面的周边边界的附接部分。附接部分具有结合自由表面的结合端和与结合端相对的自由端。稳定元件还具有从附接部分的自由端至少延伸到安装表面的平面的安装部分。

5. 发明申请

US20130003313A1 SYSTEM WITH STABILIZED HEATSINK 有权
标题翻译：具有稳定热源的系统
公开(公告)号：US20130003313A1
公开(公告)日：2013-01-03
申请号：US13537242
申请日：2012-06-29
申请人： Cristiano Gianluca Stella , Concetto Privitera
发明人： Cristiano Gianluca Stella , Concetto Privitera
IPC分类号： H05K7/20
CPC分类号： H01L23/3672 , H01L23/40 , H01L2924/0002 , H01L2924/00
摘要： An insulating body incorporates at least one integrated circuit chip and includes a mounting surface for mounting to a board and a free surface opposite the mounting surface. A heatsink is attached to the insulating body at the free surface. The heatsink includes at least one stabilizing element. The stabilizing element includes an attachment portion extending at least partially transversely to the free surface beyond a peripheral boundary of the free surface when considered in plan view. The attachment portion has a binding end bound to the free surface and a free end opposite the binding end. The stabilizing element also has a mounting portion extending from the free end of the attachment portion at least up to a plane of the mounting surface.
摘要翻译：绝缘体包括至少一个集成电路芯片，并且包括用于安装到板的安装表面和与安装表面相对的自由表面。散热片在自由表面附着在绝缘体上。散热器包括至少一个稳定元件。稳定元件包括在平面图中考虑时至少部分地横向于自由表面延伸超过自由表面的周边边界的附接部分。附接部分具有结合自由表面的结合端和与结合端相对的自由端。稳定元件还具有从附接部分的自由端至少延伸到安装表面的平面的安装部分。

6. 发明申请

US20130003312A1 PACKAGE/HEATSINK SYSTEM FOR ELECTRONIC DEVICE 有权
标题翻译：用于电子设备的封装/散热系统
公开(公告)号：US20130003312A1
公开(公告)日：2013-01-03
申请号：US13537166
申请日：2012-06-29
申请人： Cristiano Gianluca Stella , Concetto Privitera
发明人： Cristiano Gianluca Stella , Concetto Privitera
IPC分类号： H05K7/20 , H05K3/30
CPC分类号： H01L23/3672 , H01L23/36 , H01L23/3677 , H01L23/40 , H01L2924/0002 , Y10T29/4913 , H01L2924/00
摘要： An insulating body embeds an integrated circuit and has a mounting surface, an opposite free surface, and at least one pin exposed along an edge of the mounting surface and electrically connected to a terminal of the integrated circuit. A heatsink configured to dissipate heat produced by the integrated circuit is provided in correspondence of the free surface. The heatsink includes at least one protruding element including a connection portion partly extending in contact with the free surface and partly protruding beyond a boundary of the free surface (the connection portion having a free end being distal from the insulating body), and a mounting portion extending from the free end at least up to a plane of the mounting surface. The heatsink is further electrically connected to a terminal of the integrated circuit chip. The protruding element is placed in correspondence of the at least one pin.
摘要翻译：绝缘体嵌入集成电路并且具有安装表面，相对的自由表面和沿安装表面的边缘暴露的至少一个销并且电连接到集成电路的端子。配置为散发由集成电路产生的热量的散热器对应于自由表面提供。散热器包括至少一个突出元件，该突出元件包括部分地与自由表面接触地延伸并且部分地突出超过自由表面的边界的连接部分（具有远离绝缘体的自由端的连接部分），以及安装部分从自由端至少延伸到安装表面的平面。散热器进一步电连接到集成电路芯片的端子。突出元件被放置成对应于至少一个销。

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