专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08873920B2 Light-guiding cover structure 有权
标题翻译：导光罩结构
公开(公告)号：US08873920B2
公开(公告)日：2014-10-28
申请号：US13425829
申请日：2012-03-21
申请人： Bily Wang , Kuei-Pao Chen , Hsin-Cheng Chen , Cheng-Chin Chiu
发明人： Bily Wang , Kuei-Pao Chen , Hsin-Cheng Chen , Cheng-Chin Chiu
IPC分类号： G02B6/00
CPC分类号： G02B6/4298 , G01J2001/4252 , G01R31/2635 , G02B6/3616 , G02B6/3644
摘要： A light-guiding cover structure includes a top cover unit and a light-guiding unit. The top cover unit has a plurality of receiving spaces formed therein. The light-guiding unit includes a plurality of light-guiding groups, wherein each light-guiding group includes a plurality of optical fiber cables received in the corresponding receiving space, and each optical fiber cable has two opposite ends exposed from the bottom surface of the top cover unit and respectively facing at least one light-emitting device and at least one light-sensing device that have been disposed under the top cover unit. Therefore, the optical fiber cables received in the corresponding receiving space, thus when the light-guiding cover structure is applied to the LED package chip classification system, the aspect of the LED package chip classification system can be enhanced.
摘要翻译：导光罩结构包括顶盖单元和导光单元。顶盖单元具有形成在其中的多个接收空间。导光单元包括多个导光组，其中每个导光组包括容纳在相应接收空间中的多根光纤电缆，并且每根光纤电缆具有两个相对端从第并且分别面向至少一个发光装置和已经设置在顶盖单元下的至少一个光感测装置。因此，光纤电缆在相应的接收空间中被接收，因此当导光盖结构被应用于LED封装芯片分类系统时，可以提高LED封装芯片分类系统的方面。

2. 发明授权

US08686310B2 Packaged chip detection and classification device 有权
标题翻译：封装芯片检测和分类装置
公开(公告)号：US08686310B2
公开(公告)日：2014-04-01
申请号：US13170705
申请日：2011-06-28
申请人： Bily Wang , Kuei-Pao Chen , Hsin-Cheng Chen
发明人： Bily Wang , Kuei-Pao Chen , Hsin-Cheng Chen
IPC分类号： B07C5/344
CPC分类号： B07C5/00 , B07C5/344 , G01R31/01 , G01R31/2893
摘要： A packaged chip detection and classification device includes a rotation unit for transporting a plurality of packaged chips, a packaged chip detection unit, and a packaged chip classification unit. The rotation unit includes a rotary turntable, a plurality of receiving portions formed on the rotary turntable, and a plurality of suction-exhaust openings respectively formed in the receiving portions. Each receiving portion is used to selectively receive at least one of the packaged chips. The packaged chip detection unit includes a packaged chip detection module adjacent to the rotation unit for detecting each packaged chip. The packaged chip classification unit includes a packaged chip classification module adjacent to the rotation unit for classifying the packaged chips. Therefore, the packaged chip detection and classification device can be used to detect and classify no-lead packaged chips by matching the rotation unit, the packaged chip detection unit, and the packaged chip classification unit.
摘要翻译：封装芯片检测和分类装置包括用于传输多个封装芯片的转动单元，封装芯片检测单元和封装芯片分类单元。旋转单元包括旋转转盘，形成在旋转转盘上的多个接收部分和分别形成在接收部分中的多个抽吸排气口。每个接收部分用于选择性地接收至少一个封装的芯片。封装芯片检测单元包括与用于检测每个封装芯片的旋转单元相邻的封装芯片检测模块。封装芯片分类单元包括与旋转单元相邻的封装芯片分类模块，用于对封装芯片进行分类。因此，封装芯片检测和分类装置可以通过匹配旋转单元，封装芯片检测单元和封装芯片分类单元来检测和分类无铅封装芯片。

3. 发明授权

US08421884B2 GPS device with a display function and method for using the same 有权
标题翻译：具有显示功能的GPS装置及其使用方法
公开(公告)号：US08421884B2
公开(公告)日：2013-04-16
申请号：US12554924
申请日：2009-09-07
申请人： Bily Wang , Yuan-Hsiu Yang
发明人： Bily Wang , Yuan-Hsiu Yang
IPC分类号： H04N5/225 , H04N5/76
CPC分类号： H04N5/772 , G01S19/13 , H04N9/8205
摘要： A GPS device with a display function includes a GPS recorder and a display screen. The GPS recorder has a GPS casing that encloses one part of the display screen and only a display area of the display screen is exposed. The display screen is electrically disposed on the GPS recorder, and the display screen displays pattern in order to show time information and the position information that have been captured by the GPS recorder. In addition, the GPS recorder has a memory disposed therein for storing the time information and the position information.
摘要翻译：具有显示功能的GPS装置包括GPS记录器和显示屏。 GPS记录器具有GPS壳体，其包围显示屏幕的一部分，并且仅显示屏幕的显示区域被暴露。显示屏电气地设置在GPS记录器上，并且显示屏幕显示图案以便显示由GPS记录器捕获的时间信息和位置信息。此外，GPS记录器具有设置在其中的存储时间信息和位置信息的存储器。

4. 发明授权

US08162514B2 Illumination device with a fire-fighting function 有权
标题翻译：具有消防功能的照明装置
公开(公告)号：US08162514B2
公开(公告)日：2012-04-24
申请号：US12243215
申请日：2008-10-01
申请人： Bily Wang
发明人： Bily Wang
IPC分类号： F21V5/00 , F21V9/12
CPC分类号： F21V33/0064 , A62C31/00 , A62C35/02 , F21S9/022 , F21V23/0442 , F21Y2115/10 , G02B6/0081
摘要： An illumination device with a fire-fighting function includes a transparent hollow casing, fire-fighting water, a light-emitting unit, and a light-guiding unit. The transparent hollow casing has a receiving space. The fire-fighting water is filled into the receiving space of the transparent hollow casing. The light-emitting unit has a plurality of light-emitting elements disposed beside one or more lateral sides of the transparent hollow casing. The light-guiding unit is disposed over the transparent hollow casing. Hence, when fire accident happens, the transparent hollow casing will melt and crack due to the developed over-heat, and the fire-fighting water is sprayed out from the receiving spaces in order to extinguish one part of flames. Therefore, the present invention can be used as a lighting device or can be used as a fire-fighting device when fire accident happens.
摘要翻译：具有消防功能的照明装置包括透明中空壳体，消防水，发光单元和导光单元。透明中空壳体具有容纳空间。消防水被填充到透明中空壳体的接收空间中。发光单元具有设置在透明中空壳体的一个或多个侧面旁边的多个发光元件。导光单元设置在透明中空壳体的上方。因此，当发生火灾事故时，透明中空套管由于发热过热而熔化和裂开，消防水从接收空间喷出以熄灭一部分火焰。因此，本发明可以用作照明装置，也可以在火灾事故发生时用作消防装置。

5. 发明授权

US08107720B2 Detection system for detecting appearances of many electronic elements and methods of using the same 有权
标题翻译：用于检测许多电子元件外观的检测系统及其使用方法
公开(公告)号：US08107720B2
公开(公告)日：2012-01-31
申请号：US12453636
申请日：2009-05-18
申请人： Bily Wang , Kuei-Pao Chen , Hsin-Cheng Chen , Ming-Hao Chou , Ren-Chun Ni
发明人： Bily Wang , Kuei-Pao Chen , Hsin-Cheng Chen , Ming-Hao Chou , Ren-Chun Ni
IPC分类号： G06K9/00
CPC分类号： G06T7/0006 , G06T2207/30164
摘要： A detection system for detecting appearances of many electronic elements includes a rotary module, a feeding module and a detection module. The rotary module has a base structure and a hollow transparent rotary structure disposed on the base structure. The feeding module is disposed beside one side of the hollow transparent rotary structure in order to sequentially guide the electronic elements to the top surface of the hollow transparent rotary structure. The detection module has a plurality of detection units sequentially disposed around the hollow transparent rotary structure. Each detection unit is composed of an image-sensing element for sensing the electronic elements, an image-capturing element for capturing surface images of the electronic elements and a classifying element for classifying the electronic elements.
摘要翻译：用于检测许多电子元件的外观的检测系统包括旋转模块，馈送模块和检测模块。旋转模块具有底座结构和设置在基座结构上的中空透明旋转结构。馈送模块设置在中空透明旋转结构的一侧旁边，以便顺序地将电子元件引导到中空透明旋转结构的顶表面。检测模块具有多个依次设置在中空透明旋转结构周围的检测单元。每个检测单元由用于感测电子元件的图像感测元件，用于捕获电子元件的表面图像的图像捕获元件和用于分类电子元件的分类元件组成。

6. 发明授权

US08053885B2 Wafer level vertical diode package structure and method for making the same 有权
标题翻译：晶圆级垂直二极管封装结构及制作方法
公开(公告)号：US08053885B2
公开(公告)日：2011-11-08
申请号：US12318876
申请日：2009-01-12
申请人： Bily Wang , Sung-Yi Hsiao , Jack Chen
发明人： Bily Wang , Sung-Yi Hsiao , Jack Chen
IPC分类号： H01L23/485
CPC分类号： H01L29/0657 , H01L21/6836 , H01L23/31 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/16 , H01L24/17 , H01L24/45 , H01L24/48 , H01L24/96 , H01L2224/0401 , H01L2224/04042 , H01L2224/04105 , H01L2224/05 , H01L2224/12105 , H01L2224/13099 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/0101 , H01L2924/01011 , H01L2924/01014 , H01L2924/01015 , H01L2924/01021 , H01L2924/01046 , H01L2924/0107 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2924/00015 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： A wafer level vertical diode package structure includes a first semiconductor layer, a second semiconductor layer, an insulative unit, a first conductive structure, and a second conductive structure. The second semiconductor layer is connected with one surface of the first semiconductor layer. The insulative unit is disposed around a lateral side of the first semiconductor layer and a lateral side of the second semiconductor layer. The first conductive structure is formed on a top surface of the first semiconductor layer and on one lateral side of the insulative layer. The second conductive structure is formed on a top surface of the second semiconductor layer and on another opposite lateral side of the insulative layer.
摘要翻译：晶圆级垂直二极管封装结构包括第一半导体层，第二半导体层，绝缘单元，第一导电结构和第二导电结构。第二半导体层与第一半导体层的一个表面连接。绝缘单元围绕第一半导体层的侧面和第二半导体层的横向侧设置。第一导电结构形成在第一半导体层的顶表面和绝缘层的一个侧面上。第二导电结构形成在第二半导体层的顶表面上，在绝缘层的另一个相对的侧面上。

7. 发明申请

US20110156060A1 Light emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereof 审中-公开
公开(公告)号：US20110156060A1
公开(公告)日：2011-06-30
申请号：US12845719
申请日：2010-07-28
申请人： Bily Wang , Feng-Hui Chuang , Wen-Kuei Wu
发明人： Bily Wang , Feng-Hui Chuang , Wen-Kuei Wu
IPC分类号： H01L33/48
CPC分类号： H01L25/0753 , H01L33/54 , H01L33/642 , H01L2224/48091 , H01L2924/00014
摘要： A light emission module is provided. The light emission module includes a substrate, a plurality of LED chips disposed on the substrate, a fluorescent colloid and a package colloid surrounding the plurality of LED chips. The substrate includes a substrate body and a plurality of chip pads disposed thereon for carrying the LED chips. A plurality of via holes is formed passing through the chip pads and the substrate body to enhance the heat dissipation of the LED chips. The fluorescent colloid and the package colloid both have light guide structures to improve the color stability and the capacity to process the light shape of the light emission module.

8. 发明授权

US07964420B2 LED chip package structure with an embedded ESD function and method for manufacturing the same 有权
公开(公告)号：US07964420B2
公开(公告)日：2011-06-21
申请号：US12876408
申请日：2010-09-07
申请人： Bily Wang , Ping-Chou Yang , Jia-Wen Chen
发明人： Bily Wang , Ping-Chou Yang , Jia-Wen Chen
IPC分类号： H01L33/48 , H01L21/00 , H02H9/00
CPC分类号： H01L25/167 , H01L2224/48091 , H01L2224/48247 , Y10T29/41 , H01L2924/00014
摘要： An LED chip package structure includes a conductive unit, a first package unit, an ESD unit, a second package unit, a light-emitting unit and a second package unit. The conductive unit has two conductive pins adjacent to each other which form a concave space between each other. The first package unit encloses one part of each conductive pin in order to form a receiving space communicating with the concave space and to expose an end side of each conductive pin. The ESD unit is received in the concave space and electrically connected between the two conductive pins. The second package unit is received in the concave space in order to cover the ESD unit. The light-emitting unit is received in the receiving space and electrically connected between the two conductive pins. The third package unit is received in the receiving space in order to cover the light-emitting unit.

9. 发明授权

US07898663B2 Uniform light generating system for testing an image-sensing device and method of using the same 有权
标题翻译：用于测试图像感测装置的均匀光产生系统及其使用方法
公开(公告)号：US07898663B2
公开(公告)日：2011-03-01
申请号：US12285191
申请日：2008-09-30
申请人： Bily Wang , Kuei-Pao Chen , Chih-Ming Wang
发明人： Bily Wang , Kuei-Pao Chen , Chih-Ming Wang
IPC分类号： G01J3/40 , G01B9/00
CPC分类号： G01J1/10 , G01J1/0271 , G01J1/04 , G01J1/0411 , G01J1/0422 , G01J1/08 , G01J2001/083 , G01M11/0264 , G02B19/0028 , G02B19/0066 , G02B27/0977 , G02B27/0994
摘要： A uniform light generating system for testing an image-sensing device includes a light-generating unit, a light-transmitting unit, a light-diffusing unit, and a lens unit. The light-generating unit has a substrate and a plurality of light-emitting elements electrically disposed on the substrate. The light-transmitting unit has one side communicated with the light-generating unit for receiving and uniformizing light beams projected from the light-emitting elements. The light-diffusing unit has one side disposed on the other side of the light-transmitting unit for receiving and diffusing the light beams that have passed through the light-transmitting unit. The lens unit is disposed on the other side of the light-diffusing unit for transmitting the light beams that have passed through the light-diffusing unit to the image-sensing device.
摘要翻译：用于测试图像感测装置的均匀光产生系统包括发光单元，光发射单元，光漫射单元和透镜单元。光产生单元具有基板和电气设置在基板上的多个发光元件。光发射单元具有与发光单元连通的用于接收并均匀化从发光元件投射的光束的一侧。光漫射单元的一侧设置在透光单元的另一侧，用于接收并扩散已经通过光发射单元的光束。透镜单元设置在光漫射单元的另一侧，用于将已经通过光漫射单元的光束传输到图像感测装置。

10. 发明授权

US07803641B2 Mold structure for packaging LED chips and method thereof 有权
标题翻译：包装LED芯片的模具结构及其方法
公开(公告)号：US07803641B2
公开(公告)日：2010-09-28
申请号：US11854066
申请日：2007-09-12
申请人： Bily Wang , Jonnie Chuang , Hui-Yen Huang
发明人： Bily Wang , Jonnie Chuang , Hui-Yen Huang
IPC分类号： H01L21/66 , H01L21/00
CPC分类号： H01L21/565 , H01L21/561 , H01L2224/97 , H01L2224/85
摘要： A mold structure for packaging LED chips includes a top mold and a bottom mold. The bottom mold is mated with the top mold. The bottom mold has a main flow channel, a plurality of receiving spaces formed beside the main flow channel, a plurality of secondary flow channels for respectively and transversely communicating the receiving spaces with each other, and a plurality of ejection pins penetrating through the bottom mold.
摘要翻译：用于封装LED芯片的模具结构包括顶模和底模。底模与上模相配。底模具有主流道，在主流路旁边形成有多个接收空间，分别形成多个用于使接收空间相互横向连通的二次流动通道，以及贯穿底模的多个排出销。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式