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1. 发明授权

US08919186B2 Fuel pressure measuring device, fuel pressure measuring system, and fuel injection device 有权
标题翻译：燃油压力测量装置，燃油压力测量系统和燃料喷射装置
公开(公告)号：US08919186B2
公开(公告)日：2014-12-30
申请号：US12741123
申请日：2008-10-27
申请人： Jun Kondo , Tooru Taguchi , Hiroki Tanada , Akitoshi Yamanaka
发明人： Jun Kondo , Tooru Taguchi , Hiroki Tanada , Akitoshi Yamanaka
IPC分类号： G01M15/09 , F02M47/02 , F02M51/00 , F02M57/00 , F02D41/38
CPC分类号： F02M47/027 , F02D41/3845 , F02M51/005 , F02M57/005 , F02M2200/24 , F02M2547/001
摘要： A fuel injection system for use with an internal combustion engine supplies fuel to an injector (fuel injection valve) from a common rail (accumulator) through a high-pressure pipe to spray the fuel from a spray hole formed in the injector. A thin-walled portion is formed in a path member (e.g., an injector body, the high-pressure pipe, or a connector connecting the injector and the high-pressure pipe) and defined by a locally thin wall of the path member. A strain gauge (strain sensor) is affixed to the thin-walled portion to measure strain of the thin-walled portion arising from the pressure of fuel in a high-pressure fuel path.
摘要翻译：与内燃机一起使用的燃料喷射系统通过高压管从共轨（蓄能器）向喷射器（燃料喷射阀）供给燃料，以从喷射器中形成的喷孔喷射燃料。在路径构件（例如，喷射器本体，高压管或连接喷射器和高压管的连接器）中形成并由路径构件的局部薄壁限定的薄壁部分。应变计（应变传感器）固定在薄壁部分上，以测量由高压燃料路径中的燃料压力引起的薄壁部分的应变。

2. 发明授权

US08297259B2 Fuel injection valve and fuel injection device 有权
标题翻译：燃油喷射阀和燃油喷射装置
公开(公告)号：US08297259B2
公开(公告)日：2012-10-30
申请号：US12741140
申请日：2008-10-27
申请人： Jun Kondo , Tooru Taguchi , Fumiaki Arikawa , Daiji Ueda , Akitoshi Yamanaka
发明人： Jun Kondo , Tooru Taguchi , Fumiaki Arikawa , Daiji Ueda , Akitoshi Yamanaka
IPC分类号： F02M51/00 , F02M51/06
CPC分类号： F02M47/027 , F02M51/005 , F02M57/005 , F02M63/0026 , F02M63/023 , F02M2200/24
摘要： It is equipped with an injector body 4z which has formed therein high-pressure paths 6az, 6bz, and 6cz through which high-pressure fuel flows to a spray hole and stores therein a piezo-actuator 2z (i.e., an opening/closing mechanism) and a back-pressure control mechanism 3z (i.e., an opening/closing mechanism) which open or close the spray hole, and a fuel pressure sensor 50z installed in the body 4z to measure the pressure of the high-pressure fuel. The body 4z has formed therein a branch path 6ez diverging from the high-pressure paths 6bz and 6cz to deliver the high-pressure fuel to the fuel pressure sensor 50z.
摘要翻译：配备有在其中形成有高压燃料流向喷射孔的高压路径6az，6bz，6cz的喷射器主体4z，并且在其中存储有压电致动器2z（即，开闭机构）以及打开或关闭喷射孔的背压控制机构3z（即，开闭机构），以及安装在主体4z内的燃料压力传感器50z，以测量高压燃料的压力。主体4z形成有从高压通路6bz和6cz分支的分支路径6ez，以将高压燃料输送到燃料压力传感器50z。

3. 发明授权

US08210040B2 Oscillating angular speed sensor 失效
标题翻译：振荡角速度传感器
公开(公告)号：US08210040B2
公开(公告)日：2012-07-03
申请号：US12722707
申请日：2010-03-12
申请人： Hirofumi Higuchi , Akitoshi Yamanaka , Tetsuo Fujii
发明人： Hirofumi Higuchi , Akitoshi Yamanaka , Tetsuo Fujii
IPC分类号： G01C19/56 , G01P9/04 , G01P1/02
CPC分类号： G01C19/5719
摘要： An oscillating angular speed sensor includes a detector, a driving portion, and a separating portion. When an angular speed is generated while the detector is driven to oscillate by the driving portion, Coriolis force is applied to the detector. Therefore, the angular speed is detected based on a capacitance variation in accordance with a variation of an interval between a movable electrode and a fixed electrode of the detector. The separating portion is distanced from the detector and the driving portion, and is configured to separate a first space accommodating the detector and a second space accommodating the driving portion.
摘要翻译：振动角速度传感器包括检测器，驱动部分和分离部分。当检测器被驱动部分驱动振荡时产生角速度时，将科里奥利力施加到检测器。因此，根据检测器的可动电极和固定电极之间的间隔的变化，基于电容变化来检测角速度。分离部分远离检测器和驱动部分，并且被配置为分离容纳检测器的第一空间和容纳驱动部分的第二空间。

4. 发明授权

US08100344B2 Fuel injector with fuel pressure sensor 有权
标题翻译：带燃油压力传感器的燃油喷射器
公开(公告)号：US08100344B2
公开(公告)日：2012-01-24
申请号：US12423993
申请日：2009-04-15
申请人： Jun Kondo , Akitoshi Yamanaka
发明人： Jun Kondo , Akitoshi Yamanaka
IPC分类号： B67D5/38
CPC分类号： F02M47/027 , F02M57/005 , F02M61/168 , F02M2200/247 , F02M2200/8076 , G01L23/10
摘要： A fuel injector which may be employed in injecting fuel into an internal combustion engine. The fuel injector includes an injector body and a head body formed to be separate from the injector body. The head body has installed therein a fuel pressure sensor working to measure the pressure of fuel in the fuel injector and is joined detachably to the injector body. The fuel injector alternatively includes an injector body and a fuel pressure-sensing unit equipped with a fuel pressure sensor. The fuel pressure-sensing unit is installed detachably on the injector body. This structure provides enhanced productivity of the fuel injector and facilitate the ease of replacement of the fuel pressure sensor.
摘要翻译：可用于将燃料喷射到内燃机中的燃料喷射器。燃料喷射器包括喷射器主体和形成为与喷射器主体分离的头部主体。头体内安装有用于测量燃料喷射器中的燃料压力的燃料压力传感器，并可拆卸地连接到喷射器主体。燃料喷射器替代地包括喷射器主体和配备有燃料压力传感器的燃料压力感测单元。燃料压力感测单元可拆卸地安装在喷射器主体上。这种结构提高了燃料喷射器的生产率，并且便于更换燃料压力传感器。

5. 发明授权

US08089144B2 Semiconductor device and method for manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US08089144B2
公开(公告)日：2012-01-03
申请号：US12654087
申请日：2009-12-10
申请人： Tetsuo Fujii , Akitoshi Yamanaka , Hisanori Yokura
发明人： Tetsuo Fujii , Akitoshi Yamanaka , Hisanori Yokura
IPC分类号： H01L23/48
CPC分类号： G01P15/125 , B81B7/007 , B81B2207/097 , G01C19/5719 , G01C19/5783 , G01P15/0802 , G01P2015/0814 , H01L23/481 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/94 , H01L25/0657 , H01L25/16 , H01L2224/0401 , H01L2224/05558 , H01L2224/114 , H01L2224/116 , H01L2224/13009 , H01L2224/13011 , H01L2224/13025 , H01L2224/13099 , H01L2224/13144 , H01L2224/2518 , H01L2224/45144 , H01L2224/48 , H01L2224/48463 , H01L2224/80001 , H01L2224/81805 , H01L2225/06513 , H01L2225/06541 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01022 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01072 , H01L2924/01079 , H01L2924/01322 , H01L2924/014 , H01L2924/10157 , H01L2924/10253 , H01L2924/10329 , H01L2924/14 , H01L2924/1461 , H01L2924/15747 , H01L2924/15787 , H01L2924/15788 , H01L2924/19041 , H01L2924/30105 , H01L2924/3025 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device includes: a sensor including a sensor structure on a first side of the sensor and a periphery element surrounding the sensor structure; and a cap covering the sensor structure and having a second side bonded to the first side of the sensor. The cap includes a first wiring layer on the second side of the cap. The first wiring layer steps over the periphery element. The sensor further includes a sensor side connection portion, and the cap further includes a cap side connection portion. The sensor side connection portion is bonded to the cap side connection portion. At least one of the sensor side connection portion and the cap side connection portion provides an eutectic alloy so that the sensor side connection portion and the cap side connection portion are bonded to each other.
摘要翻译：半导体器件包括：传感器，包括在传感器的第一侧上的传感器结构和围绕传感器结构的外围元件; 以及盖，其覆盖所述传感器结构并具有结合到所述传感器的第一侧的第二侧。盖包括在盖的第二面上的第一布线层。第一布线层跨越周边元件。传感器还包括传感器侧连接部分，盖子还包括帽侧连接部分。传感器侧连接部分接合到盖侧连接部分。传感器侧连接部和盖侧连接部中的至少一方提供共晶合金，使得传感器侧连接部和盖侧连接部彼此接合。

6. 发明申请

US20100294242A1 FUEL INJECTION VALVE AND FUEL INJECTION DEVICE 有权
标题翻译：燃油喷射阀和燃油喷射装置
公开(公告)号：US20100294242A1
公开(公告)日：2010-11-25
申请号：US12741084
申请日：2008-10-27
申请人： Jun Kondo , Tooru Taguchi , Fumiaki Arikawa , Akitoshi Yamanaka
发明人： Jun Kondo , Tooru Taguchi , Fumiaki Arikawa , Akitoshi Yamanaka
IPC分类号： F02M61/14
CPC分类号： F02M47/027 , F02D2200/0602 , F02D2400/08 , F02M51/005 , F02M57/005 , F02M63/0026 , F02M2200/24 , G01L23/18
摘要： It is equipped with an injector body 4z which has formed therein high-pressure paths 6az, 6bz, and 6cz through which high-pressure fuel flows to a spray hole and stores therein a piezo-actuator 2z (i.e., an opening/closing mechanism) and a back-pressure control mechanism 3z (i.e., an opening/closing mechanism) which open or close the spray hole, a stem 51z (i.e., an elastic body) which is installed in said body 4z and elastically deformed when subjected to pressure of the high-pressure fluid, and a strain gauge 52z (i.e., a sensing device) which converts the degree of strain occurring at the stem 51z into an electric signal and outputs it as a measured-pressure signal. Specifically, the stain gauge 52z is installed on the stem 51z that is constructed as being separate from the body 4z.
摘要翻译：配备有在其中形成有高压燃料流向喷射孔的高压路径6az，6bz，6cz的喷射器主体4z，并且在其中存储有压电致动器2z（即，开闭机构）以及打开或关闭喷孔的背压控制机构3z（即打开/关闭机构），安装在所述主体4z中的杆51z（即，弹性体），当受到压力时弹性变形高压流体和应变计52z（即，感测装置），其将发生在杆51z处的应变程度转换为电信号并将其作为测量压力信号输出。具体地，污迹计52z安装在构成为与主体4z分离的杆51z上。

7. 发明授权

US07770452B2 Semiconductor sensor and manufacturing method therefor 有权
标题翻译：半导体传感器及其制造方法
公开(公告)号：US07770452B2
公开(公告)日：2010-08-10
申请号：US12081512
申请日：2008-04-17
申请人： Minekazu Sakai , Ryuichiro Abe , Akitoshi Yamanaka
发明人： Minekazu Sakai , Ryuichiro Abe , Akitoshi Yamanaka
IPC分类号： G01P15/00
CPC分类号： G01P15/0802 , B81B7/007 , G01P15/125 , G01P2015/0814 , H01L24/03 , H01L24/05 , H01L24/45 , H01L24/48 , H01L2224/02166 , H01L2224/04042 , H01L2224/05554 , H01L2224/05599 , H01L2224/05624 , H01L2224/05647 , H01L2224/0566 , H01L2224/45124 , H01L2224/45144 , H01L2224/48463 , H01L2224/48624 , H01L2224/48647 , H01L2224/48724 , H01L2224/48747 , H01L2224/85201 , H01L2224/8592 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01068 , H01L2924/01079 , H01L2924/181 , H01L2924/30105 , H01L2924/3025 , Y10T29/49002 , H01L2924/00 , H01L2224/4876 , H01L2224/4866
摘要： A semiconductor sensor is disclosed that includes a semiconductor substrate, a sensing portion provided on the semiconductor substrate, and a pad in electrical communication with the sensing portion and provided on the semiconductor substrate. The semiconductor sensor also includes a bonding wire in electrical communication with the pad. Furthermore, the semiconductor sensor includes a cover member with a covering portion disposed over the semiconductor substrate for covering the sensing portion such that the covering portion is separated at a distance from the sensing portion. The cover member further includes a coupling portion provided on the semiconductor substrate at an area including the pad and for enabling electrical connection of the pad with the bonding wire therethrough.
摘要翻译：公开了一种半导体传感器，其包括半导体衬底，设置在半导体衬底上的感测部分，以及与感测部分电连接并设置在半导体衬底上的焊盘。半导体传感器还包括与焊盘电连通的接合线。此外，半导体传感器包括覆盖部件，覆盖部分设置在半导体衬底上，用于覆盖感测部分，使得覆盖部分与感测部分隔开一段距离。所述盖构件还包括在包括所述焊盘的区域处设置在所述半导体衬底上的耦合部分，并且用于使所述焊盘与所述接合线电连接。

8. 发明申请

US20100096480A1 FUEL INJECTOR WITH FUEL PRESSURE SENSOR 有权
标题翻译：带燃油压力传感器的燃油喷射器
公开(公告)号：US20100096480A1
公开(公告)日：2010-04-22
申请号：US12423993
申请日：2009-04-15
申请人： Jun Kondo , Akitoshi Yamanaka
发明人： Jun Kondo , Akitoshi Yamanaka
IPC分类号： B05B1/30 , G01M15/04
CPC分类号： F02M47/027 , F02M57/005 , F02M61/168 , F02M2200/247 , F02M2200/8076 , G01L23/10
摘要： A fuel injector which may be employed in injecting fuel into an internal combustion engine. The fuel injector includes an injector body and a head body formed to be separate from the injector body. The head body has installed therein a fuel pressure sensor working to measure the pressure of fuel in the fuel injector and is joined detachably to the injector body. The fuel injector alternatively includes an injector body and a fuel pressure-sensing unit equipped with a fuel pressure sensor. The fuel pressure-sensing unit is installed detachably on the injector body. This structure provides enhanced productivity of the fuel injector and facilitate the ease of replacement of the fuel pressure sensor.
摘要翻译：可用于将燃料喷射到内燃机中的燃料喷射器。燃料喷射器包括喷射器主体和形成为与喷射器主体分离的头部主体。头体内安装有用于测量燃料喷射器中的燃料压力的燃料压力传感器，并可拆卸地连接到喷射器主体。燃料喷射器替代地包括喷射器主体和配备有燃料压力传感器的燃料压力感测单元。燃料压力感测单元可拆卸地安装在喷射器主体上。这种结构提高了燃料喷射器的生产率，并且便于更换燃料压力传感器。

9. 发明申请

US20080196501A1 Semiconductor sensor and manufacturing method therefor 有权
标题翻译：半导体传感器及其制造方法
公开(公告)号：US20080196501A1
公开(公告)日：2008-08-21
申请号：US12081512
申请日：2008-04-17
申请人： Minekazu Sakai , Ryuichiro Abe , Akitoshi Yamanaka
发明人： Minekazu Sakai , Ryuichiro Abe , Akitoshi Yamanaka
IPC分类号： G01P15/125
CPC分类号： G01P15/0802 , B81B7/007 , G01P15/125 , G01P2015/0814 , H01L24/03 , H01L24/05 , H01L24/45 , H01L24/48 , H01L2224/02166 , H01L2224/04042 , H01L2224/05554 , H01L2224/05599 , H01L2224/05624 , H01L2224/05647 , H01L2224/0566 , H01L2224/45124 , H01L2224/45144 , H01L2224/48463 , H01L2224/48624 , H01L2224/48647 , H01L2224/48724 , H01L2224/48747 , H01L2224/85201 , H01L2224/8592 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01068 , H01L2924/01079 , H01L2924/181 , H01L2924/30105 , H01L2924/3025 , Y10T29/49002 , H01L2924/00 , H01L2224/4876 , H01L2224/4866
摘要： A semiconductor sensor is disclosed that includes a semiconductor substrate, a sensing portion provided on the semiconductor substrate, and a pad in electrical communication with the sensing portion and provided on the semiconductor substrate. The semiconductor sensor also includes a bonding wire in electrical communication with the pad. Furthermore, the semiconductor sensor includes a cover member with a covering portion disposed over the semiconductor substrate for covering the sensing portion such that the covering portion is separated at a distance from the sensing portion. The cover member further includes a coupling portion provided on the semiconductor substrate at an area including the pad and for enabling electrical connection of the pad with the bonding wire therethrough.
摘要翻译：公开了一种半导体传感器，其包括半导体衬底，设置在半导体衬底上的感测部分，以及与感测部分电连接并设置在半导体衬底上的焊盘。半导体传感器还包括与焊盘电连通的接合线。此外，半导体传感器包括覆盖部件，覆盖部分设置在半导体衬底上，用于覆盖感测部分，使得覆盖部分与感测部分隔开一段距离。盖构件还包括在包括衬垫的区域处设置在半导体衬底上的耦合部分，并且用于使焊盘与通过其的接合线电连接。

10. 发明授权

US07373821B2 Semiconductor sensor and manufacturing method therefor 失效
公开(公告)号：US07373821B2
公开(公告)日：2008-05-20
申请号：US11455919
申请日：2006-06-20
申请人： Minekazu Sakai , Ryuichiro Abe , Akitoshi Yamanaka
发明人： Minekazu Sakai , Ryuichiro Abe , Akitoshi Yamanaka
IPC分类号： G01P15/00
CPC分类号： G01P15/0802 , B81B7/007 , G01P15/125 , G01P2015/0814 , H01L24/03 , H01L24/05 , H01L24/45 , H01L24/48 , H01L2224/02166 , H01L2224/04042 , H01L2224/05554 , H01L2224/05599 , H01L2224/05624 , H01L2224/05647 , H01L2224/0566 , H01L2224/45124 , H01L2224/45144 , H01L2224/48463 , H01L2224/48624 , H01L2224/48647 , H01L2224/48724 , H01L2224/48747 , H01L2224/85201 , H01L2224/8592 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01068 , H01L2924/01079 , H01L2924/181 , H01L2924/30105 , H01L2924/3025 , Y10T29/49002 , H01L2924/00 , H01L2224/4876 , H01L2224/4866
摘要： A semiconductor sensor is disclosed that includes a semiconductor substrate, a sensing portion provided on the semiconductor substrate, and a pad in electrical communication with the sensing portion and provided on the semiconductor substrate. The semiconductor sensor also includes a bonding wire in electrical communication with the pad. Furthermore, the semiconductor sensor includes a cover member with a covering portion disposed over the semiconductor substrate for covering the sensing portion such that the covering portion is separated at a distance from the sensing portion. The cover member further includes a coupling portion provided on the semiconductor substrate at an area including the pad and for enabling electrical connection of the pad with the bonding wire therethrough.

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