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1. 发明授权

US5443714A Process and electrolyte for depositing lead and lead-containing layers 失效
标题翻译：用于沉积铅和含铅层的工艺和电解质
公开(公告)号：US5443714A
公开(公告)日：1995-08-22
申请号：US848952
申请日：1992-05-29
申请人： Karl-Jurgen Schmidt , Eberhard Knaak
发明人： Karl-Jurgen Schmidt , Eberhard Knaak
IPC分类号： C25D3/36 , C25D3/56 , C25D3/32 , C25D3/38
CPC分类号： C25D3/56 , C25D3/36
摘要： A process for acidic electrolytical deposition of lead layers and predominantly lead-containing layers onto surfaces using an electrolyte containing lead salts and acids, in particular alkanesulfonic acid, borofluoric acid or silicofluoric acid, with non-ionic surfactants and cationic or amphoteric surfactants being added to the electrolyte. The process can be operated at current densities of from 0.5 to 20 A/dm.sup.2 and at a pH value below 1.
摘要翻译： PCT No.PCT / EP90 / 01670 Sec。 371日期：1992年5月29日 102（e）日期1992年5月29日PCT 1990年10月5日PCT PCT。公开号WO91 / 05890 日期1991年3月2日。一种使用含有铅盐和酸，特别是烷基磺酸，硼氟酸或硅氟酸的电解质与非离子表面活性剂的酸性电解沉积铅层和主要含铅层到表面上的方法，将阳离子或两性表面活性剂加入到电解质中。该过程可以以0.5至20A / dm 2的电流密度和低于1的pH值操作。

2. 发明授权

US5021130A Aqueous acidic solutions for the electrodeposition of tin and lead/tin alloys 失效
标题翻译：用于电沉积锡和铅/锡合金的酸性水溶液
公开(公告)号：US5021130A
公开(公告)日：1991-06-04
申请号：US469066
申请日：1990-01-23
申请人： Willi Metzger , Manfred Schmitz , Karl-Jurgen Schmidt
发明人： Willi Metzger , Manfred Schmitz , Karl-Jurgen Schmidt
IPC分类号： C25D3/32 , C25D3/56 , C25D3/60
CPC分类号： C25D3/32 , C25D3/56 , C25D3/60
摘要： Described are aqueous acidic solutions for the electrodeposition of tin and lead/tin alloys for improving electro- deposition in the high current density range and for providing a uniform luster distribution of metals deposited in the low current density range. The solutions contain a mixture of metal salts, free alkanesulfonic acid, a non-ionic wetting agent and optionally aromatic short-chain aldehydes and/or optionally aromatic ketones and/or optionally short-chain unsaturated carboxylic acids. In the solutions, tin and/or lead salts of the alkanesulfonic acid are employed as the metal salt(s), the alkyl moiety of the alkanesulfonic acid consisting of from 1 to 5 carbon atoms, the free alkanesulfonic acid having alkyl moieties with from 1 to 5 carbon atoms. They contain, as a further brightener, a mixture comprising a reaction product of acetaldehyde and/or its aidol condensation product with ammonia and/or acyclic ketones and/or aliphatic amines, amides, amino acids and or hydrazine compounds.
摘要翻译：描述了用于电沉积锡和铅/锡合金的酸性水溶液，用于改善在高电流密度范围内的电沉积，并提供在低电流密度范围内沉积的金属的均匀光泽分布。溶液含有金属盐，游离烷基磺酸，非离子润湿剂和任选的芳族短链醛和/或任选的芳族酮和/或任选的短链不饱和羧酸的混合物。在该溶液中，使用烷基磺酸的锡和/或铅盐作为金属盐，由1至5个碳原子组成的烷基磺酸的烷基部分，具有烷基部分的游离烷基磺酸具有1 至5个碳原子。它们作为另外的增白剂包含包含乙醛和/或其辅助缩合产物与氨和/或无环酮和/或脂族胺，酰胺，氨基酸和/或肼化合物的反应产物的混合物。

3. 发明授权

US4990395A Electrically conductive copper layers and process for preparing same 失效
标题翻译：导电铜层及其制备方法
公开(公告)号：US4990395A
公开(公告)日：1991-02-05
申请号：US195448
申请日：1988-05-16
申请人： Jurgen Hupe , Frank Sonnenschein , Herbert Breidenbach
发明人： Jurgen Hupe , Frank Sonnenschein , Herbert Breidenbach
IPC分类号： C23F1/02 , H05K3/06 , H05K3/24 , H05K3/28 , H05K3/34 , H05K3/38
CPC分类号： H05K3/244 , C23F1/02 , H05K3/062 , H05K3/384 , H05K2203/0361 , H05K3/243 , H05K3/28 , Y10T428/24975 , Y10T428/265
摘要： Electrically conductive copper layers in conductor plates and electrical components having a black metal coating which is acid-soluble and capable of being applied in an acidic medium are more easily prepared and have superior properties. In the process of preparation, such conductor plates provided with a resist and, optionally, with through-contacts, and having free copper areasa) are galvanically coated with a coating of a black metal in an acidic medium;b) the resist is removed and then the copper areas having been exposed thereby are removed by etching;c) the conductor plates are provided with an adhering solder mask;d) at those parts that are not covered by the solder mask the black metal coating is removed and, if desired, the copper areas exposed thereby are provided with a well solderable metal layer.

4. 发明授权

US5373629A Through-hole plate printed circuit board with resist and process for manufacturing same 失效
标题翻译：通孔板印刷电路板与抗蚀剂及其制造方法相同
公开(公告)号：US5373629A
公开(公告)日：1994-12-20
申请号：US836261
申请日：1992-02-28
申请人： Jurgen Hupe , Walter Kronenberg
发明人： Jurgen Hupe , Walter Kronenberg
IPC分类号： C08G61/10 , C08G61/12 , C25D5/56 , C25D7/00 , H05K3/10 , H05K3/40 , H05K3/42 , H05K3/46 , H01K3/10 , B32B3/10
CPC分类号： H05K3/424 , C08G61/123 , H05K3/4038 , H05K2201/0329 , H05K2203/0796 , H05K2203/107 , H05K2203/122 , H05K2203/1415 , H05K3/108 , H05K3/427 , Y10T29/49144 , Y10T29/49165 , Y10T428/24322 , Y10T428/24802 , Y10T428/24917 , Y10T428/31
摘要： A process is described for manufacturing through-hole plated single-layer or multi-layer printed circuit boards based on a polymeric substrate material or on a ceramic material provided optionally on both sides with at least one photoresist layer temporarily exposing the electroconductive circuit pattern by electroplating or electroless plating with a metal layer also on those surfaces which have not been coated with a conductive metal layer, characterized in thata) the surfaces of the substrate, after hole-drilling and a subsequent mechanical surface-treatment, are laminated with a suitable photoresist, exposed to light and developed so that the circuit pattern image is exposed,b) the surfaces of the substrate are pre-treated in a solution having oxidizing activity,c) after removal of the residual solution by rinsing, the substrate is introduced into a solution which contains at least one heterocyclic monomer, and more specifically pyrrole, thiophene, furane or derivative(s) thereof, which in a polymeric form is electrically conductive,d) the substrate is then transferred into an acidic solution whereby an electrically conductive polymeric layer is formed,whereupon, if desired or required, any residual solution is removed by rinsing, and the through-holes and the circuit pattern image are metallized in one step by galvanic or, preferably, electroless metallization.
摘要翻译： PCT No.PCT / EP90 / 01326 Sec。一九九二年二月二十八日 102（e）日期1992年2月28日PCT 1990年8月11日PCT PCT。公开号WO91 / 03920 日本1991年3月21日。描述了一种用于制造基于聚合物基材的通孔电镀单层或多层印刷电路板的工艺，或者在任选地在两侧设置有至少一个光致抗蚀剂层的陶瓷材料在没有涂覆有导电金属层的那些表面上也用金属层进行电镀或无电镀来暴露导电电路图案，其特征在于：a）所述基板的表面，在钻孔后和随后的机械表面 - 处理，与合适的光致抗蚀剂层合，暴露于光并显影，使得电路图案图像被曝光，b）基板的表面在具有氧化活性的溶液中预处理，c）在通过将底物引入含有至少一种杂环单体的溶液中，更具体地说是吡咯，噻吩，呋喃或d 以聚合形式导电，d）然后将基底转移到酸性溶液中，由此形成导电聚合物层，然后如果需要或需要，通过冲洗除去任何残留的溶液，并且通过电流或优选地，无电金属化在一个步骤中对通孔和电路图案图像进行金属化。

5. 发明授权

US6007866A Process and device for producing through-connected printed circuit boards and multilayered printed circuit boards 失效
标题翻译：用于生产贯穿连接的印刷电路板和多层印刷电路板的工艺和设备
公开(公告)号：US6007866A
公开(公告)日：1999-12-28
申请号：US473
申请日：1998-03-13
申请人： Jurgen Hupe , Sabine Fix
发明人： Jurgen Hupe , Sabine Fix
IPC分类号： C25D5/56 , C25D7/00 , H05K3/00 , H05K3/38 , H05K3/42 , B05D5/10
CPC分类号： H05K3/424 , H05K3/0055
摘要： The process for producing through-connected printed circuit boards or multilayered printed circuit boards with a polymer base with conductive polymers using a combined desmearing and direct metalization process (multilayering) is performed by subjecting the polymer base materials, provided with bore holes, to the following process steps:1) swelling in a per se known treatment liquid and rinsing with water;2) treatment with alkaline permanganate solution (desmearing);3) rinsing with water;4) rinsing with acidic aqueous solution (pH value about 1, rinsing time 10 to 120 s, depending on acid content);5) rinsing with water;6) rinsing with alkaline aqueous solution (pH 8 to 9.5);7) rinsing with water;8) rinsing with microemulsion of ethylene-3,4-dioxythiophene (catalyst);9) rinsing with acid (fixation);10) rinsing with water;11) coppering;12) rinsing with water; and13) drying;14) usual process steps for creating the printed circuit pattern.
摘要翻译： PCT No.PCT / EP96 / 03134 Sec。 371日期1998年3月13日 102（e）1998年3月13日PCT PCT 1996年7月17日PCT公布。出版物WO97 / 05758 日期1997年2月13日通过使用组合除尘和直接金属化工艺（多层）的具有导电聚合物的聚合物基底制造贯通印刷电路板或多层印刷电路板的方法是通过使聚合物基体材料孔，以下处理步骤：1）本身已知的处理液体膨胀并用水冲洗; 2）用碱性高锰酸盐溶液处理（去污）; 3）用水冲洗; 4）用酸性水溶液冲洗（pH值约1，漂洗时间10〜120秒，取决于酸含量）; 5）用水冲洗; 6）用碱性水溶液（pH8〜9.5）冲洗; 7）用水冲洗; 8）用乙烯-3,4-二氧噻吩（催化剂）的微乳液冲洗; 9）用酸冲洗（固定）; 10）用水冲洗; 11）铜; 12）用水冲洗; 和13）干燥; 14）用于创建印刷电路图案的通常处理步骤。

6. 发明授权

US5981793A Slightly water-soluble metal salts, a process for the preparation thereof, and the use thereof as gloss additives in the electrolytic deposition of metals 有权
标题翻译：微溶于水的金属盐，其制备方法及其在金属的电解沉积中作为光泽添加剂的用途
公开(公告)号：US5981793A
公开(公告)日：1999-11-09
申请号：US142857
申请日：1998-10-28
申请人： Eberhard Knaak , Joachim Heyer , Marlies Kleinfeld , Christel Van Wijngaarden
发明人： Eberhard Knaak , Joachim Heyer , Marlies Kleinfeld , Christel Van Wijngaarden
IPC分类号： C07C327/18 , C25D3/46 , C07C51/305
CPC分类号： C25D3/46 , C07C327/18
摘要： The slightly water-soluble metal salts having the formula I ##STR1## wherein R.sub.1 and R.sub.2 are the same or different and represent hydrogen or a lower alkyl group of from 1 to 3 carbon atoms, M is the cation of a metal which forms slightly water-soluble sulfides, and n means 1 or 2, and mixtures thereof are prepared by reacting carbon disulfide with ketones having the formula II: ##STR2## optionally with the addition of non-aqueous inert solvents, in the presence of strong alkali, preferably potassium hydroxide, followed by precipitation of the slightly water-soluble metal salts of formula I by the addition of aqueous solutions of metal salts of the metals M. They are used as gloss additives to electrolytic baths.
摘要翻译： PCT No.PCT / EP97 / 01389第 371日期：1998年9月16日 102（e）日期1998年9月16日PCT 1997年3月20日PCT公布。第WO97 / 35840号公报日期1997年10月2日具有式I的轻微水溶性金属盐，其中R 1和R 2相同或不同，表示氢或1至3个碳原子的低级烷基，M是形成金属的阳离子微水溶性硫化物，n表示1或2，并且其混合物通过二硫化碳与具有式II的酮反应制备：任选地加入非水惰性溶剂，在强碱存在下，优选氢氧化钾，然后通过加入金属M的金属盐的水溶液沉淀出微溶于式I的水溶性金属盐。它们用作电解浴的光泽添加剂。

7. 发明授权

US5145572A Process for manufacturing through-hole contacting plated printed circuit 失效
标题翻译：制造通孔接触电镀印刷电路的工艺
公开(公告)号：US5145572A
公开(公告)日：1992-09-08
申请号：US803899
申请日：1991-12-09
申请人： Jurgen Hupe , Herbert Iwan
发明人： Jurgen Hupe , Herbert Iwan
IPC分类号： C25D5/56 , H05K3/18 , H05K3/42
CPC分类号： C25D5/56 , H05K3/424 , H05K2203/0285 , H05K2203/0716 , H05K2203/122 , H05K3/427 , Y10T29/49165
摘要： The process for manufacturing through-hole contacting plated printed circuit boards by direct metal electrodeposition on catalytically activated surfaces of the substrate material is improved by pre-treatment prior to electrodepositing the metal, preferably with a solution containing one or more nitrogen-containing organic compounds.
摘要翻译：在电沉积金属之前，优选用含有一种或多种含氮有机化合物的溶液进行预处理，通过在基底材料的催化活化表面上直接金属电沉积制造通孔接触电镀印刷电路板的方法得到改进。

8. 发明授权

US4750976A Electrically conductive copper layers and process for preparing same 失效
标题翻译：导电铜层及其制备方法
公开(公告)号：US4750976A
公开(公告)日：1988-06-14
申请号：US806679
申请日：1985-12-09
申请人： Jurgen Hupe , Frank Sonnenschein , Herbert Breidenbach
发明人： Jurgen Hupe , Frank Sonnenschein , Herbert Breidenbach
IPC分类号： C23F1/02 , H05K3/06 , H05K3/24 , H05K3/28 , H05K3/34 , H05K3/38 , C25D5/02
CPC分类号： H05K3/244 , C23F1/02 , H05K3/062 , H05K3/384 , H05K2203/0361 , H05K3/243 , H05K3/28 , Y10T428/24975 , Y10T428/265
摘要： Electrically conductive copper layers in conductor plates and electrical components having a black metal coating which is acid-soluble and capable of being applied in an acidic medium are more easily prepared and have superior properties. In the process of preparation, such conductor plates provided with a resist and, optionally, with through-contacts, and having free copper areas(a) are galvanically coated with a coating of a black metal in an acidic medium;(b) the resist is removed and then the copper areas having been exposed thereby are removed by etching;(c) the conductor plates are provided with an adhering solder mask;(d) at those parts that are not covered by the solder mask the black metal coating is removed and, if desired, the copper areas exposed thereby are provided with a well solderable metal layer.
摘要翻译：导电板中的导电铜层和具有酸溶性且能够在酸性介质中施加的黑色金属涂层的电子部件更容易制备并且具有优异的性能。在制备过程中，具有抗蚀剂和任选地具有通孔的导体板和具有自由铜区域（a）的导体板在酸性介质中用黑色金属涂层电镀涂覆; （b）去除抗蚀剂，然后通过蚀刻去除已曝露的铜区域; （c）导体板设置有粘附的焊接掩模; （d）在未被焊接掩模覆盖的那些部分，除去黑色金属涂层，如果需要，由此暴露的铜区域设置有可焊接的金属层。

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