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    • 5. 发明申请
    • Abrasive disc
    • 研磨盘
    • US20060211353A1
    • 2006-09-21
    • US11080981
    • 2005-03-16
    • Noriomi KodaniAkihiko NagayaKatsuhiro Kawasaki
    • Noriomi KodaniAkihiko NagayaKatsuhiro Kawasaki
    • B23F21/03B24B33/00
    • B24D7/06
    • An abrasive disc which has plural abrasive chips having an abrasive layer on a metal piece and being arranged in a peripheral portion of a disc substrate with a predetermined space comprises a suspension plate placed between the disc substrate and abrasive chips and an elastic sheet placed between the disc substrate and the suspension plate, wherein the disc substrate consists of a plastic resin including fiber, the abrasive chips have stakes therein and the suspension plate has through-holes to which the stakes are deformed therein. Each of the abrasive chips has abrasive surfaces including a top abrasive surface and peripheral surfaces and the outer peripheral portion and the inner peripheral portion are declined to the top surface. The abrasive discs have a combination of different abrasive chips fabricated by different bonding metals for the fabrication of the abrasive chips.
    • 具有在金属片上具有研磨层并且具有预定间隔设置在盘基片的周边部分中的多个研磨片的研磨盘包括放置在盘基片和研磨片之间的悬挂板, 盘基片和悬挂板,其中盘基片由包括纤维的塑料树脂组成,研磨片在其中具有桩,悬挂板具有通孔,桩中的桩在其中变形。 每个研磨片具有包括顶部研磨表面和外周表面的研磨表面,并且外周部分和内周部分向下倾斜到顶表面。 研磨盘具有由用于制造磨料碎片的不同结合金属制成的不同研磨片的组合。
    • 8. 发明授权
    • Retaining ring assembly for use in chemical mechanical polishing
    • 固定环组件用于化学机械抛光
    • US07029386B2
    • 2006-04-18
    • US10865626
    • 2004-06-10
    • Richard T. Young
    • Richard T. Young
    • B24B21/18B24B33/00B24B47/26B24B55/00
    • B24B37/32
    • A retaining ring assembly for use in chemical mechanical polishing that includes an annular plastic retaining ring portion defining an annular projection thereon, an annular metal backing defining an annular channel therein for receiving the projection and a pair of elongated spring members concentrically disposed about the annular projection on the retaining ring. The channel in the backing is sized so as to receive the annular projection on the retaining ring and spring members therein upon the retaining ring being urged against the backing whereupon the spring members bear against the projection on the retaining ring and portions of the annular backing so as to releasably secure the retaining ring to the backing such that the retaining ring can be replaced upon becoming worn during use and the metal backing can be reused.
    • 一种用于化学机械抛光的保持环组件,其包括在其上限定环形突起的环形塑料保持环部分,环形金属背衬,其中限定用于接收突出部的环形通道,以及一对同心地围绕环形突起设置的细长弹簧部件 在挡环上。 背衬中的通道的尺寸被设计成在保持环被推靠在背衬上时接收保持环上的环形突起和弹簧构件,随后弹簧构件抵靠保持环上的突起和环形背衬的一部分 为了将保持环可释放地固定到背衬上,使得保持环可以在使用期间变得磨损而被替换,并且可以重新使用金属背衬。
    • 9. 发明申请
    • Chemical mechanical machining and surface finishing
    • 化学机械加工和表面处理
    • US20050164610A1
    • 2005-07-28
    • US11012518
    • 2004-12-15
    • Mark MichaudGary SrokaLane Winkelmann
    • Mark MichaudGary SrokaLane Winkelmann
    • B23C3/00B23F19/00B24B1/00B24B5/42B24B19/06B24B33/00B24B37/00B24B37/04C23C22/07C23C22/24C23C22/46C23C22/47C23C22/73C23F3/00B23C1/00
    • B24B37/042B24B5/42B24B33/00C23C22/73C23F3/00
    • The invention described herein discloses a chemical mechanical machining and surface finishing process. A conversion coating is formed on the surface of a workpiece and is removed via relative motion with a tool, thereby exposing the workpiece to further reaction with the active chemistry. Low mechanical forces are used such that the plastic deformation, shear strength, tensile strength and/or thermal degradation temperature of the workpiece are not exceeded. Since the chemical mechanical machining and surface finishing process requires little force and/or speed of contact to remove the conversion coating, the equipment's mass, complexity and cost can be significantly reduced, while simultaneously increasing machining precision and accuracy. The present invention lends itself to a very controlled rate of metal removal, and can simply surface finish the workpiece, or if desired, can surface finish the workpiece simultaneously with the shaping and/or sizing process.
    • 本文所述的发明公开了一种化学机械加工和表面精加工方法。 在工件的表面上形成转化涂层,并通过工具的相对运动去除转化涂层,从而使工件暴露于与活性化学物质的进一步反应。 使用低机械力,使得不超过工件的塑性变形,剪切强度,拉伸强度和/或热降解温度。 由于化学机械加工和表面处理过程需要很小的力和/或接触速度来去除转换涂层,因此可以显着降低设备的质量,复杂性和成本,同时提高加工精度和精度。 本发明适用于非常受控的金属去除速率,并且可以简单地对工件进行表面光洁度,或者如果需要,可以在成形和/或定径过程中同时对工件进行表面光洁。
    • 10. 发明授权
    • Chemical mechanical polish (CMP) conditioning-disk holder
    • 化学机械抛光(CMP)调理盘支架
    • US06887138B2
    • 2005-05-03
    • US10601248
    • 2003-06-20
    • Brian E. BottemaLarry J. BustosMartin W. CainNathan R. Brown
    • Brian E. BottemaLarry J. BustosMartin W. CainNathan R. Brown
    • B24B53/017B24B53/12B24B33/00
    • B24B53/017B24B53/12
    • A chemical mechanical polishing (CMP) tool holds a conditioning disk that is used to remove impurities from a polishing disk used to planarize surfaces, such as a semiconductor surface. The tool uses an elastic disk that is positioned between a clamp and a gimbal hub that pivotally overlies a gimbal plate. The elastic disk is a polymer material, such as for example polytetrafluoroethylene (PTFE). The elastic disk has a central opening and is radially solid around the central opening. Alignment holes and drive mechanism holes pierce the elastic disk which functions to rotate the tool with minimal friction and provides a liquid seal from CMP fluids. Access holes in the gimbal plate permit easy installation and removal of the individual components. The PTFE disk is strong and durable enough to withstand high torque and provide lengthy operation without maintenance.
    • 化学机械抛光(CMP)工具保持用于从用于平坦化表面的抛光盘(例如半导体表面)去除杂质的调节盘。 该工具使用一个弹性盘,该弹性盘定位在夹具和万向枢轴之间,万向枢轴枢转地覆盖在万向节板上。 弹性盘是聚合物材料,例如聚四氟乙烯(PTFE)。 弹性盘具有中心开口并围绕中心开口径向固定。 对准孔和驱动机构孔刺穿弹性盘,其功能是以最小摩擦旋转工具,并提供CMP流体的液体密封。 万向节板上的通孔允许容易地安装和拆卸各个部件。 PTFE圆盘坚固耐用,足以承受高扭矩并提供长时间的操作,无需维护。