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1. 发明授权

US09913693B2 Error correction techniques in surgical navigation 有权
公开(公告)号：US09913693B2
公开(公告)日：2018-03-13
申请号：US12916232
申请日：2010-10-29
申请人： Randal C. Schulhauser , Paul Gerrish , Michael F. Mattes , Todd A. Kallmyer , Patrick P. Senarith , Per Klype , David A. Ruben
发明人： Randal C. Schulhauser , Paul Gerrish , Michael F. Mattes , Todd A. Kallmyer , Patrick P. Senarith , Per Klype , David A. Ruben
IPC分类号： A61B5/05 , A61B34/20 , A61B17/00 , A61B90/00
CPC分类号： A61B34/20 , A61B2017/00703 , A61B2034/2048 , A61B2034/2051 , A61B2034/2055 , A61B2034/2072 , A61B2090/0818 , A61B2090/376
摘要： A medical system includes a sensor location module, a first module, and a second module. The sensor location module determines a location of a magnetic field sensor within a magnetic field. The first module determines an acceleration of the magnetic field sensor. The second module indicates a modified location of the magnetic field sensor in an image of a medical patient based on the acceleration and one or more previously determined locations.

2. 发明授权

US09252415B2 Power sources suitable for use in implantable medical devices and corresponding fabrication methods 有权
标题翻译：适用于植入医疗器械的电源和相应的制造方法
公开(公告)号：US09252415B2
公开(公告)日：2016-02-02
申请号：US13524304
申请日：2012-06-15
申请人： Mohsen Askarinya , Andreas A. Fenner , Erik J. Herrmann , David A. Ruben , John K. Day
发明人： Mohsen Askarinya , Andreas A. Fenner , Erik J. Herrmann , David A. Ruben , John K. Day
IPC分类号： H01M2/10 , H01M2/20 , H01M2/24 , H01M2/26 , H01M10/0562 , H01M10/0585 , H01M10/647 , H01M6/40 , H01M6/46 , H01M2/22 , H01M10/04 , H01M10/0525 , A61N1/378 , A61N1/375
CPC分类号： H01M2/204 , A61N1/3758 , A61N1/378 , H01M2/1066 , H01M2/202 , H01M2/22 , H01M2/24 , H01M2/266 , H01M6/40 , H01M6/46 , H01M10/0436 , H01M10/0525 , H01M10/0562 , H01M10/0585 , H01M10/647 , Y02E60/122 , Y10T29/49112
摘要： Arrays of planar solid state batteries are stacked in an aligned arrangement for subsequent separation into individual battery stacks. Prior to stacking, a redistribution layer (RDL) is formed over a surface of each wafer that contains an array; each RDL includes first and second groups of conductive traces, each of the first extending laterally from a corresponding positive battery contact, and each of the second extending laterally from a corresponding negative battery contact. Conductive vias, formed before or after stacking, ultimately couple together corresponding contacts of aligned batteries. If before, each via extends through a corresponding battery contact of each wafer and is coupled to a corresponding conductive layer that is included in another RDL formed over an opposite surface of each wafer. If after, each via extends through corresponding aligned conductive traces and, upon separation of individual battery stacks, becomes an exposed conductive channel of a corresponding battery stack.
摘要翻译：平面固态电池的阵列以对准的布置堆叠，以便随后分离成单独的电池堆叠。在堆叠之前，在包含阵列的每个晶片的表面上形成重分布层（RDL）; 每个RDL包括第一和第二组导电迹线，每个导体迹线首先从对应的正电池触点横向延伸，并且每个第二组从相应的负电池触点横向延伸。在堆叠之前或之后形成的导电通孔最终将对准的电池的相应触点耦合在一起。如果之前，每个通孔延伸穿过每个晶片的对应的电池触点并且耦合到相应的导电层，该导电层被包括在形成于每个晶片的相对表面上的另一个RDL中。如果之后，每个通孔延伸通过对应的对准的导电迹线，并且在单独的电池堆分离时，成为相应电池堆的暴露的导电通道。

3. 发明授权

US08461681B2 Layered structure for corrosion resistant interconnect contacts 有权
标题翻译：用于耐腐蚀互连触点的分层结构
公开(公告)号：US08461681B2
公开(公告)日：2013-06-11
申请号：US11741583
申请日：2007-04-27
申请人： David A. Ruben
发明人： David A. Ruben
IPC分类号： H01L23/52
CPC分类号： A61B5/0215 , A61B2562/028
摘要： The present invention is directed to an interconnect for an implantable medical device. The interconnect includes a first conductive layer, a second conductive layer introduced over the first conductive layer, and a third conductive layer introduced over the second conductive layer. One of the first conductive layer, the second conductive layer, and the third conductive layer comprises titanium-niobium (Ti—Nb).
摘要翻译：本发明涉及一种用于可植入医疗装置的互连件。互连包括第一导电层，在第一导电层上引入的第二导电层和引入第二导电层的第三导电层。第一导电层，第二导电层和第三导电层中的一个包括钛 - 铌（Ti-Nb）。

4. 发明授权

US08424388B2 Implantable capacitive pressure sensor apparatus and methods regarding same 有权
标题翻译：可植入式电容式压力传感器装置及方法
公开(公告)号：US08424388B2
公开(公告)日：2013-04-23
申请号：US13016363
申请日：2011-01-28
申请人： Michael F. Mattes , David A. Ruben
发明人： Michael F. Mattes , David A. Ruben
IPC分类号： G01L7/00
CPC分类号： A61B5/0215 , A61B2562/0247 , A61B2562/028 , A61N1/056 , G01L9/0072 , G01L9/12 , H01L2224/32145 , H01L2224/48091 , H01L2224/48145 , H01L2224/73265 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An implantable capacitive pressure sensor apparatus and method for making such an apparatus includes a first pressure sensor portion and a second pressure sensor portion. The first pressure sensor portion includes a diaphragm electrode connectable to ground (e.g., the diaphragm electrode being positioned in close proximity to the body when implanted therein such that the diaphragm electrode is deformable in response to pressure applied thereto by the body). The second pressure sensor portion includes a signal electrode (e.g., wherein the first pressure sensor portion and the second pressure sensor portion are coupled such that a gap is provided between the diaphragm electrode and the signal electrode) and an insulator material. The signal electrode is provided on and in direct contact with the insulator material to electrically isolate the signal electrode such that parasitic capacitance effects on the signal electrode are reduced.
摘要翻译：一种用于制造这种装置的可植入电容式压力传感器装置和方法包括第一压力传感器部分和第二压力传感器部分。第一压力传感器部分包括可连接到地面的隔膜电极（例如，当植入其中时，隔膜电极位于身体附近，使得隔膜电极响应于由身体施加到其上的压力而变形）。第二压力传感器部分包括信号电极（例如，其中第一压力传感器部分和第二压力传感器部分联接成使得在隔膜电极和信号电极之间设置间隙）和绝缘体材料。信号电极设置在绝缘体材料上并与绝缘体材料直接接触，以使信号电极电隔离，从而减小对寄生电容对信号电极的影响。

5. 发明申请

US20120161305A1 TECHNIQUES FOR BONDING SUBSTRATES USING AN INTERMEDIATE LAYER 有权
标题翻译：使用中间层粘合基板的技术
公开(公告)号：US20120161305A1
公开(公告)日：2012-06-28
申请号：US12977890
申请日：2010-12-23
申请人： David A. Ruben , Michael S. Sandlin
发明人： David A. Ruben , Michael S. Sandlin
IPC分类号： H01L23/00 , H01L21/50 , H01L21/762 , H01L21/66
CPC分类号： B32B7/04 , B32B17/06 , B32B2250/02 , B32B2457/00 , H01L21/2007 , H01L2224/16225 , H01L2224/97 , H01L2924/16195 , H05K1/0306 , H05K1/0313 , H05K1/115 , H05K1/183 , H05K2201/0175 , Y10T428/13 , Y10T428/24562 , Y10T428/265 , Y10T428/30 , Y10T428/31678
摘要： A method includes depositing a thin film on a first surface of a first substrate and moving a second surface of a second substrate into contact with the thin film such that the thin film is located between the first and second surfaces. The method further includes generating electromagnetic (EM) radiation of a first wavelength, the first wavelength selected such that the thin film absorbs EM radiation at the first wavelength. Additionally, the method includes directing the EM radiation through one of the first and second substrates and onto a region of the thin film until the first and second substrates are fused in the region.
摘要翻译：一种方法包括在第一衬底的第一表面上沉积薄膜并将第二衬底的第二表面移动为与薄膜接触，使得薄膜位于第一和第二表面之间。该方法还包括产生第一波长的电磁（EM）辐射，所述第一波长选择为使得薄膜吸收第一波长的EM辐射。此外，该方法包括将EM辐射引导通过第一和第二基板中的一个并且到薄膜的区域上，直到第一和第二基板在该区域中熔合。

6. 发明授权

US07886608B2 Pressure sensor configurations for implantable medical electrical leads 有权
标题翻译：用于植入式医疗电线的压力传感器配置
公开(公告)号：US07886608B2
公开(公告)日：2011-02-15
申请号：US12544342
申请日：2009-08-20
申请人： Kamal Deep Mothilal , Michael A. Schugt , David A. Ruben , Jonathan P. Roberts , Clark B. Norgaard , Lary R. Larson
发明人： Kamal Deep Mothilal , Michael A. Schugt , David A. Ruben , Jonathan P. Roberts , Clark B. Norgaard , Lary R. Larson
IPC分类号： G01L9/12
CPC分类号： A61N1/056 , A61B5/0215 , A61B2562/0247 , A61B2562/028 , A61B2562/182 , A61N1/0573
摘要： An implantable pressure sensor, which may be incorporated within an implantable medical electrical lead, includes an insulative sidewall, which contains a gap capacitor and an integrated circuit. The insulative sidewall of the pressure sensor includes a pressure sensitive diaphragm portion, and the gap capacitor includes a first electrode plate, which is attached to an interior surface of the diaphragm portion of the sidewall, and a second electrode plate, which is spaced apart from the first electrode plate and coupled to the integrated circuit, which is coupled, through the sidewall, to a supply contact and a ground contact. A conductive layer extends over one of the interior surface of the diaphragm portion of the sidewall and an exterior surface of the diaphragm portion; and the conductive layer is coupled to the ground contact to either shield or ground the first electrode plate.
摘要翻译：可植入的压力传感器，其可并入可植入医疗电引线内，包括绝缘侧壁，其包含间隙电容器和集成电路。压力传感器的绝缘侧壁包括压敏膜部分，并且间隙电容器包括附接到侧壁的隔膜部分的内表面的第一电极板和与侧壁隔膜部分隔开的第二电极板第一电极板并且耦合到集成电路，其通过侧壁耦合到电源触点和接地触点。导电层在侧壁的隔膜部分的内表面和隔膜部分的外表面之一上延伸; 并且所述导电层耦合到所述接地触头以屏蔽或接地所述第一电极板。

7. 发明授权

US07682878B2 Encapsulation circuitry on a substrate 有权
标题翻译：衬底上的封装电路
公开(公告)号：US07682878B2
公开(公告)日：2010-03-23
申请号：US11877408
申请日：2007-10-23
申请人： David A. Ruben , Scott B. Sleeper , Peter C. Tortorici
发明人： David A. Ruben , Scott B. Sleeper , Peter C. Tortorici
IPC分类号： H01L21/44
CPC分类号： H05K3/284 , H01L23/24 , H01L2924/0002 , H05K1/18 , H05K3/0064 , H05K2201/09063 , H05K2201/2018 , H01L2924/00
摘要： An assembly for a circuit board includes a substrate, at least one circuit component formed on the substrate, and a frame. The frame comprises a first substantially planar surface attached to the substrate, and a hole formed through the frame and defined by a wall that surrounds the at least one circuit component. A method of manufacturing the circuit board includes the step of attaching the substantially planar surface of the frame to the substrate in an arrangement in which the at least one circuit component is surrounded by a wall that defines the hole.
摘要翻译：一种用于电路板的组件包括衬底，形成在衬底上的至少一个电路部件和框架。框架包括附接到基板的第一基本上平坦的表面，以及穿过框架形成并由围绕至少一个电路部件的壁限定的孔。一种制造电路板的方法包括将框架的基本上平坦的表面附接到衬底的步骤，其中至少一个电路部件被限定孔的壁包围。

8. 发明申请

US20210178518A1 HERMETIC ASSEMBLY AND DEVICE INCLUDING SAME 有权
公开(公告)号：US20210178518A1
公开(公告)日：2021-06-17
申请号：US17118283
申请日：2020-12-10
申请人： David A. Ruben , Andreas Fenner , Andrew J. Ries , Robert A. Munoz , Christopher T. Kinsey , Mark E. Henschel
发明人： David A. Ruben , Andreas Fenner , Andrew J. Ries , Robert A. Munoz , Christopher T. Kinsey , Mark E. Henschel
IPC分类号： B23K26/20 , H05K5/06 , A61N1/39 , H01L23/522 , B23K26/32
摘要： Various embodiments of a hermetic assembly and a method of forming such assembly are disclosed. The hermetic assembly includes a dielectric substrate having a first major surface and a second major surface, a patterned layer connected to the first major surface of the dielectric substrate by a laser bond, and a ferrule having a body and a flange extending from the body. The flange is welded to a welding portion of the patterned layer that is disposed between the flange and the first major surface of the dielectric substrate such that the ferrule is hermetically sealed to the dielectric substrate.

9. 发明授权

US09616223B2 Media-exposed interconnects for transducers 有权
公开(公告)号：US09616223B2
公开(公告)日：2017-04-11
申请号：US11323896
申请日：2005-12-30
申请人： Michael A. Schugt , Kamal D. Mothilal , David A. Ruben , Lary R. Larson , Michael F. Mattes
发明人： Michael A. Schugt , Kamal D. Mothilal , David A. Ruben , Lary R. Larson , Michael F. Mattes
IPC分类号： H05K1/16 , A61N1/05 , A61B5/0215 , H05K1/02 , B81B3/00 , H01L21/48 , H05K3/40
CPC分类号： A61N1/056 , A61B5/0215 , B81B3/0072 , B81C2201/0167 , H01L21/4857 , H05K1/0271 , H05K3/4061 , H05K3/4092
摘要： Media-exposed interconnects for transducer modules are disclosed. The transducers may be sensing transducers, actuating transducers, IC-only transducers, or combinations thereof, or other suitable transducers. The transducers may be used in connection with implantable medical devices and may be exposed to various media, such as body fluids. The media-exposed interconnects for transducer modules may allow transducers to communicate electrically with other components, such as implantable medical devices.

10. 发明授权

US08666505B2 Wafer-scale package including power source 有权
标题翻译：晶圆级封装，包括电源
公开(公告)号：US08666505B2
公开(公告)日：2014-03-04
申请号：US13016253
申请日：2011-01-28
申请人： Richard J. O'Brien , John K. Day , Paul F. Gerrish , Michael F. Mattes , David A. Ruben , Malcolm K. Grief
发明人： Richard J. O'Brien , John K. Day , Paul F. Gerrish , Michael F. Mattes , David A. Ruben , Malcolm K. Grief
IPC分类号： A61N1/05
CPC分类号： H01L23/12 , A61B5/0031 , A61B5/01 , A61B5/03 , A61B5/11 , A61N1/37211 , A61N1/3758 , B81B2201/0214 , B81B2207/012 , B81C1/0023 , H01L23/58 , H01L25/0655 , H01L2223/6677 , H01L2224/16145 , H01L2224/16225 , H01L2924/1461 , H01L2924/15153 , H01L2924/15192 , H01L2924/15313 , H01L2924/16195 , H01L2924/16251 , H01L2924/19105 , H01L2924/00
摘要： A medical device includes a first substrate, a second substrate, a control module, and an energy storage device. The first substrate includes at least one of a first semiconductor material and a first insulating material. The second substrate includes at least one of a second semiconductor material and a second insulating material. The second substrate is bonded to the first substrate such that the first and second substrates define an enclosed cavity between the first and second substrates. The control module is disposed within the enclosed cavity. The control module is configured to at least one of determine a physiological parameter of a patient and deliver electrical stimulation to the patient. The energy storage device is disposed within the cavity and is configured to supply power to the control module.
摘要翻译：医疗装置包括第一基板，第二基板，控制模块和能量存储装置。第一基板包括第一半导体材料和第一绝缘材料中的至少一个。第二基板包括第二半导体材料和第二绝缘材料中的至少一个。第二基板被结合到第一基板，使得第一和第二基板在第一和第二基板之间限定封闭的空腔。控制模块设置在封闭腔内。控制模块被配置为至少确定患者的生理参数并向患者传递电刺激中的至少一个。能量存储装置设置在空腔内并被配置为向控制模块供电。

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