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1. 发明申请

US20130003308A1 POWER ELECTRONIC DEVICE HAVING HIGH HEAT DISSIPATION AND STABILITY 有权
标题翻译：具有高热量消耗和稳定性的电力电子设备
公开(公告)号：US20130003308A1
公开(公告)日：2013-01-03
申请号：US13534201
申请日：2012-06-27
申请人： Cristiano Gianluca Stella
发明人： Cristiano Gianluca Stella
IPC分类号： H05K7/20
CPC分类号： H01L23/4334 , H01L23/3672 , H01L23/49562 , H01L23/49575 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： An insulating body embeds at least one integrated circuit chip and a first and second exposed heat sink exposed on a free surface opposite a mounting surface of the body. An external heat-sink extends above the free surface. The external heat-sink includes a first dissipative portion and a second dissipative portion for contacting the first and second heat-sinks on the free surface, respectively, as well as an insulating portion for electrically insulating the first dissipative portion from the second dissipative portion. The first dissipative portion and the second dissipative portion are symmetrical with respect to the insulating portion. An extension of the external heat-sink may provide a stabilizing element. The extension of the external heat-sink may alternatively thermally and electrically interconnect two insulating bodies, each body embedding at least one integrated circuit chip.
摘要翻译：绝缘体嵌入至少一个集成电路芯片和暴露在与主体的安装表面相对的自由表面上的第一和第二暴露的散热器。外部散热器在自由表面上方延伸。外部散热器包括分别与自由表面上的第一和第二散热器接触的第一耗散部分和第二耗散部分，以及用于将第一耗散部分与第二耗散部分电绝缘的绝缘部分。第一耗散部分和第二耗散部分相对于绝缘部分是对称的。外部散热器的延伸可以提供稳定元件。外部散热器的延伸可替代地热和电互连两个绝缘体，每个主体嵌入至少一个集成电路芯片。

2. 发明申请

US20120014057A1 INTEGRATED POWER ADAPTER SYSTEM FOR PORTABLE COMPUTERS 有权
标题翻译：用于便携式计算机的集成电源适配器系统
公开(公告)号：US20120014057A1
公开(公告)日：2012-01-19
申请号：US13184761
申请日：2011-07-18
申请人： Cristiano Gianluca STELLA , Giuseppe Consentino
发明人： Cristiano Gianluca STELLA , Giuseppe Consentino
IPC分类号： H05K7/00 , H05K13/00
CPC分类号： G06F1/1637 , G06F1/1635 , Y10T29/49002
摘要： An integrated power adapter system for a portable computer may include a power adapter for providing power to the portable computer, extractable elements for connection to an external socket, and a dissipation grid for reducing the temperature of the cover screen. The power adapter system may be a slim power adapter system being removable from and integrated with the cover screen of the portable computer.
摘要翻译：用于便携式计算机的集成电力适配器系统可以包括用于向便携式计算机提供电力的电力适配器，用于连接到外部插座的可抽出元件以及用于降低盖屏幕的温度的耗散栅格。电源适配器系统可以是可移动并且与便携式计算机的盖屏幕集成的细长电源适配器系统。

3. 发明授权

US09275943B2 Power device having reduced thickness 有权
标题翻译：功率器件具有减小的厚度
公开(公告)号：US09275943B2
公开(公告)日：2016-03-01
申请号：US13535636
申请日：2012-06-28
申请人： Cristiano Gianluca Stella , Agatino Carmelo Minotti
发明人： Cristiano Gianluca Stella , Agatino Carmelo Minotti
IPC分类号： H01L23/34 , H01L23/495 , H01L23/433 , H01L23/31
CPC分类号： H01L21/52 , H01L21/56 , H01L23/3107 , H01L23/3114 , H01L23/3675 , H01L23/4334 , H01L23/49524 , H01L23/49562 , H01L2224/32245 , H01L2924/1301 , H01L2924/13055 , H01L2924/13062 , H01L2924/13091 , H01L2924/00
摘要： An electronic device includes at least one chip and an insulating body embedding the chip. The electronic device further includes a heat-sink in contact with the chip. The heat-sink includes a plate having a first thickness. A recess is provided in the plate that defines a central portion of the plate having a second thickness less than the first thickness. The chip is mounted to the central region of the heat-sink within the recess. The insulating body includes a surface, such as a mounting surface, including an opening exposing at least a portion of the heat-sink. The device may further include a reophore extending through a side surface of the insulating body, that reophore being in contact with the heat sink.
摘要翻译：电子设备包括至少一个芯片和嵌入芯片的绝缘体。电子设备还包括与芯片接触的散热器。散热器包括具有第一厚度的板。在板中设置有限定板的中心部分的凹部，其具有小于第一厚度的第二厚度。芯片安装在凹槽内的散热器的中心区域。绝缘体包括诸如安装表面的表面，其包括露出散热器的至少一部分的开口。该装置还可以包括延伸穿过绝缘体的侧表面的再浮标，该再浮标与散热器接触。

4. 发明授权

US09105598B2 Package/heatsink system for electronic device 有权
标题翻译：用于电子设备的封装/散热系统
公开(公告)号：US09105598B2
公开(公告)日：2015-08-11
申请号：US13537166
申请日：2012-06-29
申请人： Cristiano Gianluca Stella , Concetto Privitera
发明人： Cristiano Gianluca Stella , Concetto Privitera
IPC分类号： H05K7/20 , H01L23/367 , H01L23/40 , H01L23/36
CPC分类号： H01L23/3672 , H01L23/36 , H01L23/3677 , H01L23/40 , H01L2924/0002 , Y10T29/4913 , H01L2924/00
摘要： An insulating body embeds an integrated circuit and has a mounting surface, an opposite free surface, and at least one pin exposed along an edge of the mounting surface and electrically connected to a terminal of the integrated circuit. A heatsink configured to dissipate heat produced by the integrated circuit is provided in correspondence of the free surface. The heatsink includes at least one protruding element including a connection portion partly extending in contact with the free surface and partly protruding beyond a boundary of the free surface (the connection portion having a free end being distal from the insulating body), and a mounting portion extending from the free end at least up to a plane of the mounting surface. The heatsink is further electrically connected to a terminal of the integrated circuit chip. The protruding element is placed in correspondence of the at least one pin.
摘要翻译：绝缘体嵌入集成电路并且具有安装表面，相对的自由表面和沿安装表面的边缘暴露的至少一个销并且电连接到集成电路的端子。配置为散发由集成电路产生的热量的散热器对应于自由表面提供。散热器包括至少一个突出元件，该突出元件包括部分地与自由表面接触地延伸并且部分地突出超过自由表面的边界的连接部分（具有远离绝缘体的自由端的连接部分），以及安装部分从自由端至少延伸到安装表面的平面。散热器进一步电连接到集成电路芯片的端子。突出元件被放置成对应于至少一个销。

5. 发明申请

US20130001764A1 POWER DEVICE HAVING REDUCED THICKNESS 有权
标题翻译：具有减小厚度的电力设备
公开(公告)号：US20130001764A1
公开(公告)日：2013-01-03
申请号：US13535636
申请日：2012-06-28
申请人： Cristiano Gianluca Stella , Agatino Carmelo Minotti
发明人： Cristiano Gianluca Stella , Agatino Carmelo Minotti
IPC分类号： H01L23/34 , H01L21/50
CPC分类号： H01L21/52 , H01L21/56 , H01L23/3107 , H01L23/3114 , H01L23/3675 , H01L23/4334 , H01L23/49524 , H01L23/49562 , H01L2224/32245 , H01L2924/1301 , H01L2924/13055 , H01L2924/13062 , H01L2924/13091 , H01L2924/00
摘要： An electronic device includes at least one chip and an insulating body embedding the chip. The electronic device further includes a heat-sink in contact with the chip. The heat-sink includes a plate having a first thickness. A recess is provided in the plate that defines a central portion of the plate having a second thickness less than the first thickness. The chip is mounted to the central region of the heat-sink within the recess. The insulating body includes a surface, such as a mounting surface, including an opening exposing at least a portion of the heat-sink. The device may further include a reophore extending through a side surface of the insulating body, that reophore being in contact with the heat sink.
摘要翻译：电子设备包括至少一个芯片和嵌入芯片的绝缘体。电子设备还包括与芯片接触的散热器。散热器包括具有第一厚度的板。在板中设置有限定板的中心部分的凹部，其具有小于第一厚度的第二厚度。芯片安装在凹槽内的散热器的中心区域。绝缘体包括诸如安装表面的表面，其包括露出散热器的至少一部分的开口。该装置还可以包括延伸穿过绝缘体的侧表面的再浮标，该再浮标与散热器接触。

6. 发明授权

US09882595B2 Housing system for portable electronic devices and related accessories 有权
公开(公告)号：US09882595B2
公开(公告)日：2018-01-30
申请号：US14430180
申请日：2013-09-20
申请人： Andrea Tranchida , Cristiano Gianluca Stella
发明人： Andrea Tranchida , Cristiano Gianluca Stella
IPC分类号： H04M1/00 , H04B1/3888 , H04R1/10
CPC分类号： H04B1/3888 , A45C11/00 , A45C2011/001 , A45C2011/002 , A45C2011/003 , G06F1/1628 , G06F1/1632 , H04R1/1033
摘要： A system includes a housing for a portable electronic device and a housing dedicated to house a winding mechanism for an earphone cable. The winding mechanism comprises a hollow base element, a cover element, a central sliding element, a spring, and a groove. The base element centrally includes a protrusion and the cover element has a base with a central hole corresponding to the protrusion and configured to allow exit of a first portion of the cable. The sliding element allows sliding of the cable and includes a base with a central hole between the base element and the covering element to form a pocket in which second and third portions of the cable are wrapped. The second portion is wrapped around the edge of the sliding element and the third portion is fixed inside the sliding element between a first hole and a second hole in the groove.

7. 发明授权

US08860192B2 Power device having high switching speed 有权
标题翻译：功率器件具有高开关速度
公开(公告)号：US08860192B2
公开(公告)日：2014-10-14
申请号：US13534832
申请日：2012-06-27
申请人： Cristiano Gianluca Stella
发明人： Cristiano Gianluca Stella
IPC分类号： H01L23/495 , H01L23/433 , H01L23/00
CPC分类号： H01L23/49562 , H01L23/4334 , H01L23/49568 , H01L24/32 , H01L2924/1301 , H01L2924/13055 , H01L2924/13062 , H01L2924/13091 , H01L2924/00
摘要： An electronic device includes at least one electronic component chip having a first conduction terminal and a control terminal on a first surface of the chip and a second conduction terminal on a second surface opposite the first surface of the chip. An insulating body embeds the chip. The insulating body includes a mounting surface and an electrically conductive heat-sink connected to the first conduction terminal on the first surface of the chip, but insulated from the control terminal. An opening in a first surface of the insulating body exposes a surface of the electrically conductive heat sink. The electrically conductive heat sink includes a perimeter cavity configured for alignment with an encircling configuration of the control terminal, wherein the perimeter cavity contains a material that insulates the control terminal from the heat sink.
摘要翻译：电子设备包括至少一个电子元件芯片，其具有在芯片的第一表面上的第一导电端子和控制端子，以及在与芯片的第一表面相对的第二表面上的第二导电端子。绝缘体嵌入芯片。绝缘体包括安装表面和连接到芯片的第一表面上的第一导电端子但与控制端子绝缘的导电散热器。绝缘体的第一表面中的开口露出导电散热片的表面。导电散热器包括被配置为与控制端子的环绕构型对准的周边空腔，其中周边空腔包含使控制端子与散热器绝缘的材料。

8. 发明授权

US08755188B2 Half-bridge electronic device with common auxiliary heat sink 有权
标题翻译：半桥电子设备，配有普通辅助散热器
公开(公告)号：US08755188B2
公开(公告)日：2014-06-17
申请号：US13536278
申请日：2012-06-28
申请人： Cristiano Gianluca Stella
发明人： Cristiano Gianluca Stella
IPC分类号： H05K7/20 , H01L29/00 , H02J3/38 , H02M1/44 , H02M7/539
CPC分类号： H01L29/00 , H01L23/49562 , H01L23/49575 , H01L24/32 , H01L24/33 , H01L2224/32245 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H02J3/38 , H02M1/44 , H02M7/539 , Y02B70/1483 , H01L2924/00 , H01L2924/00012
摘要： An electronic device includes a first and second integrated chip switch, each having a back (drain) surface and an opposite front (source) surface. An insulating package embeds the switches along with first, second and third heat sinks. The front surface of the first switch and back surface of the second switch are mounted to the first heat sink to couple first switch source to the second switch drain through the first heat sink in a half-bridge configuration. The first switch back surface is mounted to the second heat sink and the second switch front surface is mounted to the third heat sink. The package includes first, second and third openings which expose, respectively, the first, second and third heat sinks. The first heat sink opening is provided on one surface of the package, while the second and third heat sink openings are provided on an opposite surface of the package.
摘要翻译：电子设备包括第一和第二集成芯片开关，每个具有背面（漏极）表面和相对的前（源）表面。绝缘封装将开关与第一，第二和第三散热片一起嵌入。第一开关的第一开关的前表面和第二开关的后表面安装到第一散热器，以半桥配置将第一开关源耦合到通过第一散热器的第二开关漏极。第一开关背表面安装到第二散热器，第二开关前表面安装到第三散热器。该包装包括分别暴露第一，第二和第三散热片的第一，第二和第三开口。第一散热开口设置在封装的一个表面上，而第二和第三散热开口设置在封装的相对表面上。

9. 发明授权

US08472176B2 Integrated power adapter system for portable computers 有权
标题翻译：用于便携式计算机的集成电源适配器系统
公开(公告)号：US08472176B2
公开(公告)日：2013-06-25
申请号：US13184761
申请日：2011-07-18
申请人： Cristiano Gianluca Stella , Giuseppe Consentino
发明人： Cristiano Gianluca Stella , Giuseppe Consentino
IPC分类号： G06F1/16
CPC分类号： G06F1/1637 , G06F1/1635 , Y10T29/49002
摘要： An integrated power adapter system for a portable computer may include a power adapter for providing power to the portable computer, extractable elements for connection to an external socket, and a dissipation grid for reducing the temperature of the cover screen. The power adapter system may be a slim power adapter system being removable from and integrated with the cover screen of the portable computer.
摘要翻译：用于便携式计算机的集成电力适配器系统可以包括用于向便携式计算机提供电力的电力适配器，用于连接到外部插座的可抽出元件以及用于降低盖屏幕的温度的耗散栅格。电源适配器系统可以是可移动并且与便携式计算机的盖屏幕集成的细长电源适配器系统。

10. 发明申请

US20130003313A1 SYSTEM WITH STABILIZED HEATSINK 有权
标题翻译：具有稳定热源的系统
公开(公告)号：US20130003313A1
公开(公告)日：2013-01-03
申请号：US13537242
申请日：2012-06-29
申请人： Cristiano Gianluca Stella , Concetto Privitera
发明人： Cristiano Gianluca Stella , Concetto Privitera
IPC分类号： H05K7/20
CPC分类号： H01L23/3672 , H01L23/40 , H01L2924/0002 , H01L2924/00
摘要： An insulating body incorporates at least one integrated circuit chip and includes a mounting surface for mounting to a board and a free surface opposite the mounting surface. A heatsink is attached to the insulating body at the free surface. The heatsink includes at least one stabilizing element. The stabilizing element includes an attachment portion extending at least partially transversely to the free surface beyond a peripheral boundary of the free surface when considered in plan view. The attachment portion has a binding end bound to the free surface and a free end opposite the binding end. The stabilizing element also has a mounting portion extending from the free end of the attachment portion at least up to a plane of the mounting surface.
摘要翻译：绝缘体包括至少一个集成电路芯片，并且包括用于安装到板的安装表面和与安装表面相对的自由表面。散热片在自由表面附着在绝缘体上。散热器包括至少一个稳定元件。稳定元件包括在平面图中考虑时至少部分地横向于自由表面延伸超过自由表面的周边边界的附接部分。附接部分具有结合自由表面的结合端和与结合端相对的自由端。稳定元件还具有从附接部分的自由端至少延伸到安装表面的平面的安装部分。

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