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1. 发明授权

US09812929B2 Electric rotating machine 有权
公开(公告)号：US09812929B2
公开(公告)日：2017-11-07
申请号：US14372493
申请日：2012-04-16
申请人： Yuji Shirakata , Dai Nakajima , Masahiko Fujita , Masaki Kato
发明人： Yuji Shirakata , Dai Nakajima , Masahiko Fujita , Masaki Kato
IPC分类号： H02K9/00 , H02K11/04 , H02P27/06 , H02K11/05 , H02K5/08 , H02K5/14 , H02K5/22 , H02K15/12 , H02K11/33
CPC分类号： H02K9/00 , H02K5/08 , H02K5/141 , H02K5/225 , H02K11/046 , H02K11/048 , H02K11/05 , H02K11/33 , H02K15/12 , H02P27/06
摘要： Two or more switching devices (36) and two or more lead frames (41, 42, 43, and 44) are integrally molded by use of a molding resin (37) so that a power module (30) is formed; the power module (30) is made to adhere to a heat sink (32) via an insulating material (31); the power module (30) and the heat sink (32) are fixed to a housing (33) of the power module composite (23); the power module composite (23) is fixed to a case (6) of an electric rotating machine (1) via the housing (33).

2. 发明授权

US09698646B2 Rotating electrical machine 有权
公开(公告)号：US09698646B2
公开(公告)日：2017-07-04
申请号：US14131482
申请日：2011-11-09
申请人： Yuji Shirakata , Dai Nakajima , Masahiko Fujita
发明人： Yuji Shirakata , Dai Nakajima , Masahiko Fujita
IPC分类号： H02K9/00 , H02K5/10 , H02K11/33
CPC分类号： H02K5/10 , H02K9/00 , H02K11/33
摘要： A rotating electrical machine includes: a case; a rotor; a stator; a control portion including a field circuit portion used to supply a current to a control circuit and the field winding; a power circuit portion controlling a stator current; a heat sink installed so as to cool the control portion and the power circuit portion; a first waterproof portion providing waterproofing to signal terminals of the power circuit portion and the field circuit portion; a second waterproof portion provided with through-holes from which a part of the control portion and the power circuit portion is exposed and providing waterproofing between the control portion as well as the power circuit portion and the heat sink; and insulation portions installed in the through-holes of the second waterproof portion and isolating the control portion and the power circuit portion from the heat sink.

3. 发明授权

US09531318B2 Rotating electrical machine 有权
标题翻译：旋转电机
公开(公告)号：US09531318B2
公开(公告)日：2016-12-27
申请号：US13879722
申请日：2010-12-10
申请人： Yuji Shirakata , Dai Nakajima , Masahiko Fujita
发明人： Yuji Shirakata , Dai Nakajima , Masahiko Fujita
IPC分类号： H02P1/04 , H02P29/00 , H02P29/02
CPC分类号： H02P29/68 , H02P29/02 , H02P29/032
摘要： Provided is a rotating electrical machine capable of downsizing. The rotating electrical machine includes: a stator (2) including an armature winding (9); a rotor (3) provided inside the stator (2) in a rotatable manner; a power circuit unit (18) including a power circuit semiconductor switching element, for supplying a current to the armature winding (9); and a control board (6) in which an energization-allowed time corresponding to revolution speed of the rotor (3) is set, for controlling supply of the current by the power circuit unit (18), in which the control board (6) stops the supply of the current by the power circuit unit (18) when an integrated time of energization times to the armature winding (9) is longer than the energization-allowed time.
摘要翻译：提供能够减小尺寸的旋转电机。旋转电机包括：定子（2），包括电枢绕组（9）; 以可旋转的方式设置在所述定子（2）内部的转子（3）电源电路单元（18），其包括用于向所述电枢绕组（9）提供电流的电源电路半导体开关元件; 以及控制板（6），其中设置与转子（3）的转速相对应的通电允许时间，用于控制电力电路单元（18）提供的电流，其中控制板（6）当对电枢绕组（9）的通电时间的积分时间长于通电允许时间时，由电力电路单元（18）停止电流的供给。

4. 发明授权

US09129949B2 Power semiconductor module 有权
标题翻译：功率半导体模块
公开(公告)号：US09129949B2
公开(公告)日：2015-09-08
申请号：US13881654
申请日：2011-02-09
申请人： Shinsuke Asada , Kenjiro Nagao , Dai Nakajima , Yuetsu Watanabe , Yoshihito Asao , Takuya Oga , Masaki Kato
发明人： Shinsuke Asada , Kenjiro Nagao , Dai Nakajima , Yuetsu Watanabe , Yoshihito Asao , Takuya Oga , Masaki Kato
IPC分类号： H01L23/495 , H01L23/12 , H01L23/00 , H01L23/36 , H01L23/31
CPC分类号： H01L23/49568 , H01L23/3107 , H01L23/36 , H01L23/49524 , H01L23/49562 , H01L23/49575 , H01L24/05 , H01L24/06 , H01L24/29 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/84 , H01L2224/04026 , H01L2224/04034 , H01L2224/04042 , H01L2224/0603 , H01L2224/06051 , H01L2224/06181 , H01L2224/291 , H01L2224/2919 , H01L2224/40137 , H01L2224/40139 , H01L2224/40247 , H01L2224/4103 , H01L2224/41051 , H01L2224/45015 , H01L2224/45124 , H01L2224/48139 , H01L2224/48247 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/83411 , H01L2224/83455 , H01L2224/83801 , H01L2224/8385 , H01L2224/84801 , H01L2924/00014 , H01L2924/01029 , H01L2924/07802 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/014 , H01L2924/00 , H01L2924/00012 , H01L2224/37099
摘要： A power semiconductor module (100) includes: an electrode plate (2) in which a body portion (2a) and an external connection terminal portion (2b) are integrally formed, and the body portion (2a) is arranged on the same flat surface; a semiconductor chip (1) mounted on one surface (mounting surface) (2c) of the body portion (2a); and a resin package (3) in which the other surface (heat dissipation surface) (2d) of the body portion (2a) is exposed, and the body portion (2a) of the electrode plate (2) and the semiconductor chip (1) are sealed with resin. The heat dissipation surface (2d) is the same surface as the bottom (3a) of the resin package (3); and consequently, heat dissipation properties and reliability are improved and a reduction in size can be achieved.
摘要翻译：功率半导体模块（100）包括：一体形成有主体部分（2a）和外部连接端子部分（2b）的电极板（2），并且主体部分（2a）布置在同一平面 ; 安装在主体部分（2a）的一个表面（安装表面）（2c）上的半导体芯片（1）; 和主体部（2a）的另一面（散热面）（2d）露出的树脂封装体（3）和电极板（2）的主体部分（2a）和半导体芯片（1））用树脂密封。散热面（2d）与树脂封装（3）的底部（3a）相同。因此，散热性和可靠性得到改善，并且可以实现尺寸的减小。

5. 发明申请

US20110193432A1 POWER SUPPLY UNIT-INTEGRATED DYNAMOELECTRIC MACHINE 有权
标题翻译：电源单元整合式电动机
公开(公告)号：US20110193432A1
公开(公告)日：2011-08-11
申请号：US12845878
申请日：2010-07-29
申请人： Atsushi TAKECHI , Dai NAKAJIMA , Hitoshi ISODA , Masahiko FUJITA
发明人： Atsushi TAKECHI , Dai NAKAJIMA , Hitoshi ISODA , Masahiko FUJITA
IPC分类号： H02K11/04 , H02K5/18 , H02K9/06
CPC分类号： H02K19/365 , H02K5/18 , H02K9/06 , H02K11/048
摘要： A dynamoelectric machine main body that includes: a housing that is constituted by a rear bracket and a front bracket; a rotor; a stator; and a fan, and a power supply unit that is mounted integrally onto the dynamoelectric machine main body are included, the power supply unit is disposed between the fan and a bottom portion of the rear bracket, and the power supply unit is disposed between the fan and a bottom portion of the rear bracket, and the rear bracket has: air discharge ports that are formed on portions that are positioned radially outside the fan; and air suction ports that have openings nearer to a bottom portion than the power supply unit, and includes a partitioning member for configuring a ventilation channel that extends from the air suction ports to the air discharge ports that is disposed between the power supply unit and the fan.
摘要翻译：一种电动机主体，包括：由后支架和前支架构成的壳体; 转子定子包括风扇和一体地安装在电动机主体上的电源单元，电源单元设置在风扇和后支架的底部之间，电源单元设置在风扇之间和后支架的底部，后支架具有：形成在位于风扇径向外侧的部分上的排气口; 以及空气吸入口，其具有比所述电源单元更靠近底部的开口，并且包括用于配置从所述空气吸入口延伸到所述排气口的通气通道的分隔构件，所述排气口设置在所述电源单元和风扇。

6. 发明申请

US20110175496A1 CONTROL APPARATUS-INTEGRATED DYNAMOELECTRIC MACHINE 有权
标题翻译：控制装置一体化电动机
公开(公告)号：US20110175496A1
公开(公告)日：2011-07-21
申请号：US12819678
申请日：2010-06-21
申请人： Yuji SHIRAKATA , Dai Nakajima , Masahiko Fujita , Masaki Kato , Kazuyasu Sakamoto , Takuya Oga
发明人： Yuji SHIRAKATA , Dai Nakajima , Masahiko Fujita , Masaki Kato , Kazuyasu Sakamoto , Takuya Oga
IPC分类号： H02K7/00
CPC分类号： H02P9/48 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2924/181 , H01L2924/1815 , H02K11/048 , H02K19/365 , H02P2101/45 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
摘要： A dynamoelectric machine main body, power circuit modules and a field circuit module, and a control apparatus that has a heatsink that is prepared by die casting, and that is mounted integrally onto the dynamoelectric machine main body are included, the heatsink including a plurality of convex heat receiving portions that are disposed so as to project from a front surface of a base plate, and that have heat receiving surfaces, the power circuit modules and the field circuit module including seal main body portions that are constituted by an electrically insulating resin that seal switching elements so as to expose bottom surfaces of element heat radiating portions on reference surfaces that have a surface shape that corresponds to a shape of the heat receiving surfaces, and electrical insulation supporting layers being interposed between the bottom surfaces of the heat receiving surfaces and the element heat radiating portions.
摘要翻译：电动机主体，电力电路模块和现场电路模块以及具有通过压铸制造的散热器并且整体安装在电动机械主体上的控制装置的散热器包括多个凸形受热部，其从基板的前表面突出设置并具有受热面，所述电源电路模块和励磁电路模块包括由电绝缘树脂构成的密封主体部，密封开关元件，以便露出具有与受热表面形状相对应的表面形状的参考表面上的元件散热部分的底表面，以及插入在热接收表面的底表面之间的电绝缘支撑层，以及元件散热部分。

7. 发明授权

US07151311B2 Mold resin-sealed power semiconductor device having insulating resin layer fixed on bottom surface of heat sink and metal layer on the resin layer 有权
标题翻译：模具树脂密封功率半导体器件具有固定在散热器底面上的绝缘树脂层和树脂层上的金属层
公开(公告)号：US07151311B2
公开(公告)日：2006-12-19
申请号：US10413288
申请日：2003-04-15
申请人： Dai Nakajima , Kazuhiro Tada , Taketoshi Shikano , Yasunari Hino
发明人： Dai Nakajima , Kazuhiro Tada , Taketoshi Shikano , Yasunari Hino
IPC分类号： H01L23/34
CPC分类号： H01L23/49537 , H01L21/565 , H01L23/42 , H01L23/4334 , H01L23/49562 , H01L24/28 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L2224/2929 , H01L2224/29386 , H01L2224/32014 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2224/73265 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/0105 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15787 , H01L2924/181 , H01L2924/2076 , H01L2924/351 , H01L2924/00014 , H01L2924/00 , H01L2924/3512 , H01L2924/0503 , H01L2924/0665 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2924/00012
摘要： An insulating sheet consisting of a metal layer and an unhardened insulating resin layer is formed. The insulating resin layer contains a filler having grains of, e.g., scale-like shape and has thixotropy, and its outer size is larger than that of a bottom surface of a metal plate. The insulating sheet is disposed on a bottom surface of a cavity of a mold die and the metal plate is disposed on an upper surface of the insulating resin layer. On a main surface of the metal plate, a power semiconductor chip connected to a frame and another frame through a wire is mounted. The cavity is fully filled with a liquid mold resin in this state. After that, the insulating resin layer is hardened at the same timing as the hardening of the mold resin, and the insulating resin and the metal plate are fixed to each other. An interface between the insulating resin layer and the metal plate is included in the upper surface of the insulating resin layer.
摘要翻译：形成由金属层和未硬化的绝缘树脂层构成的绝缘片。绝缘树脂层含有具有例如鳞片状的颗粒的具有触变性的填料，其外形尺寸大于金属板的底面的外形尺寸。绝缘片设置在模具的模腔的底面上，并且金属板设置在绝缘树脂层的上表面上。在金属板的主表面上安装有通过线连接到框架和另一框架的功率半导体芯片。在这种状态下，模腔充满液态树脂。之后，绝缘树脂层在与模制树脂的硬化相同的时刻硬化，绝缘树脂和金属板相互固定。绝缘树脂层和金属板之间的界面包括在绝缘树脂层的上表面中。

8. 发明授权

US06984884B2 Electric power semiconductor device 有权
标题翻译：电力半导体装置
公开(公告)号：US06984884B2
公开(公告)日：2006-01-10
申请号：US10836262
申请日：2004-05-03
申请人： Masao Kikuchi , Dai Nakajima , Koichi Tsurusako , Kunihiro Yoshihara
发明人： Masao Kikuchi , Dai Nakajima , Koichi Tsurusako , Kunihiro Yoshihara
IPC分类号： H01L23/48
CPC分类号： H01L24/85 , H01L23/49541 , H01L23/49562 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05552 , H01L2224/05554 , H01L2224/0603 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48247 , H01L2224/48463 , H01L2224/48472 , H01L2224/49111 , H01L2224/49175 , H01L2224/85205 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/18301 , H01L2924/2076 , H01L2224/78 , H01L2924/00 , H01L2924/00012
摘要： A main lead (2) is a single body comprised of an inner lead (2a) and an outer lead (2b) which are integrally formed, the bonding wires are arranged in parallel and fixed onto the inner lead (2a) by the wire bonding portions (3b), and the outer lead are exposed from the mold resin to the outside for electrical connection, and a plurality of through holes (8) penetrating the main terminal lead are formed in the outer vicinity of the wire bonding portions (3b) within the inner lead (2a), and the through holes are arranged substantially in parallel to the arrangement direction of the wire bonding portions (3b) so as to correspond to the entire wire bonding portions (3b).
摘要翻译：主引线（2）是由一体形成的内引线（2a）和外引线（2b）组成的单体，所述接合线平行布置并固定在内引线（2a）上，通过引线接合部（3b）和外引线从模制树脂露出到外部进行电连接，并且在引线接合的外部附近形成有贯穿主端子引线的多个通孔（8）内部引线（2a）内的部分（3b）和通孔与导线接合部分（3b）的布置方向基本上平行地布置，以便对应于整个引线接合部分（3b）。

9. 发明授权

US06900986B2 Power module 有权
标题翻译：电源模块
公开(公告)号：US06900986B2
公开(公告)日：2005-05-31
申请号：US10810832
申请日：2004-03-29
申请人： Nobuyoshi Kimoto , Takanobu Yoshida , Naoki Yoshimatsu , Masuo Koga , Dai Nakajima , Gourab Majumdar , Masakazu Fukada
发明人： Nobuyoshi Kimoto , Takanobu Yoshida , Naoki Yoshimatsu , Masuo Koga , Dai Nakajima , Gourab Majumdar , Masakazu Fukada
IPC分类号： H01L23/057 , H01L23/50 , H01L23/60 , H01L25/07 , H01L25/18 , H02M1/00 , H02M7/00 , H02M7/04 , H05K7/20
CPC分类号： H02M7/003 , H01L23/057 , H01L23/50 , H01L23/60 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/072 , H01L2224/32225 , H01L2224/45124 , H01L2224/48091 , H01L2224/4811 , H01L2224/48137 , H01L2224/48227 , H01L2224/49109 , H01L2224/73265 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01074 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1532 , H01L2924/16152 , H01L2924/19041 , H01L2924/19107 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , H01L2924/351 , H01L2924/00014 , H01L2924/00
摘要： A power module includes a first substrate with a power semiconductor device mounted thereon, a second substrate with a control circuit for controlling the power semiconductor device formed thereon, a smoothing capacitor electrically connected to the power semiconductor device for smoothing a voltage to be externally supplied to the power semiconductor device, and a case including a case frame and a case lid. The case has an interior in which the first substrate, the second substrate and the smoothing capacitor are disposed, and the smoothing capacitor is disposed in contact with a side surface of the case frame.
摘要翻译：功率模块包括其上安装有功率半导体器件的第一衬底，具有用于控制其上形成的功率半导体器件的控制电路的第二衬底，电连接到功率半导体器件的平滑电容器，用于平滑外部供应到功率半导体器件，以及包括壳体框架和壳体盖的壳体。壳体具有其中设置有第一基板，第二基板和平滑电容器的内部，并且平滑电容器设置成与壳体框架的侧表面接触。

10. 发明授权

US06753596B1 Resin-sealed semiconductor device 有权
标题翻译：树脂密封半导体器件
公开(公告)号：US06753596B1
公开(公告)日：2004-06-22
申请号：US10436262
申请日：2003-05-13
申请人： Dai Nakajima , Kiyoshi Ishida , Taketoshi Shikano
发明人： Dai Nakajima , Kiyoshi Ishida , Taketoshi Shikano
IPC分类号： H01L23495
CPC分类号： H01L24/85 , H01L23/3121 , H01L23/3142 , H01L23/4334 , H01L23/49562 , H01L24/32 , H01L24/45 , H01L24/48 , H01L2224/27013 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/73265 , H01L2224/83051 , H01L2224/85009 , H01L2224/85205 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01068 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2924/18301 , H01L2924/351 , H01L2224/78 , H01L2924/00012 , H01L2924/00 , H01L2924/3512
摘要： A resin-sealed semiconductor device includes a metallic plate and a semiconductor element soldered thereto. The metallic plate has a semiconductor element mounting region formed on one surface thereof and a plurality of squared recesses defined lengthwise and crosswise in the one surface at approximately regular intervals at locations other than the semiconductor element mounting region.
摘要翻译：树脂密封半导体器件包括金属板和焊接到其上的半导体元件。金属板具有在其一个表面上形成的半导体元件安装区域和在半导体元件安装区域之外的位置处以大致规则的间隔在一个表面中纵向和横向限定的多个平方的凹槽。

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