专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20100006880A1 Led chip package structure using sedimentation and method for making the same 审中-公开
标题翻译： LED芯片封装结构采用沉淀法制作相同的方法
公开(公告)号：US20100006880A1
公开(公告)日：2010-01-14
申请号：US12457222
申请日：2009-06-04
申请人： Bily Wang , Shih-Yu Wu , Chao-Yuan Huang , Ping-Chou Yang , Cheng-Yen Chiang
发明人： Bily Wang , Shih-Yu Wu , Chao-Yuan Huang , Ping-Chou Yang , Cheng-Yen Chiang
IPC分类号： H01L33/00 , H01L21/56
CPC分类号： H01L33/52 , H01L33/508 , H01L2224/48091 , H01L2924/181 , H01L2933/0041 , H01L2924/00014 , H01L2924/00012
摘要： An LED chip package structure using sedimentation includes a package body, at least two conductive substrates, at least one light-emitting element, and a package unit. The package body has a receiving space. The two conductive substrates are received in the receiving space. The light-emitting element is received in the receiving space and electrically connected to the two conductive substrates. The package unit has a package colloid layer and a powder mixed into the package colloid layer, and the package unit is filled into the receiving space. The powder is uniformly deposited in the receiving space by maintaining the package unit at room temperature firstly and the powder is solidified in the receiving space by heating to a predetermined temperature.
摘要翻译：使用沉淀的LED芯片封装结构包括封装体，至少两个导电基板，至少一个发光元件和封装单元。包装体具有接收空间。两个导电基板被接收在接收空间中。发光元件被容纳在接收空间中并与两个导电基板电连接。包装单元具有包装胶体层和混合到包装胶体层中的粉末，并且包装单元填充到容纳空间中。首先将包装单元保持在室温下，将粉末均匀地沉积在接收空间中，并通过加热到预定温度使粉末在接收空间中固化。

2. 发明授权

US07876593B2 LED chip package structure with an embedded ESD function and method for manufacturing the same 有权
标题翻译：具有嵌入式ESD功能的LED芯片封装结构及其制造方法
公开(公告)号：US07876593B2
公开(公告)日：2011-01-25
申请号：US12243016
申请日：2008-10-01
申请人： Bily Wang , Ping-Chou Yang , Jia-Wen Chen
发明人： Bily Wang , Ping-Chou Yang , Jia-Wen Chen
IPC分类号： H01L33/00 , H01L21/00 , H02H9/00
CPC分类号： H01L25/167 , H01L2224/48091 , H01L2224/48247 , Y10T29/41 , H01L2924/00014
摘要： An LED chip package structure includes a conductive unit, a first package unit, an ESD unit, a second package unit, a light-emitting unit and a second package unit. The conductive unit has two conductive pins adjacent to each other which form a concave space between each other. The first package unit encloses one part of each conductive pin in order to form a receiving space communicating with the concave space and to expose an end side of each conductive pin. The ESD unit is received in the concave space and electrically connected between the two conductive pins. The second package unit is received in the concave space in order to cover the ESD unit. The light-emitting unit is received in the receiving space and electrically connected between the two conductive pins. The third package unit is received in the receiving space in order to cover the light-emitting unit.
摘要翻译： LED芯片封装结构包括导电单元，第一封装单元，ESD单元，第二封装单元，发光单元和第二封装单元。导电单元具有彼此相邻的两个导电销，它们彼此之间形成凹形空间。第一封装单元包围每个导电引脚的一部分，以便形成与凹入空间连通并且暴露每个导电引脚的端侧的接收空间。 ESD单元被容纳在凹形空间中并电连接在两个导电销之间。第二包装单元被容纳在凹形空间中以覆盖ESD单元。发光单元被容纳在接收空间中并且电连接在两个导电引脚之间。第三包装单元被容纳在接收空间中以覆盖发光单元。

3. 外观设计

USD595675S1 Light emitting diode 有权
公开(公告)号：USD595675S1
公开(公告)日：2009-07-07
申请号：US29309666
申请日：2008-09-24
申请人： Bily Wang , Chao-Yuan Huang , Ping-Chou Yang , Jia-Wen Chen , Hsiu-Wen Wang
设计人： Bily Wang , Chao-Yuan Huang , Ping-Chou Yang , Jia-Wen Chen , Hsiu-Wen Wang

4. 发明授权

US08623680B2 LED chip package structure using sedimentation and method for making the same 有权
标题翻译： LED芯片封装结构采用沉淀法和制造方法相同
公开(公告)号：US08623680B2
公开(公告)日：2014-01-07
申请号：US13232391
申请日：2011-09-14
申请人： Bily Wang , Shih-Yu Wu , Chao-Yuan Huang , Ping-Chou Yang , Cheng-Yen Chiang
发明人： Bily Wang , Shih-Yu Wu , Chao-Yuan Huang , Ping-Chou Yang , Cheng-Yen Chiang
IPC分类号： H01L21/00
CPC分类号： H01L33/52 , H01L33/508 , H01L2224/48091 , H01L2924/181 , H01L2933/0041 , H01L2924/00014 , H01L2924/00012
摘要： An LED chip package structure using sedimentation includes a package body, at least two conductive substrates, at least one light-emitting element, and a package unit. The package body has a receiving space. The two conductive substrates are received in the receiving space. The light-emitting element is received in the receiving space and electrically connected to the two conductive substrates. The package unit has a package colloid layer and a powder mixed into the package colloid layer, and the package unit is filled into the receiving space. The powder is uniformly deposited in the receiving space by maintaining the package unit at room temperature firstly and the powder is solidified in the receiving space by heating to a predetermined temperature.
摘要翻译：使用沉淀的LED芯片封装结构包括封装体，至少两个导电基板，至少一个发光元件和封装单元。包装体具有接收空间。两个导电基板被接收在接收空间中。发光元件被容纳在接收空间中并与两个导电基板电连接。包装单元具有包装胶体层和混合到包装胶体层中的粉末，并且包装单元填充到容纳空间中。首先将包装单元保持在室温下，将粉末均匀地沉积在接收空间中，并通过加热到预定温度使粉末在接收空间中固化。

5. 发明授权

US08079737B2 Reflection-type light-emitting module with high heat-dissipating and high light-generating efficiency 有权
标题翻译：反射式发光模块具有散热性好，发光效率高的特点
公开(公告)号：US08079737B2
公开(公告)日：2011-12-20
申请号：US12426621
申请日：2009-04-20
申请人： Bily Wang , Ping-Chou Yang , Yu-Jen Cheng
发明人： Bily Wang , Ping-Chou Yang , Yu-Jen Cheng
IPC分类号： F21V7/00
CPC分类号： F21V29/51 , F21K9/233 , F21V7/0008 , F21V7/041 , F21V7/048 , F21V7/09 , F21V29/507 , F21V29/717 , F21V29/773 , F21Y2115/10
摘要： A reflection-type light-emitting module with high heat-dissipating and high light-generating efficiency includes a reflection-type lampshade unit, a heat pipe unit and a light-emitting unit. The reflection-type lampshade unit has an open casing, a receiving space formed in the open casing, and a first reflective structure is disposed in the receiving space and on an inner surface of the open casing. The heat pipe unit is received in the receiving space and is disposed on the open casing. The light-emitting unit is disposed on the heat pipe unit, and the light-emitting unit has a light-emitting face facing the inner surface of the open casing.
摘要翻译：具有散热高，发光效率高的反射型发光模块包括反射式灯罩单元，热管单元和发光单元。反射型灯罩单元具有敞开的壳体，形成在开放式壳体中的容纳空间，并且第一反射结构设置在容纳空间中和开口壳体的内表面上。热管单元被容纳在接收空间中并且设置在开放的壳体上。发光单元设置在热管单元上，并且发光单元具有面向开口壳体的内表面的发光面。

6. 发明申请

US20110003409A1 LED CHIP PACKAGE STRUCTURE WITH AN EMBEDDED ESD FUNCTION AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：具有嵌入式ESD功能的LED芯片封装结构及其制造方法
公开(公告)号：US20110003409A1
公开(公告)日：2011-01-06
申请号：US12876408
申请日：2010-09-07
申请人： BILY WANG , PING-CHOU YANG , JIA-WEN CHEN
发明人： BILY WANG , PING-CHOU YANG , JIA-WEN CHEN
IPC分类号： H01L33/48
CPC分类号： H01L25/167 , H01L2224/48091 , H01L2224/48247 , Y10T29/41 , H01L2924/00014
摘要： An LED chip package structure includes a conductive unit, a first package unit, an ESD unit, a second package unit, a light-emitting unit and a second package unit. The conductive unit has two conductive pins adjacent to each other which form a concave space between each other. The first package unit encloses one part of each conductive pin in order to form a receiving space communicating with the concave space and to expose an end side of each conductive pin. The ESD unit is received in the concave space and electrically connected between the two conductive pins. The second package unit is received in the concave space in order to cover the ESD unit. The light-emitting unit is received in the receiving space and electrically connected between the two conductive pins. The third package unit is received in the receiving space in order to cover the light-emitting unit.
摘要翻译： LED芯片封装结构包括导电单元，第一封装单元，ESD单元，第二封装单元，发光单元和第二封装单元。导电单元具有彼此相邻的两个导电销，它们彼此之间形成凹形空间。第一封装单元包围每个导电引脚的一部分，以便形成与凹入空间连通并且暴露每个导电引脚的端侧的接收空间。 ESD单元被容纳在凹形空间中并电连接在两个导电销之间。第二包装单元被容纳在凹形空间中以覆盖ESD单元。发光单元被容纳在接收空间中并且电连接在两个导电引脚之间。第三包装单元被容纳在接收空间中以覆盖发光单元。

7. 发明申请

US20100264797A1 REFLECTION-TYPE LIGHT-EMITTING MODULE WITH HIGH HEAT-DISSIPATING AND HIGH LIGHT-GENERATING EFFICIENCY 有权
标题翻译：具有高散热和高发光效率的反射型发光模块
公开(公告)号：US20100264797A1
公开(公告)日：2010-10-21
申请号：US12426621
申请日：2009-04-20
申请人： Bily WANG , Ping-Chou Yang , Yu-Jen Cheng
发明人： Bily WANG , Ping-Chou Yang , Yu-Jen Cheng
IPC分类号： H01J61/52
CPC分类号： F21V29/51 , F21K9/233 , F21V7/0008 , F21V7/041 , F21V7/048 , F21V7/09 , F21V29/507 , F21V29/717 , F21V29/773 , F21Y2115/10
摘要： A reflection-type light-emitting module with high heat-dissipating and high light-generating efficiency includes a reflection-type lampshade unit, a heat pipe unit and a light-emitting unit. The reflection-type lampshade unit has an open casing, a receiving space formed in the open casing, and a first reflective structure is disposed in the receiving space and on an inner surface of the open casing. The heat pipe unit is received in the receiving space and is disposed on the open casing. The light-emitting unit is disposed on the heat pipe unit, and the light-emitting unit has a light-emitting face facing the inner surface of the open casing.
摘要翻译：具有散热高，发光效率高的反射型发光模块包括反射式灯罩单元，热管单元和发光单元。反射型灯罩单元具有敞开的壳体，形成在开放式壳体中的容纳空间，并且第一反射结构设置在容纳空间中和开口壳体的内表面上。热管单元被容纳在接收空间中并且设置在开放的壳体上。发光单元设置在热管单元上，并且发光单元具有面向开口壳体的内表面的发光面。

8. 外观设计

USD660259S1 Strip LED 有权
标题翻译：带LED
公开(公告)号：USD660259S1
公开(公告)日：2012-05-22
申请号：US29396540
申请日：2011-06-30
申请人： Bily Wang , Wen-Kuei Wu , Ping-Chou Yang
设计人： Bily Wang , Wen-Kuei Wu , Ping-Chou Yang

9. 外观设计

USD595674S1 Light emitting diode 有权
公开(公告)号：USD595674S1
公开(公告)日：2009-07-07
申请号：US29309665
申请日：2008-09-24
申请人： Bily Wang , Chao-Yuan Huang , Ping-Chou Yang , Jia-Wen Chen , Hsiu-Wen Wang
设计人： Bily Wang , Chao-Yuan Huang , Ping-Chou Yang , Jia-Wen Chen , Hsiu-Wen Wang

10. 发明申请

US20120003765A1 LED CHIP PACKAGE STRUCTURE USING SEDIMENTATION AND METHOD FOR MAKING THE SAME 有权
标题翻译： LED芯片包装结构及其制作方法
公开(公告)号：US20120003765A1
公开(公告)日：2012-01-05
申请号：US13232391
申请日：2011-09-14
申请人： BILY WANG , SHIH-YU WU , CHAO-YUAN HUANG , PING-CHOU YANG , CHENG-YEN CHIANG
发明人： BILY WANG , SHIH-YU WU , CHAO-YUAN HUANG , PING-CHOU YANG , CHENG-YEN CHIANG
IPC分类号： H01L33/52
CPC分类号： H01L33/52 , H01L33/508 , H01L2224/48091 , H01L2924/181 , H01L2933/0041 , H01L2924/00014 , H01L2924/00012
摘要： An LED chip package structure using sedimentation includes a package body, at least two conductive substrates, at least one light-emitting element, and a package unit. The package body has a receiving space. The two conductive substrates are received in the receiving space. The light-emitting element is received in the receiving space and electrically connected to the two conductive substrates. The package unit has a package colloid layer and a powder mixed into the package colloid layer, and the package unit is filled into the receiving space. The powder is uniformly deposited in the receiving space by maintaining the package unit at room temperature firstly and the powder is solidified in the receiving space by heating to a predetermined temperature.
摘要翻译：使用沉淀的LED芯片封装结构包括封装体，至少两个导电基板，至少一个发光元件和封装单元。包装体具有接收空间。两个导电基板被接收在接收空间中。发光元件被容纳在接收空间中并与两个导电基板电连接。包装单元具有包装胶体层和混合到包装胶体层中的粉末，并且包装单元填充到容纳空间中。首先将包装单元保持在室温下，将粉末均匀地沉积在接收空间中，并通过加热到预定温度使粉末在接收空间中固化。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式