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    • 5. 发明申请
    • SUBSTRATE HOUSING CONTAINER
    • US20190385868A1
    • 2019-12-19
    • US16483589
    • 2017-02-06
    • Achilles Corporation
    • Masayuki Nishijima
    • H01L21/673H01L21/677H01L21/687
    • A substrate housing container (1) includes (i) a container body (10) having one end that is provided with an opening (11) and another end that is provided with a mount element (12) on which substrates (W) are stacked, the mount element 12 facing the opening (11), and (ii) a cover (20) to cover the opening (11), wherein the cover (20) includes a lid portion (21) to cover the opening (11) and at least two holding members (22) disposed on the lid portion (21), the holding members (22) being configured to swing in a central direction of the lid portion (21) and to press outer sides of the substrates (W) accommodated in the container body (10) with the substrates (W) stacked, the container body (10) has guide grooves (13) to make tips (22a) of the holding members (22) move from an outer side of the mount element (12) to an inner sides of the mount element (12) to guide the tips (22a) of the holding members (22) to positions at which the holding members (22) press the outer sides of the substrates (W), and the guide grooves (13) are formed as a dent on surfaces of the mount element (12).
    • 9. 发明申请
    • SEMICONDUCTOR WAFER CONTAINER
    • US20210118712A1
    • 2021-04-22
    • US16498450
    • 2018-02-06
    • Achilles Corporation
    • Masayuki NISHIJIMAKenichi HIROSEJames CHRISTIE
    • H01L21/673
    • [Problem to be Solved]
      To provide a semiconductor wafer container
      [Solution]
      A semiconductor wafer container including two outer shells in a substantially flat and identical form, each outer shell vertically overlapping so as to accommodate a single semiconductor wafer therein, wherein the outer shell has a wafer retaining device and an external wall forming device in addition to a main body of the outer shell, wherein the wafer retaining device accommodates and fixedly holds the wafer in such a manner that upper and bottom surfaces of the wafer are not substantially in contact with the outer shells, the wafer retaining device including: an inclined surface formed on an upper surface of the outer shell and being in line contact with an outer peripheral edge of the wafer from below; a wafer contact surface formed on a bottom surface of the outer shell and being in surface contact with the outer peripheral edge of the wafer from above; and a shallow gap portion formed on each central region of both the upper and bottom surfaces of the outer shell so as to cover an upper part or a lower part of the wafer; and wherein the external wall forming device has a hanging portion formed on an outer peripheral edge of the bottom surface of the outer shell so as to externally constitute a closed external wall relative to the wafer when each outer shell vertically overlaps to store the wafer.