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1. 发明申请

US20110079897A1 INTEGRATED CIRCUIT CHIP AND FLIP CHIP PACKAGE HAVING THE INTEGRATED CIRCUIT CHIP 有权
标题翻译：具有集成电路芯片的集成电路芯片和片式芯片封装
公开(公告)号：US20110079897A1
公开(公告)日：2011-04-07
申请号：US12894540
申请日：2010-09-30
申请人： Jin-Woo PARK , Eun-Chul Ahn , Dong-Kil Shin , Sun-Won Kang , Jong-Ho Lee
发明人： Jin-Woo PARK , Eun-Chul Ahn , Dong-Kil Shin , Sun-Won Kang , Jong-Ho Lee
IPC分类号： H01L23/48
CPC分类号： H01L24/06 , H01L23/49816 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/12 , H01L24/13 , H01L2224/02125 , H01L2224/03464 , H01L2224/0401 , H01L2224/05011 , H01L2224/05018 , H01L2224/05124 , H01L2224/05147 , H01L2224/05556 , H01L2224/05558 , H01L2224/05569 , H01L2224/05572 , H01L2224/05655 , H01L2224/06051 , H01L2224/13018 , H01L2224/13022 , H01L2224/13099 , H01L2224/131 , H01L2224/13116 , H01L2224/1403 , H01L2224/16225 , H01L2224/16227 , H01L2224/73204 , H01L2924/00013 , H01L2924/0002 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15788 , H01L2924/181 , H01L2924/19041 , H01L2924/00014 , H01L2924/0105 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2224/05552 , H01L2924/00 , H01L2924/00012
摘要： In an integrated circuit (IC) chip and a flip chip package having the same, no wiring line is provided and the first electrode pad does not make contact with the wiring line in a pad area of the IC chip. Thus, the first bump structure makes contact with the first electrode regardless of the wiring line in the pad area. The second electrode pad makes contact with the wiring line in a pseudo pad area of the IC chip. Thus, the second bump structure in the pseudo pad area makes contact with an upper surface of the second electrode at a contact point(s) spaced apart from the wiring line under the second electrode.
摘要翻译：在集成电路（IC）芯片和具有其的倒装芯片封装中，不设置布线，并且第一电极焊盘不与IC芯片的焊盘区域中的布线接触。因此，与焊盘区域中的布线无关，第一凸块结构与第一电极接触。第二电极焊盘与IC芯片的伪焊盘区域中的布线接触。因此，伪焊盘区域中的第二凸块结构在与第二电极下方的布线间隔开的接触点处与第二电极的上表面接触。

2. 发明申请

US20150243607A1 METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE HAVING MAGNETIC SHIELD UNIT 有权
标题翻译：制造具有磁性屏蔽单元的半导体封装的方法
公开(公告)号：US20150243607A1
公开(公告)日：2015-08-27
申请号：US14490105
申请日：2014-09-18
申请人： Jae-Gwon JANG , Jin-Woo PARK , Jong-Ho LEE
发明人： Jae-Gwon JANG , Jin-Woo PARK , Jong-Ho LEE
IPC分类号： H01L23/00 , H01L23/31 , H01L21/78
CPC分类号： H01L23/564 , H01L21/561 , H01L21/568 , H01L21/78 , H01L23/3128 , H01L23/3142 , H01L23/552 , H01L24/19 , H01L24/20 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/50 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/86 , H01L24/92 , H01L24/96 , H01L24/97 , H01L25/0657 , H01L25/105 , H01L2224/04026 , H01L2224/04105 , H01L2224/05082 , H01L2224/05568 , H01L2224/05582 , H01L2224/12105 , H01L2224/131 , H01L2224/2919 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48 , H01L2224/48228 , H01L2224/73215 , H01L2224/73265 , H01L2224/73267 , H01L2224/85005 , H01L2224/92165 , H01L2224/92247 , H01L2224/94 , H01L2224/97 , H01L2225/0651 , H01L2225/06537 , H01L2225/06565 , H01L2225/1023 , H01L2225/1035 , H01L2225/1041 , H01L2225/1058 , H01L2924/00014 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2224/05599 , H01L2924/00 , H01L2924/00012 , H01L2924/014 , H01L2224/03 , H01L2224/83 , H01L2224/85 , H01L2224/48227
摘要： A method of manufacturing a semiconductor package having a magnetic shield function is provided. The method includes forming cracks in a lattice structure on an active surface in which electrode terminals are formed; grinding a back surface of a wafer facing the active surface, bonding a tape on the active surface of the wafer, expanding the tape such that the wafer on the tape is divided as semiconductor chips, forming a shield layer on surfaces of the semiconductor chips and the tape, cutting the shield layer between the semiconductor chips and individualizing as each of the semiconductor chips which has a first shield pattern formed on back surface and sides, bonding the semiconductor chips on a substrate, and forming a second shield pattern on each of the active surfaces of the semiconductor chips, wherein the semiconductor chips and the substrate are physically and electrically connected by a bonding wire.
摘要翻译：提供一种制造具有磁屏蔽功能的半导体封装的方法。该方法包括在其中形成电极端子的有源表面上形成栅格结构中的裂纹; 研磨面向活性表面的晶片的背面，将胶带粘合在晶片的有效表面上，使胶带膨胀，使得胶带上的晶片被划分为半导体芯片，在半导体芯片的表面上形成屏蔽层，在所述半导体芯片之间切割所述屏蔽层，并且将每个所述半导体芯片分别形成在所述半导体芯片的背面和侧面上形成第一屏蔽图案并且将所述半导体芯片接合在基板上，并在所述半导体芯片的每一个上形成第二屏蔽图案半导体芯片的有源表面，其中半导体芯片和基板通过接合线物理和电连接。

3. 发明申请

US20140284565A1 ORGANIC LIGHT EMITTING DISPLAY AND MANUFACTURING METHOD THEREOF 有权
标题翻译：有机发光显示及其制造方法
公开(公告)号：US20140284565A1
公开(公告)日：2014-09-25
申请号：US13963278
申请日：2013-08-09
申请人： Jin-Woo PARK , Myung-Jong JUNG , Sung-Woo CHO , Hyung-Tag LIM
发明人： Jin-Woo PARK , Myung-Jong JUNG , Sung-Woo CHO , Hyung-Tag LIM
IPC分类号： H01L51/50 , H01L51/56
CPC分类号： H01L51/504 , H01L27/3211 , H01L51/0013 , H01L51/5012 , H01L51/56
摘要： An OLED display and associated methods, including a substrate; a first electrode; a second electrode; and an organic emission layer between the first and second electrodes, the organic emission layer including first-third organic emission layers, wherein the third organic emission layer is commonly disposed on the first electrode in the first-third subpixels, the first organic emission layer is in the first subpixel, the second organic emission layer is on the third organic emission layer in the first to third subpixels, an intermediate layer is between the first organic emission layer and the third organic emission layer in the first subpixel and between the second organic emission layer and the third organic emission layer in the second subpixel, and a HTL is between the first organic emission layer and the intermediate layer in the first subpixel and between the second organic emission layer and the intermediate layer in the second subpixel.
摘要翻译： OLED显示器及相关方法，包括基板; 第一电极; 第二电极; 以及所述第一和第二电极之间的有机发光层，所述有机发光层包括第三有机发光层，其中所述第三有机发光层通常设置在所述第一三分之一子像素中的所述第一电极上，所述第一有机发光层为在第一子像素中，第二有机发光层位于第一至第三子像素中的第三有机发光层上，中间层位于第一子像素中的第一有机发光层与第三有机发光层之间，第二有机发光层和第二子像素中的第三有机发光层，HTL位于第一子像素中的第一有机发光层与中间层之间，第二子像素中的第二有机发光层与中间层之间。

4. 发明申请

US20120161088A1 Photosensitive Resin Composition and Color Filter Using the Same 有权
标题翻译：感光树脂组合物和使用其的滤色器
公开(公告)号：US20120161088A1
公开(公告)日：2012-06-28
申请号：US13217581
申请日：2011-08-25
申请人： Jung-Sik CHOI , Chang-Min LEE , Jin-Woo PARK , Kyung-Won AHN , Myung-Ho CHO
发明人： Jung-Sik CHOI , Chang-Min LEE , Jin-Woo PARK , Kyung-Won AHN , Myung-Ho CHO
IPC分类号： G02B5/23 , G03F7/032
CPC分类号： G03F7/0007 , G02B5/201 , G03F7/027 , G03F7/032 , G03F7/0388
摘要： Disclosed is a photosensitive resin composition including (A) a photopolymerizable monomer including a compound represented by the following Chemical Formula 1, wherein the substituents of Chemical Formula 1 are the same as defined in the specification, (B) a binder resin, (C) a photopolymerization initiator, (D) a pigment and (E) a solvent, and a color filter using the same.
摘要翻译：公开了包含（A）包含由以下化学式1表示的化合物的光聚合性单体的光敏树脂组合物，其中化学式1的取代基与说明书中所定义的相同，（B）粘合剂树脂，（C）光聚合引发剂，（D）颜料和（E）溶剂，以及使用其的滤色器。

5. 发明申请

US20110215444A1 PACKAGE SUBSTRATES, SEMICONDUCTOR PACKAGES HAVING THE SAME, AND METHODS OF FABRICATING THE SEMICONDUCTOR PACKAGES 有权
标题翻译：封装基板，具有该封装基板的半导体封装以及制造半导体封装的方法
公开(公告)号：US20110215444A1
公开(公告)日：2011-09-08
申请号：US13042855
申请日：2011-03-08
申请人： Jin-Woo PARK , Hwan-Sik Lim , Eunchul Ahn
发明人： Jin-Woo PARK , Hwan-Sik Lim , Eunchul Ahn
IPC分类号： H01L23/58 , H01L23/48
CPC分类号： H01L21/50 , H01L21/563 , H01L23/48 , H01L23/58 , H01L2224/16225 , H01L2224/26175 , H01L2224/32225 , H01L2224/73204 , H01L2224/83385 , H01L2924/00012
摘要： A package substrate, a semiconductor package having the same, and a method for fabricating the semiconductor package. The semiconductor package includes a semiconductor chip, a package substrate, and a molding layer. The package substrate provides a region mounted with the semiconductor chip. The molding layer is configured to mold the semiconductor chip. The package substrate includes a first opening portion that provides an open region connected electrically to the semiconductor chip and extends beyond sides of the semiconductor chip to be electrically connected to the semiconductor chip.
摘要翻译：封装基板，具有该封装基板的半导体封装以及半导体封装的制造方法。半导体封装包括半导体芯片，封装基板和模制层。封装衬底提供安装有半导体芯片的区域。模制层被配置成模制半导体芯片。封装基板包括第一开口部分，该第一开口部分提供与半导体芯片电连接的开放区域，并且延伸超过半导体芯片的两侧以与半导体芯片电连接。

6. 发明申请

US20110080357A1 LIQUID CRYSTAL DISPLAY WITH BUILT-IN TOUCH SCREEN 有权
标题翻译：液晶显示屏，内置触摸屏
公开(公告)号：US20110080357A1
公开(公告)日：2011-04-07
申请号：US12834102
申请日：2010-07-12
申请人： Jin-Woo PARK , Sang-Uk Kim , Hee-Chul Hwang , My-Kyung Jeon , Hideo Yoshimura
发明人： Jin-Woo PARK , Sang-Uk Kim , Hee-Chul Hwang , My-Kyung Jeon , Hideo Yoshimura
IPC分类号： G06F3/041
CPC分类号： G06F3/0412 , G02F1/13338 , G02F1/133514 , G02F2001/13312 , G02F2001/136222 , G06F3/044
摘要： A liquid crystal display (LCD) with a built-in touch screen includes: a first substrate including a pixel area having a plurality of pixels and a sensor area having a plurality of photosensors; a second substrate positioned over the first substrate, and including a color filter, a light receiving portion, a transparent electrode layer, and a front polarizing plate; an LCD panel including a liquid crystal layer interposed between the first and second substrates; and a touch screen driver circuit to sense a capacitance variation provided through a first sensing line connected to the transparent electrode layer when an object is in contact with the LCD panel, and to output position information of the object, sensed by using optical information sensed through a second sensing line connected the plurality of photosensors when the capacitance variation is greater than or equal to a predetermined threshold value.
摘要翻译：具有内置触摸屏的液晶显示器（LCD）包括：第一基板，包括具有多个像素的像素区域和具有多个光电传感器的传感器区域; 位于第一基板上的第二基板，包括滤色器，受光部，透明电极层和前偏振片; 液晶显示面板，包括插入在第一和第二基板之间的液晶层; 以及触摸屏驱动器电路，用于感测当物体与LCD面板接触时通过连接到透明电极层的第一感测线提供的电容变化，并且输出通过使用通过以下方式感测的光学信息感测的物体的位置信息当电容变化大于或等于预定阈值时，连接多个光电传感器的第二传感线。

7. 发明申请

US20090149016A1 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：US20090149016A1
公开(公告)日：2009-06-11
申请号：US12330416
申请日：2008-12-08
申请人： Jin-Woo PARK , Tae-Joo HWANG , Nam-Seog KIM
发明人： Jin-Woo PARK , Tae-Joo HWANG , Nam-Seog KIM
IPC分类号： H01L21/768
CPC分类号： H01L24/11 , H01L24/13 , H01L2224/05001 , H01L2224/05022 , H01L2224/05027 , H01L2224/05124 , H01L2224/05166 , H01L2224/05572 , H01L2224/10126 , H01L2224/1308 , H01L2224/13099 , H01L2224/13565 , H01L2224/16 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01022 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/00014
摘要： Provided is a semiconductor device and a method of fabricating the same. The method of fabricating the semiconductor device includes forming a mask pattern having an opening corresponding to an electrode pad formed on a semiconductor substrate; forming a bump by filling the opening with a conductive first material; forming a sidewall film on sidewalls of the bump using a second material; forming a connection member between an upper surface of the bump and a wire substrate using a conductive third material in order to electrically connect the bump and the wire substrate; and forming an underfill resin between the wire substrate and the semiconductor substrate, wherein a wetting angle between the second material and the third material is greater than that between the first material and the third material.
摘要翻译：提供一种半导体器件及其制造方法。制造半导体器件的方法包括形成具有对应于形成在半导体衬底上的电极焊盘的开口的掩模图案; 通过用导电的第一材料填充开口形成凸起; 使用第二材料在所述凸块的侧壁上形成侧壁膜; 在所述突起的上表面和使用导电的第三材料的金属基底之间形成连接构件，以便电连接所述凸块和所述金属丝基底; 以及在所述金属丝衬底和所述半导体衬底之间形成底部填充树脂，其中所述第二材料和所述第三材料之间的润湿角度大于所述第一材料和所述第三材料之间的润湿角度。

8. 发明申请

US20150235939A1 THREE-DIMENSIONAL SEMICONDUCTOR DEVICES 有权
标题翻译：三维半导体器件
公开(公告)号：US20150235939A1
公开(公告)日：2015-08-20
申请号：US14588506
申请日：2015-01-02
申请人： Sunyeong LEE , Kyoung-Hoon KIM , Jin-Woo PARK , SeungWoo PAEK , Seok-won LEE , Taekeun CHO
发明人： Sunyeong LEE , Kyoung-Hoon KIM , Jin-Woo PARK , SeungWoo PAEK , Seok-won LEE , Taekeun CHO
IPC分类号： H01L23/528 , H01L27/115
CPC分类号： H01L27/11582 , H01L27/11519 , H01L27/11526 , H01L27/11548 , H01L27/11551 , H01L27/11556 , H01L27/11565 , H01L27/11573 , H01L27/11575 , H01L27/11578 , H01L2224/32145
摘要： Three-dimensional (3D) semiconductor devices are provided. The 3D semiconductor device includes a plurality of dummy pillars penetrating each cell pad of an electrode structure and the electrode structure disposed under each cell pad. Insulating patterns of a mold stack structure for formation of the electrode structure may be supported by the plurality of dummy pillars, so transformation and contact of the insulating patterns may be minimized or prevented.
摘要翻译：提供三维（3D）半导体器件。 3D半导体器件包括穿过电极结构的每个电池衬垫的多个虚拟柱和设置在每个电池衬垫下方的电极结构。用于形成电极结构的模具堆叠结构的绝缘图案可以由多个虚拟支柱支撑，因此可以最小化或防止绝缘图案的变形和接触。

9. 发明申请

US20150123289A1 SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME 有权
标题翻译：半导体封装及其制造方法
公开(公告)号：US20150123289A1
公开(公告)日：2015-05-07
申请号：US14463854
申请日：2014-08-20
申请人： Jin-Woo PARK
发明人： Jin-Woo PARK
IPC分类号： H01L23/00 , H01L23/538 , H01L23/12
CPC分类号： H01L24/49 , H01L23/13 , H01L23/145 , H01L23/3128 , H01L23/3135 , H01L23/49811 , H01L23/5385 , H01L23/5389 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/92 , H01L25/065 , H01L25/0657 , H01L25/10 , H01L25/105 , H01L25/50 , H01L2224/0401 , H01L2224/04042 , H01L2224/05553 , H01L2224/06135 , H01L2224/131 , H01L2224/16225 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/83191 , H01L2224/92125 , H01L2224/92225 , H01L2225/0651 , H01L2225/06562 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2225/107 , H01L2924/00014 , H01L2924/12042 , H01L2924/1431 , H01L2924/1434 , H01L2924/15159 , H01L2924/15311 , H01L2924/181 , H01L2924/18161 , H01L2924/19107 , H01L2924/00012 , H01L2924/00 , H01L2924/2075 , H01L2924/20757 , H01L2924/20756 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2224/05599 , H01L2924/014
摘要： Provided is a semiconductor package, the semiconductor package includes a first substrate, a first semiconductor chip which is mounted on the first substrate, a second substrate which is disposed on the first semiconductor chip, at least one second semiconductor chip which is disposed on the second substrate; and a plurality of wires which are in contact with the first substrate and the second substrate to connect the first substrate and the second substrate to each other.
摘要翻译：提供一种半导体封装，该半导体封装包括第一衬底，安装在第一衬底上的第一半导体芯片，设置在第一半导体芯片上的第二衬底，设置在第二衬底上的至少一个第二半导体芯片基质; 以及与第一基板和第二基板接触以将第一基板和第二基板彼此连接的多根电线。

10. 发明申请

US20110057908A1 LIQUID CRYSTAL DISPLAY DEVICE WITH A BUILT IN TOUCH SCREEN 有权
标题翻译：液晶显示设备与触摸屏幕内置
公开(公告)号：US20110057908A1
公开(公告)日：2011-03-10
申请号：US12789930
申请日：2010-05-28
申请人： Jin-Woo PARK , Sang-Uk Kim , Hee-Chul Hwang , Mu-Kyung Jeon , Hideo Yoshimura
发明人： Jin-Woo PARK , Sang-Uk Kim , Hee-Chul Hwang , Mu-Kyung Jeon , Hideo Yoshimura
IPC分类号： G06F3/041 , G02F1/135 , G09G3/36
CPC分类号： G06F3/042 , G02F1/13318 , G02F1/13338 , G06F3/0412
摘要： A liquid crystal display device having a built in touch screen including a first substrate having pixel units comprising: a plurality of pixels displaying an image and sensor regions having light sensors formed adjacent to the corresponding pixel units to sense a position of a contacted object; a second substrate disposed on the first substrate, comprising: color filters formed on regions corresponding to the pixel units and first black matrices formed on regions corresponding to the sensor regions of the pixel units; a liquid crystal layer interposed between the first substrate and the second substrate; and a backlight assembly disposed on a bottom portion of the first substrate and providing light to the first substrate and the second substrate. The liquid crystal display device with the built in touch screen determines a point of contact on the touch screen.
摘要翻译：一种具有内置触摸屏的液晶显示装置，包括具有像素单元的第一基板，所述第一基板具有：显示图像的多个像素和具有与相应像素单元相邻形成的光传感器的传感器区域，以感测被接触物体的位置; 设置在第一基板上的第二基板，包括：形成在与像素单元的传感器区域对应的区域上形成的与像素单元对应的区域上的滤色器和形成的第一黑色矩阵; 插入在第一基板和第二基板之间的液晶层; 以及背光组件，其设置在所述第一基板的底部并且向所述第一基板和所述第二基板提供光。具有内置触摸屏的液晶显示装置确定触摸屏上的接触点。

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