会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明授权
    • Superabrasive wheel with active bond
    • 超级砂轮与积极的债券
    • US06200208B1
    • 2001-03-13
    • US09227028
    • 1999-01-07
    • Richard M. AndrewsSergej-Tomislav BuljanSrinivasan RamanathEarl G. Geary
    • Richard M. AndrewsSergej-Tomislav BuljanSrinivasan RamanathEarl G. Geary
    • B28D100
    • B28D5/022B24D3/06
    • A straight, thin, monolithic abrasive wheel formed of hard and rigid abrasive grains and a sintered bond including a metal component and an active metal component exhibits superior stiffness. The metal component can be selected from among many sinterable metal compositions. The active metal is a metal capable of reacting to form a bond with the abrasive grains at sintering conditions and is present in an amount effective to integrate the grains and sintered bond into a grain-reinforced composite. A diamond abrasive, copper/tin/titanium sintered bond abrasive wheel is preferred. Such a wheel is useful for abrading operations in the electronics industry, such as cutting silicon wafers and alumina-titanium carbide pucks. The stiffness of the novel abrasive wheels is higher than conventional straight monolithic wheels and therefore improved cutting precision and less chipping can be attained without increase of wheel thickness and concomitant increased kerf loss.
    • 由硬质刚性磨粒和包含金属组分和活性金属组分的烧结粘合剂形成的直的,薄的整体砂轮显示出优异的刚度。 金属组分可以选自许多可烧结金属组合物。 活性金属是能够在烧结条件下与磨粒形成结合的金属,并且以有效将晶粒和烧结结合在晶粒增强复合材料中的量存在。 金刚石研磨剂,铜/锡/钛烧结粘结砂轮是优选的。 这种轮对于电子工业中的研磨操作是有用的,例如切割硅晶片和氧化铝 - 碳化钛圆盘。 新型砂轮的刚度高于传统的直式整体轮,因此在不增加车轮厚度和随之增加的切口损失的情况下,可以获得更好的切割精度并减少切屑。
    • 7. 发明授权
    • Superabrasive wheel with active bond
    • 超级砂轮与积极的债券
    • US06485532B2
    • 2002-11-26
    • US09748563
    • 2000-12-21
    • Richard M. AndrewsSergej-Tomislav BuljanSrinivasan RamanathEarl G. Geary
    • Richard M. AndrewsSergej-Tomislav BuljanSrinivasan RamanathEarl G. Geary
    • B24D1100
    • B28D5/022B24D3/06
    • A straight, thin, monolithic abrasive wheel formed of hard and rigid abrasive grains and a sintered bond including a metal component and an active metal component exhibits superior stiffness. The metal component can be selected from among many sinterable metal compositions. The active metal is a metal capable of reacting to form a bond with the abrasive grains at sintering conditions and is present in an amount effective to integrate the grains and sintered bond into a grain-reinforced composite. A diamond abrasive, copper/tin/titanium sintered bond abrasive wheel is preferred. Such a wheel is useful for abrading operations in the electronics industry, such as cutting silicon wafers and alumina-titanium carbide pucks. The stiffness of the novel abrasive wheels is higher than conventional straight monolithic wheels and therefore improved cutting precision and less chipping can be attained without increase of wheel thickness and concomitant increased kerf loss.
    • 由硬质刚性磨粒和包含金属组分和活性金属组分的烧结粘合剂形成的直的,薄的整体砂轮显示出优异的刚度。 金属组分可以选自许多可烧结金属组合物。 活性金属是能够在烧结条件下与磨粒形成结合的金属,并且以有效将晶粒和烧结结合在晶粒增强复合材料中的量存在。 金刚石研磨剂,铜/锡/钛烧结粘结砂轮是优选的。 这种轮对于电子工业中的研磨操作是有用的,例如切割硅晶片和氧化铝 - 碳化钛圆盘。 新型砂轮的刚度高于传统的直式整体轮,因此在不增加车轮厚度和随之增加的切口损失的情况下,可以获得更好的切割精度并减少切屑。