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    • 5. 发明申请
    • SEMICONDUCTOR WAFER CONTAINER
    • US20210118712A1
    • 2021-04-22
    • US16498450
    • 2018-02-06
    • Achilles Corporation
    • Masayuki NISHIJIMAKenichi HIROSEJames CHRISTIE
    • H01L21/673
    • [Problem to be Solved]
      To provide a semiconductor wafer container
      [Solution]
      A semiconductor wafer container including two outer shells in a substantially flat and identical form, each outer shell vertically overlapping so as to accommodate a single semiconductor wafer therein, wherein the outer shell has a wafer retaining device and an external wall forming device in addition to a main body of the outer shell, wherein the wafer retaining device accommodates and fixedly holds the wafer in such a manner that upper and bottom surfaces of the wafer are not substantially in contact with the outer shells, the wafer retaining device including: an inclined surface formed on an upper surface of the outer shell and being in line contact with an outer peripheral edge of the wafer from below; a wafer contact surface formed on a bottom surface of the outer shell and being in surface contact with the outer peripheral edge of the wafer from above; and a shallow gap portion formed on each central region of both the upper and bottom surfaces of the outer shell so as to cover an upper part or a lower part of the wafer; and wherein the external wall forming device has a hanging portion formed on an outer peripheral edge of the bottom surface of the outer shell so as to externally constitute a closed external wall relative to the wafer when each outer shell vertically overlaps to store the wafer.
    • 8. 发明申请
    • TRAY FOR A WAFER WITH TAPE FRAME
    • 用于带子带框的托盘
    • US20150380293A1
    • 2015-12-31
    • US14761837
    • 2014-02-07
    • ACHILLES CORPORATION
    • Masayuki NISHIJIMA
    • H01L21/683
    • H01L21/6836H01L21/67346H01L2221/68327
    • A tray for storing a wafer with a tape frame in a storage container includes a ring-shaped frame, a dicing tape and a semiconductor wafer. The dicing tape is stuck on the rear surface of the ring-shaped frame, and the semiconductor wafer is supported on the dicing tape. The tray has a substantially circular shape and is positioned on the upper side and the lower side of the wafer with tape frame. The front surface of the tray has a flat portion for mounting the wafer, and at least a portion of the outer peripheral portion of the front surface of the tray includes a convex portion. A projecting portion is formed on the rear surface so that the projection portion is positioned outside the outer periphery of the semiconductor wafer of the wafer with the tape frame when the tray is positioned on the wafer with tape frame.
    • 用于将具有带框架的晶片存储在存储容器中的托盘包括环形框架,切割带和半导体晶片。 切割胶带粘贴在环形框架的后表面上,半导体晶片被支撑在切割带上。 托盘具有大致圆形的形状,并且位于具有带框架的晶片的上侧和下侧。 托盘的前表面具有用于安装晶片的平坦部分,并且托盘的前表面的外周部分的至少一部分包括凸部。 突出部分形成在后表面上,使得当托盘用带框架定位在晶片上时,突出部分与带框架位于晶片的半导体晶片的外周边外侧。