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1. 发明授权

US08175652B2 Terminal and method of controlling the same 有权
标题翻译：终端及其控制方法
公开(公告)号：US08175652B2
公开(公告)日：2012-05-08
申请号：US12252049
申请日：2008-10-15
申请人： Dong Kil Shin
发明人： Dong Kil Shin
IPC分类号： H04M1/00
CPC分类号： G06F3/0489 , G06F3/0237 , G06F3/04886 , H04M2250/22
摘要： A mobile terminal having a display including a touch screen, and a control unit configured to display on the touch screen a plurality of key buttons, and when a first key button of the plurality of key buttons is touched, to display at least one item that is relevant to the first touched key button in an area of the touch screen defined by the key buttons.
摘要翻译：一种移动终端，其具有包括触摸屏的显示器，以及控制单元，被配置为在触摸屏上显示多个按键按钮，并且当多个按键按钮中的第一按键被触摸时，显示至少一个项目，与由按键定义的触摸屏的区域中的第一个触摸的按键相关。

2. 发明申请

US20110079897A1 INTEGRATED CIRCUIT CHIP AND FLIP CHIP PACKAGE HAVING THE INTEGRATED CIRCUIT CHIP 有权
标题翻译：具有集成电路芯片的集成电路芯片和片式芯片封装
公开(公告)号：US20110079897A1
公开(公告)日：2011-04-07
申请号：US12894540
申请日：2010-09-30
申请人： Jin-Woo PARK , Eun-Chul Ahn , Dong-Kil Shin , Sun-Won Kang , Jong-Ho Lee
发明人： Jin-Woo PARK , Eun-Chul Ahn , Dong-Kil Shin , Sun-Won Kang , Jong-Ho Lee
IPC分类号： H01L23/48
CPC分类号： H01L24/06 , H01L23/49816 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/12 , H01L24/13 , H01L2224/02125 , H01L2224/03464 , H01L2224/0401 , H01L2224/05011 , H01L2224/05018 , H01L2224/05124 , H01L2224/05147 , H01L2224/05556 , H01L2224/05558 , H01L2224/05569 , H01L2224/05572 , H01L2224/05655 , H01L2224/06051 , H01L2224/13018 , H01L2224/13022 , H01L2224/13099 , H01L2224/131 , H01L2224/13116 , H01L2224/1403 , H01L2224/16225 , H01L2224/16227 , H01L2224/73204 , H01L2924/00013 , H01L2924/0002 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15788 , H01L2924/181 , H01L2924/19041 , H01L2924/00014 , H01L2924/0105 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2224/05552 , H01L2924/00 , H01L2924/00012
摘要： In an integrated circuit (IC) chip and a flip chip package having the same, no wiring line is provided and the first electrode pad does not make contact with the wiring line in a pad area of the IC chip. Thus, the first bump structure makes contact with the first electrode regardless of the wiring line in the pad area. The second electrode pad makes contact with the wiring line in a pseudo pad area of the IC chip. Thus, the second bump structure in the pseudo pad area makes contact with an upper surface of the second electrode at a contact point(s) spaced apart from the wiring line under the second electrode.
摘要翻译：在集成电路（IC）芯片和具有其的倒装芯片封装中，不设置布线，并且第一电极焊盘不与IC芯片的焊盘区域中的布线接触。因此，与焊盘区域中的布线无关，第一凸块结构与第一电极接触。第二电极焊盘与IC芯片的伪焊盘区域中的布线接触。因此，伪焊盘区域中的第二凸块结构在与第二电极下方的布线间隔开的接触点处与第二电极的上表面接触。

3. 发明申请

US20100259912A1 Electronic device 有权
标题翻译：电子设备
公开(公告)号：US20100259912A1
公开(公告)日：2010-10-14
申请号：US12662218
申请日：2010-04-06
申请人： Dong-Kil Shin , Shle-Ge Lee
发明人： Dong-Kil Shin , Shle-Ge Lee
IPC分类号： H05K1/11
CPC分类号： H05K1/111 , H05K3/3436 , H05K3/368 , H05K2201/09381 , H05K2201/09418 , H05K2201/09427 , Y02P70/611 , Y02P70/613
摘要： Provided is an electronic device which may include a first structure having a first surface, a first land region on the first surface, a second structure having a second surface facing the first surface, a second land region on the second surface, and a connection structure between the first and second structures electrically connecting the first land region to the second land region. As provided, the first land region may have a major axis and a minor axis on the first surface and the second land region may have a major axis and a minor axis on the second surface. Furthermore, the major axes of the first and second land regions may have different orientations with respect to one another.
摘要翻译：提供一种电子设备，其可以包括第一结构，其具有第一表面，第一表面上的第一焊盘区域，具有面向第一表面的第二表面的第二结构，第二表面上的第二焊盘区域，以及连接结构在第一和第二结构之间，电连接第一焊盘区域和第二焊盘区域。如上所述，第一焊盘区域可以在第一表面上具有长轴和短轴，并且第二焊盘区域可以在第二表面上具有长轴和短轴。此外，第一和第二脊区域的长轴可以具有彼此不同的取向。

4. 发明申请

US20090032916A1 SEMICONDUCTOR PACKAGE APPARATUS 审中-公开
标题翻译：半导体封装设备
公开(公告)号：US20090032916A1
公开(公告)日：2009-02-05
申请号：US12182843
申请日：2008-07-30
申请人： Dong-Kil SHIN , Sang-Wook PARK
发明人： Dong-Kil SHIN , Sang-Wook PARK
IPC分类号： H01L23/495
CPC分类号： H05K3/3426 , H01L23/49548 , H01L23/49555 , H01L23/49575 , H01L23/49582 , H01L24/48 , H01L25/105 , H01L2224/32145 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2225/1029 , H01L2225/1058 , H01L2924/00014 , H01L2924/01019 , H01L2924/01079 , H01L2924/1532 , H01L2924/181 , H05K2201/10477 , H05K2201/10689 , Y02P70/613 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor package apparatus and a method of fabricating the semiconductor package apparatus. The semiconductor package apparatus includes: semiconductor chips comprising active and inactive surfaces and protected by a packing portion; a substrate on which the semiconductor chips are installed; leads comprising front portions electrically coupled to the active surfaces of the semiconductor chips and rear portions extending substantially to the substrate; and bonding materials bonded between ends of the rear portions of the leads and the substrate to electrically couple the leads to the substrate. Ends of the rear portions of the leads may stand on the substrate. Thus, solder joint reliability can be improved, and a wetting characteristic of solder can be improved during surface installation. Also, semiconductor package apparatuses having similar attributes can easily be multilayered. In addition, a foot print of the semiconductor package apparatus can be reduced to enable high-density installation. Moreover, shapes of the bonding materials (solder) can be controlled to optimize bonding strength of the leads, quantity of the bonding materials, or the like.
摘要翻译：一种半导体封装装置及其制造方法。半导体封装装置包括：半导体芯片，包括有源和非活性表面，并被封装部分保护; 其上安装有半导体芯片的基板; 引线包括电耦合到半导体芯片的有源表面的前部和基本上延伸到衬底的后部; 以及接合在引线的后部的端部与基板之间的接合材料，以将引线电耦合到基板。引线的后部的端部可以位于基板上。因此，可以提高焊点可靠性，并且可以在表面安装期间改善焊料的润湿特性。此外，具有相似属性的半导体封装装置可以容易地多层化。此外，可以减少半导体封装装置的脚印，以实现高密度安装。此外，可以控制接合材料（焊料）的形状，以优化引线的接合强度，接合材料的量等。

5. 发明申请

US20070029674A1 Board-on-chip package and stack package using the same 审中-公开
标题翻译：片上封装和堆栈封装使用相同
公开(公告)号：US20070029674A1
公开(公告)日：2007-02-08
申请号：US11375760
申请日：2006-03-14
申请人： Dong-Kil Shin , Se-Young Yang , Shin Kim , Wang-Ju Lee
发明人： Dong-Kil Shin , Se-Young Yang , Shin Kim , Wang-Ju Lee
IPC分类号： H01L23/48
CPC分类号： H01L23/49816 , H01L23/13 , H01L23/3157 , H01L24/48 , H01L25/105 , H01L2224/32225 , H01L2224/4824 , H01L2224/73215 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/15311 , H01L2924/15331 , H01L2924/1815 , H01L2924/3511 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Provided is a board-on-chip package and stack package using the same to reduce the likelihood that bonding wires in an encapsulant may be damaged due to mechanical stresses applied during a package stacking process. A semiconductor package may have a spacer provided along the opposing sides of an encapsulant. The spacer may be spaced away from bonding wires embedded in the encapsulant. The height of the spacer may be greater than the height of the encapsulated bonding wire from the bottom surface of the semiconductor package. The spacer may be formed of a bar or a protrusion. In a stack package using the semiconductor package, the spacer may be provided between a semiconductor chip of a lower semiconductor package and an encapsulant of an upper semiconductor package.
摘要翻译：提供了一种使用其的片上封装和堆叠封装，以减少由于在封装堆叠过程中施加的机械应力而使密封剂中的接合线可能被损坏的可能性。半导体封装可以具有沿密封剂的相对侧设置的间隔件。间隔件可以与嵌入密封剂中的接合线间隔开。间隔件的高度可以大于封装的接合线从半导体封装的底表面的高度。间隔件可以由杆或突起形成。在使用半导体封装的堆叠封装中，间隔件可以设置在下半导体封装的半导体芯片和上半导体封装的封装件之间。

6. 发明申请

US20100230811A1 SEMICONDUCTOR DEVICE HAVING A CONDUCTIVE BUMP 有权
标题翻译：具有导电BUMP的半导体器件
公开(公告)号：US20100230811A1
公开(公告)日：2010-09-16
申请号：US12722794
申请日：2010-03-12
申请人： Dong-Kil Shin , Shle-Ge Lee , Jong-Joo Lee , Jong-Ho Lee
发明人： Dong-Kil Shin , Shle-Ge Lee , Jong-Joo Lee , Jong-Ho Lee
IPC分类号： H01L23/498
CPC分类号： H01L24/13 , H01L23/3192 , H01L24/03 , H01L24/05 , H01L24/11 , H01L2224/02126 , H01L2224/0401 , H01L2224/05558 , H01L2224/05571 , H01L2224/05573 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/1132 , H01L2224/1134 , H01L2224/11464 , H01L2224/13006 , H01L2224/13018 , H01L2224/13022 , H01L2224/13082 , H01L2224/131 , H01L2224/13147 , H01L2224/16 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/014 , H01L2924/351 , H01L2924/00014 , H01L2224/13099 , H01L2924/00 , H01L2924/00012
摘要： In one embodiment, a semiconductor device includes a semiconductor substrate and a bonding pad disposed thereon. The semiconductor device also includes a passivation layer, a buffer layer, and an insulating layer sequentially stacked on the semiconductor substrate. According to one aspect, a first recess is defined within the passivation layer, the buffer layer, and the insulating layer to expose at least a region of the bonding pad and a second recess is defined within the insulating layer to expose at least a region of the buffer layer and spaced apart from the first recess such that a portion of the insulating layer is interposed therebetween. Further, the semiconductor device includes a conductive solder bump disposed within the first and second recesses. The conductive solder bump may be connected to the bonding pad in the first recess and supported by the buffer layer through a protrusion of the conductive solder bump extending into the second recess.
摘要翻译：在一个实施例中，半导体器件包括半导体衬底和设置在其上的接合焊盘。半导体器件还包括依次堆叠在半导体衬底上的钝化层，缓冲层和绝缘层。根据一个方面，在钝化层，缓冲层和绝缘层内限定第一凹槽，以露出焊盘的至少一个区域，并且在绝缘层内限定第二凹槽，以暴露至少一个区域缓冲层，并且与第一凹部间隔开，使得绝缘层的一部分插入其间。此外，半导体器件包括设置在第一和第二凹槽内的导电焊料凸块。导电焊料凸块可以连接到第一凹槽中的焊盘，并且通过延伸到第二凹部中的导电焊料凸块的突起被缓冲层支撑。

7. 发明申请

US20090197647A1 TERMINAL AND METHOD OF CONTROLLING THE SAME 有权
标题翻译：终端及其控制方法
公开(公告)号：US20090197647A1
公开(公告)日：2009-08-06
申请号：US12252049
申请日：2008-10-15
申请人： Dong Kil SHIN
发明人： Dong Kil SHIN
IPC分类号： H04M1/00 , G06F3/041
CPC分类号： G06F3/0489 , G06F3/0237 , G06F3/04886 , H04M2250/22
摘要： A mobile terminal having a display including a touch screen, and a control unit configured to display on the touch screen a plurality of key buttons, and when a first key button of the plurality of key buttons is touched, to display at least one item that is relevant to the first touched key button in an area of the touch screen defined by the key buttons.
摘要翻译：一种移动终端，其具有包括触摸屏的显示器，以及控制单元，被配置为在触摸屏上显示多个按键按钮，并且当多个按键按钮中的第一按键被触摸时，显示至少一个项目，与由按键定义的触摸屏的区域中的第一个触摸的按键相关。

8. 发明授权

US08922012B2 Integrated circuit chip and flip chip package having the integrated circuit chip 有权
标题翻译：具有集成电路芯片的集成电路芯片和倒装芯片封装
公开(公告)号：US08922012B2
公开(公告)日：2014-12-30
申请号：US12894540
申请日：2010-09-30
申请人： Jin-Woo Park , Eun-Chul Ahn , Dong-Kil Shin , Sun-Won Kang , Jong-Ho Lee
发明人： Jin-Woo Park , Eun-Chul Ahn , Dong-Kil Shin , Sun-Won Kang , Jong-Ho Lee
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H01L23/00 , H01L23/498
CPC分类号： H01L24/06 , H01L23/49816 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/12 , H01L24/13 , H01L2224/02125 , H01L2224/03464 , H01L2224/0401 , H01L2224/05011 , H01L2224/05018 , H01L2224/05124 , H01L2224/05147 , H01L2224/05556 , H01L2224/05558 , H01L2224/05569 , H01L2224/05572 , H01L2224/05655 , H01L2224/06051 , H01L2224/13018 , H01L2224/13022 , H01L2224/13099 , H01L2224/131 , H01L2224/13116 , H01L2224/1403 , H01L2224/16225 , H01L2224/16227 , H01L2224/73204 , H01L2924/00013 , H01L2924/0002 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15788 , H01L2924/181 , H01L2924/19041 , H01L2924/00014 , H01L2924/0105 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2224/05552 , H01L2924/00 , H01L2924/00012
摘要： In an integrated circuit (IC) chip and a flip chip package having the same, no wiring line is provided and the first electrode pad does not make contact with the wiring line in a pad area of the IC chip. Thus, the first bump structure makes contact with the first electrode regardless of the wiring line in the pad area. The second electrode pad makes contact with the wiring line in a pseudo pad area of the IC chip. Thus, the second bump structure in the pseudo pad area makes contact with an upper surface of the second electrode at a contact point(s) spaced apart from the wiring line under the second electrode.
摘要翻译：在集成电路（IC）芯片和具有其的倒装芯片封装中，不设置布线，并且第一电极焊盘不与IC芯片的焊盘区域中的布线接触。因此，与焊盘区域中的布线无关，第一凸块结构与第一电极接触。第二电极焊盘与IC芯片的伪焊盘区域中的布线接触。因此，伪焊盘区域中的第二凸块结构在与第二电极下方的布线间隔开的接触点处与第二电极的上表面接触。

9. 发明授权

US08120176B2 Semiconductor device having a conductive bump 有权
标题翻译：具有导电凸块的半导体器件
公开(公告)号：US08120176B2
公开(公告)日：2012-02-21
申请号：US12722794
申请日：2010-03-12
申请人： Dong-Kil Shin , Shle-Ge Lee , Jong-Joo Lee , Jong-Ho Lee
发明人： Dong-Kil Shin , Shle-Ge Lee , Jong-Joo Lee , Jong-Ho Lee
IPC分类号： H01L23/48
CPC分类号： H01L24/13 , H01L23/3192 , H01L24/03 , H01L24/05 , H01L24/11 , H01L2224/02126 , H01L2224/0401 , H01L2224/05558 , H01L2224/05571 , H01L2224/05573 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/1132 , H01L2224/1134 , H01L2224/11464 , H01L2224/13006 , H01L2224/13018 , H01L2224/13022 , H01L2224/13082 , H01L2224/131 , H01L2224/13147 , H01L2224/16 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/014 , H01L2924/351 , H01L2924/00014 , H01L2224/13099 , H01L2924/00 , H01L2924/00012
摘要： In one embodiment, a semiconductor device includes a semiconductor substrate and a bonding pad disposed thereon. The semiconductor device also includes a passivation layer, a buffer layer, and an insulating layer sequentially stacked on the semiconductor substrate. According to one aspect, a first recess is defined within the passivation layer, the buffer layer, and the insulating layer to expose at least a region of the bonding pad and a second recess is defined within the insulating layer to expose at least a region of the buffer layer and spaced apart from the first recess such that a portion of the insulating layer is interposed therebetween. Further, the semiconductor device includes a conductive solder bump disposed within the first and second recesses. The conductive solder bump may be connected to the bonding pad in the first recess and supported by the buffer layer through a protrusion of the conductive solder bump extending into the second recess.
摘要翻译：在一个实施例中，半导体器件包括半导体衬底和设置在其上的接合焊盘。半导体器件还包括依次堆叠在半导体衬底上的钝化层，缓冲层和绝缘层。根据一个方面，在钝化层，缓冲层和绝缘层内限定第一凹槽，以露出焊盘的至少一个区域，并且在绝缘层内限定第二凹槽，以暴露至少一个区域缓冲层，并且与第一凹部间隔开，使得绝缘层的一部分插入其间。此外，半导体器件包括设置在第一和第二凹槽内的导电焊料凸块。导电焊料凸块可以连接到第一凹槽中的焊盘，并且通过延伸到第二凹部中的导电焊料凸块的突起被缓冲层支撑。

10. 发明授权

US06756668B2 Semiconductor package having thermal interface material (TIM) 有权
公开(公告)号：US06756668B2
公开(公告)日：2004-06-29
申请号：US10232344
申请日：2002-08-30
申请人： Joong-Hyun Baek , Ho-Jeong Moon , Dong-Kil Shin , Yun-Hyeok Im
发明人： Joong-Hyun Baek , Ho-Jeong Moon , Dong-Kil Shin , Yun-Hyeok Im
IPC分类号： H01L2312
CPC分类号： H01L23/433 , H01L24/31 , H01L2224/16225 , H01L2224/73253 , H01L2224/73257 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/07802 , H01L2924/15312 , H01L2924/15787 , H01L2924/16152 , H01L2924/351 , H01L2924/3512 , H01L2924/00
摘要： A semiconductor package and a method for forming the same are provided. The semiconductor package comprises a chip having an active surface and a back surface. The semiconductor package further comprises a substrate having an upper surface and a lower surface opposite the upper surface. The chip is electrically connected to the upper surface of the substrate. A lid is thermally coupled to the back surface of the chip. A thermal interface material (TIM) is located between the chip and the lid. The TIM includes voids to reduce thermomechanical stresses applied on the chip and the TIM, thereby preventing package cracks.

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