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    • 5. 发明申请
    • MEMORY DEVICE
    • 内存设备
    • US20130315013A1
    • 2013-11-28
    • US13609499
    • 2012-09-11
    • Bo-Kyeom Kim
    • Bo-Kyeom Kim
    • G11C7/10
    • G11C29/808G11C7/1039
    • A memory device includes a first main page buffer array configured to access data of a first main memory array; a second main page buffer array configured to access data of a second main memory array; a redundancy page buffer array configured to access data of a redundancy memory array replacing the first and second main memory array; a first redundancy transfer unit configured to transfer data between the redundancy page buffer array and the outside of the memory device through a first redundancy bus, when a first column address indicates one or more defective columns of the first main memory array; and a second redundancy transfer unit configured to transfer data between the redundancy page buffer array and the outside through a second redundancy bus, when a second column address indicates one or more defective columns of the second main memory array.
    • 存储器件包括:第一主页缓冲器阵列,被配置为访问第一主存储器阵列的数据; 配置为访问第二主存储器阵列的数据的第二主页缓冲器阵列; 冗余页缓冲器阵列,被配置为访问代替所述第一和第二主存储器阵列的冗余存储器阵列的数据; 第一冗余传送单元,被配置为当第一列地址指示第一主存储器阵列的一个或多个缺陷列时,通过第一冗余总线在冗余页缓冲器阵列和存储器件外部之间传送数据; 以及第二冗余传送单元,被配置为当第二列地址指示第二主存储器阵列的一个或多个有缺陷的列时,通过第二冗余总线在冗余页缓冲器阵列和外部之间传送数据。
    • 7. 发明授权
    • Memory device with redundancy page buffer array
    • 具有冗余页面缓冲区数组的内存设备
    • US09190176B2
    • 2015-11-17
    • US13609499
    • 2012-09-11
    • Bo-Kyeom Kim
    • Bo-Kyeom Kim
    • G11C29/00G11C7/10
    • G11C29/808G11C7/1039
    • A memory device includes a first main page buffer array configured to access data of a first main memory array; a second main page buffer array configured to access data of a second main memory array; a redundancy page buffer array configured to access data of a redundancy memory array replacing the first and second main memory array; a first redundancy transfer unit configured to transfer data between the redundancy page buffer array and the outside of the memory device through a first redundancy bus, when a first column address indicates one or more defective columns of the first main memory array; and a second redundancy transfer unit configured to transfer data between the redundancy page buffer array and the outside through a second redundancy bus, when a second column address indicates one or more defective columns of the second main memory array.
    • 存储器件包括:第一主页缓冲器阵列,被配置为访问第一主存储器阵列的数据; 配置为访问第二主存储器阵列的数据的第二主页缓冲器阵列; 冗余页缓冲器阵列,被配置为访问代替所述第一和第二主存储器阵列的冗余存储器阵列的数据; 第一冗余传送单元,被配置为当第一列地址指示第一主存储器阵列的一个或多个缺陷列时,通过第一冗余总线在冗余页缓冲器阵列和存储器件外部之间传送数据; 以及第二冗余传送单元,被配置为当第二列地址指示第二主存储器阵列的一个或多个有缺陷的列时,通过第二冗余总线在冗余页缓冲器阵列和外部之间传送数据。
    • 9. 发明授权
    • Semiconductor device
    • 半导体器件
    • US07940576B2
    • 2011-05-10
    • US12323687
    • 2008-11-26
    • Bo-Kyeom KimSang-Sic Yoon
    • Bo-Kyeom KimSang-Sic Yoon
    • G11C7/10
    • G11C7/1078G11C7/1039G11C7/1084G11C7/1096G11C8/06G11C8/12G11C11/408G11C11/4093G11C11/4096
    • There is provided a semiconductor memory device, including: a plurality of bank groups each comprising a plurality of banks; a plurality of data pads grouped by a predetermined number for receiving data for the bank groups, wherein the data pads are divided into a plurality of first pad groups receiving data and a plurality of second pad groups selectively receiving data according to a data input/output option value; a first driving unit configured to drive data input via the first pad group to transfer the data input via the first pad group to the bank group corresponding to the first pad group; a second driving unit configured to drive data input via the second pad group to transfer the data input via the second pad group to the bank group corresponding to the second pad group; and a third driving unit configured to drive data input via the first pad group to transfer the data input via the first pad group to the bank group corresponding to the second pad group in response to the data input/output option value.
    • 提供了一种半导体存储器件,包括:多个银行组,每个组包括多个存储体; 多个用于接收银行组的数据的预定数量的数据焊盘,其中数据焊盘被分成多个接收数据的第一焊盘组和根据数据输入/输出有选择地接收数据的多个第二焊盘组 期权价值 第一驱动单元,被配置为驱动经由所述第一焊盘组输入的数据,以将经由所述第一焊盘组输入的数据传送到对应于所述第一焊盘组的所述存储体组; 第二驱动单元,被配置为驱动经由所述第二焊盘组输入的数据,以将经由所述第二焊盘组输入的数据传送到对应于所述第二焊盘组的所述存储体组; 以及第三驱动单元,被配置为响应于所述数据输入/输出选项值,经由所述第一焊盘组驱动经由所述第一焊盘组输入的数据到与所述第二焊盘组对应的所述存储体组。
    • 10. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • US20090273990A1
    • 2009-11-05
    • US12323687
    • 2008-11-26
    • Bo-Kyeom KIMSang-Sic YOON
    • Bo-Kyeom KIMSang-Sic YOON
    • G11C7/00G11C8/00
    • G11C7/1078G11C7/1039G11C7/1084G11C7/1096G11C8/06G11C8/12G11C11/408G11C11/4093G11C11/4096
    • There is provided a semiconductor memory device, including: a plurality of bank groups each comprising a plurality of banks; a plurality of data pads grouped by a predetermined number for receiving data for the bank groups, wherein the data pads are divided into a plurality of first pad groups receiving data and a plurality of second pad groups selectively receiving data according to a data input/output option value; a first driving unit configured to drive data input via the first pad group to transfer the data input via the first pad group to the bank group corresponding to the first pad group; a second driving unit configured to drive data input via the second pad group to transfer the data input via the second pad group to the bank group corresponding to the second pad group; and a third driving unit configured to drive data input via the first pad group to transfer the data input via the first pad group to the bank group corresponding to the second pad group in response to the data input/output option value.
    • 提供了一种半导体存储器件,包括:多个银行组,每个组包括多个存储体; 多个用于接收银行组的数据的预定数量的数据焊盘,其中数据焊盘被分成多个接收数据的第一焊盘组和根据数据输入/输出有选择地接收数据的多个第二焊盘组 期权价值 第一驱动单元,被配置为驱动经由所述第一焊盘组输入的数据,以将经由所述第一焊盘组输入的数据传送到对应于所述第一焊盘组的所述存储体组; 第二驱动单元,被配置为驱动经由所述第二焊盘组输入的数据,以将经由所述第二焊盘组输入的数据传送到对应于所述第二焊盘组的所述存储体组; 以及第三驱动单元,被配置为响应于所述数据输入/输出选项值,经由所述第一焊盘组驱动经由所述第一焊盘组输入的数据到与所述第二焊盘组对应的所述存储体组。