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1. 发明授权

US08766192B2 Method for inspecting a photovoltaic substrate 有权
标题翻译：检查光伏基板的方法
公开(公告)号：US08766192B2
公开(公告)日：2014-07-01
申请号：US12916694
申请日：2010-11-01
申请人： Ran Shi Wang , Jiangwen Deng , Chung Yan Lau
发明人： Ran Shi Wang , Jiangwen Deng , Chung Yan Lau
IPC分类号： G01J5/02
CPC分类号： G01N21/9505 , G01N21/359 , G01N25/72
摘要： A method for inspecting a substrate having intrinsic heterogeneous patterns for the presence of cracks comprises the steps of providing an optical device and front-side lighting on a first side of the substrate and providing near-infrared lighting on a second side of the substrate opposite to the first side. The near-infrared lighting is operable to penetrate the substrate so as to be detectable by the optical device through the substrate. One or more images are obtained by illuminating the substrate with the front-side lighting and/or the near-infrared lighting from the second side. The one or more images are thereafter processed to distinguish between the heterogeneous patterns on the substrate and any cracks present on the substrate.
摘要翻译：用于检查具有固有异质图案的衬底以存在裂缝的方法包括以下步骤：在衬底的第一侧上提供光学器件和前侧照明，并在衬底的与第二侧相对的第二侧上提供近红外线照明第一面。近红外照明可操作地穿透基板，以便可以通过基板通过光学装置检测。利用来自第二面的前侧照明和/或近红外照明照射基板来获得一个或多个图像。此后处理一个或多个图像以区分基底上的异质图案和存在于基底上的任何裂纹。

2. 发明授权

US08651159B2 Die bonder providing a large bonding force 有权
标题翻译：贴片机提供大的粘合力
公开(公告)号：US08651159B2
公开(公告)日：2014-02-18
申请号：US12483529
申请日：2009-06-12
申请人： Sun Kuen Wong , Hon Chiu Hui , Yin Fun Ng
发明人： Sun Kuen Wong , Hon Chiu Hui , Yin Fun Ng
IPC分类号： B29C65/00
CPC分类号： H01L24/83 , H01L24/75 , H01L2224/83 , H01L2224/838 , H01L2924/01033
摘要： A die bonder is provided comprising a bond head including a collet for picking up a die and bonding the die at a bonding site. The die bonder further comprises a first motor which is connected to the collet by a shaft for driving the collet in driving directions towards and away from the bonding site and a second motor which is connected to the bond head for driving the bond head in directions parallel to the driving directions of the first motor. A rotary motor is also operatively connected to the collet for rotating the collet about a rotational axis that is parallel to the driving directions of the first motor. The shaft is slidably connected to the rotary motor and is slidable relative to the rotary motor when it is driven by the first motor to move.
摘要翻译：提供一种管芯接合器，其包括：接合头，其包括用于拾取管芯的夹头并在接合位置接合管芯。管芯接合器还包括第一电动机，该第一电动机通过用于在朝向和远离焊接部位的驱动方向上驱动夹头的轴连接到夹头;以及第二电动机，其连接到用于在平行方向上驱动焊接头的接合头到第一马达的行驶方向。旋转马达也可操作地连接到夹头，用于围绕平行于第一马达的驱动方向的旋转轴旋转夹头。轴可滑动地连接到旋转电动机，并且当其被第一电动机驱动以移动时可相对于旋转电动机滑动。

3. 发明授权

US08011058B2 Singulation handler system for electronic packages 有权
标题翻译：电子封装的分割处理系统
公开(公告)号：US08011058B2
公开(公告)日：2011-09-06
申请号：US11925091
申请日：2007-10-26
申请人： Chi Wah Cheng , Wang Lung Alan Tse , Tim Wai Tony Mak , Ming Cheong Kary Tse
发明人： Chi Wah Cheng , Wang Lung Alan Tse , Tim Wai Tony Mak , Ming Cheong Kary Tse
IPC分类号： A47L5/38
CPC分类号： H01L21/67092
摘要： A singulation handler system is provided for a strip of electronic packages, which comprises an onloader located adjacent to an onloading location for providing an unsingulated strip of packages for singulation and a cutting jig for mounting the strip of unsingulated packages. The cutting jig is movable between the onloading location and a singulation location at which the strip is singulated by a singulation engine. The system further includes a buffer boat for holding singulated packages that have been removed from the cutting jig and which is operative to convey the singulated packages in a fixed relative orientation. A gang pick head is operative to transfer multiple singulated packages simultaneously from the buffer boat to a rotary turret device and an offloader is provided for transferring singulated packages from the rotary turret device to containers in which the singulated packages are storable.
摘要翻译：提供了一种用于电子包装条的分切处理系统，其包括位于加载位置附近的加载器，用于提供用于分割的未卷曲包装条带和用于安装未卷曲包装条的切割夹具。切割夹具可以在加载位置和切片位置之间移动，在该切割位置，条带由分割引擎分割。该系统还包括用于保持已经从切割夹具移除并且以固定的相对定向输送单个包装的单个包装的缓冲舟。组合拾取头可操作以将多个单独包装从缓冲舟同时转移到旋转转塔装置，并且提供卸载器用于将分离的包装从旋转转塔装置传送到其中可分离包装的容器。

4. 发明授权

US07975710B2 Acoustic cleaning system for electronic components 有权
标题翻译：电子元件声学清洗系统
公开(公告)号：US07975710B2
公开(公告)日：2011-07-12
申请号：US12497842
申请日：2009-07-06
申请人： Hon Keung Lai , Hoi Shuen Tang , Wang Lung Tse
发明人： Hon Keung Lai , Hoi Shuen Tang , Wang Lung Tse
IPC分类号： B08B3/00 , B08B3/12 , B08B6/00
CPC分类号： B08B3/12 , Y10S134/902
摘要： An apparatus for cleaning electronic packages comprises a tank containing cleaning fluid and a holder above the tank that supports the electronic packages above a top surface of the cleaning fluid with the electronic packages facing the cleaning fluid. Acoustic energy generators are immersed in the cleaning fluid for generating and propagating acoustic energy towards the top surface of the cleaning fluid to create streaming fluid jets projecting upwardly at the top surface to contact and clean the electronic packages supported on the holder.
摘要翻译：一种用于清洁电子包装的装置，包括一个容纳洗涤流体的罐和一个罐上方的保持器，该电子包装将电子包装物上面的清洁流体的上表面支撑在电子包装件的上方，电子包装件面向清洁流体。声能发生器被浸入清洁流体中，用于向清洁流体的顶表面产生和传播声能，以产生在顶表面向上突出的流体流体射流，以接触和清洁支撑在支架上的电子包装。

5. 发明授权

US07830597B2 Optical system having selectable field for inspection 有权
标题翻译：光学系统具有可选择的检查范围
公开(公告)号：US07830597B2
公开(公告)日：2010-11-09
申请号：US11853296
申请日：2007-09-11
申请人： Siu Wing Lau , Zhuan Yun Zhang , Yiu Ming Cheung , Chi Ping Hung
发明人： Siu Wing Lau , Zhuan Yun Zhang , Yiu Ming Cheung , Chi Ping Hung
IPC分类号： G02B21/00
CPC分类号： G02B21/084 , G02B21/025
摘要： An optical system for viewing an object has a plurality of lenses and a main optical axis coincident with the centers of the lenses. The optical system further comprises a low magnification optical subsystem that is operative to view the object at a first magnification and a high magnification optical subsystem that is operative to view the object at a second magnification that is higher than the first magnification. The high magnification optical subsystem has a high magnification optical axis along which light rays that are received from the main optical axis are transmitted. A movable element is locatable on the high magnification optical axis and is movable in directions transverse to the axis for receiving and transmitting light rays.
摘要翻译：用于观看物体的光学系统具有与透镜的中心一致的多个透镜和主光轴。光学系统还包括低倍率光学子系统，其可操作以在第一放大率下观看物体，以及高倍率光学子系统，其可操作以在高于第一放大率的第二放大率下观察物体。高倍率光学子系统具有高倍率的光轴，沿主光轴从主光轴接收的光线被传送。可移动元件可定位在高放大倍率的光轴上，并且可在横向于轴线的方向上移动以接收和传输光线。

6. 发明授权

US07757742B2 Vibration-induced die detachment system 有权
标题翻译：振动引起的脱模系统
公开(公告)号：US07757742B2
公开(公告)日：2010-07-20
申请号：US11830986
申请日：2007-07-31
申请人： Yiu Ming Cheung , Man Kit Chow
发明人： Yiu Ming Cheung , Man Kit Chow
IPC分类号： B32B38/10
CPC分类号： H01L21/67132 , Y10S438/976 , Y10T156/1121 , Y10T156/1179 , Y10T156/1922 , Y10T156/1983
摘要： A die is detachable from an adhesive tape on which the die is mounted with a die detachment tool comprising a vacuum enclosure that is operative to provide a vacuum suction on the adhesive tape. One or more ejector pins are housed in the vacuum enclosure and are projectable from the vacuum enclosure for lifting the die and adhesive tape. A vibrational tool is housed in the vacuum enclosure adjacent to the ejector pins and it is projectable from the vacuum enclosure to contact a portion of the adhesive tape at which the die is located. The vibrational tool is further operative to oscillate the adhesive tape and die for promoting delamination of the die from the adhesive tape.
摘要翻译：模具可从其上安装有模具的胶带拆卸，其中模具拆卸工具包括真空外壳，该真空外壳可用于在胶带上提供真空吸力。一个或多个推出销被容纳在真空外壳中，并且可从真空外壳中投射以提升模具和胶带。振动工具被容纳在与排出销相邻的真空外壳中，并且可从真空外壳中移出以接触模具所在的粘合带的一部分。振动工具进一步操作以使粘合带和模具振动，以促进模具从胶带剥离。

7. 发明授权

US07726540B2 Apparatus and method for arranging devices for processing 有权
标题翻译：用于处理装置的装置和方法
公开(公告)号：US07726540B2
公开(公告)日：2010-06-01
申请号：US11301064
申请日：2005-12-12
申请人： Chi Wah Cheng , Hoi Shuen Joseph Tang , Tim Wai Tony Mak , See Lok Chan
发明人： Chi Wah Cheng , Hoi Shuen Joseph Tang , Tim Wai Tony Mak , See Lok Chan
IPC分类号： B23K1/14 , B23K5/22 , H01R43/00
CPC分类号： B23K3/087 , B23K2101/42 , G01R31/2893 , Y10T29/53261
摘要： An apparatus is provided for arranging for processing a semiconductor device having surface components on its surface. A device support comprising a set of protrusions for contacting a surface of the semiconductor device supports the semiconductor device on a plane. The protrusions are arranged and positioned such that they avoid contact with the surface components on the surface. In order to grip the semiconductor device supported on the plane, a clamping device having a first set of clamps is configured for gripping the semiconductor device along a first axis and a second set of clamps is configured for gripping the semiconductor device along a second axis perpendicular to the first axis.
摘要翻译：提供了一种用于布置用于处理其表面上具有表面成分的半导体器件的装置。包括用于接触半导体器件的表面的一组突起的器件支撑件在平面上支撑半导体器件。突起被布置和定位成使得它们避免与表面上的表面部件接触。为了夹持支撑在平面上的半导体器件，具有第一组夹具的夹持装置被配置为沿着第一轴夹持半导体器件，并且第二组夹具被配置为沿着垂直于第二轴的夹持半导体器件到第一轴。

8. 发明授权

US07665204B2 Die detachment apparatus comprising pre-peeling structure 有权
标题翻译：脱模装置包括预剥离结构
公开(公告)号：US07665204B2
公开(公告)日：2010-02-23
申请号：US11582055
申请日：2006-10-16
申请人： Yiu Ming Cheung , Shiqiang Yao , Gary Peter Widdowson
发明人： Yiu Ming Cheung , Shiqiang Yao , Gary Peter Widdowson
IPC分类号： B23P19/00 , B29C1/00 , B29C63/00
CPC分类号： H01L21/67132 , Y10T29/49819 , Y10T29/53174 , Y10T29/53191 , Y10T29/53274 , Y10T156/1179
摘要： An apparatus and method are provided for detaching a die from an adhesive film, the apparatus comprising a vacuum platform having a surface configured to support a part of the adhesive film on which the die is attached. A plurality of pre-peeling columns having substantially flat contact surfaces are projectable relative to the surface of the vacuum platform to push against the adhesive film at the position of the die to generate initial peeling between the die and the adhesive film. Thereafter, a plurality of ejector pins that are positionable relative to the pre-peeling columns are operative to push against the adhesive film at the position of the die to generate further peeling between the die and the adhesive film. The die is then removed from the adhesive film.
摘要翻译：提供了一种用于将模具从粘合剂膜上分离的装置和方法，该装置包括一个真空平台，该真空平台具有被配置为支撑其上连接有模具的粘合膜的一部分的表面。具有大致平坦接触表面的多个预剥离柱相对于真空平台的表面是可投射的，以在模具的位置处推压粘合剂膜，以在模具和粘合剂膜之间产生初始剥离。此后，可以相对于预剥离柱定位的多个顶针可操作以在模具的位置处推动粘合剂膜，以在模具和粘合剂膜之间产生进一步的剥离。然后从粘合膜中取出模具。

9. 发明授权

US07602087B2 Linear motor having dual coil configuration 有权
标题翻译：线性电机具有双线圈配置
公开(公告)号：US07602087B2
公开(公告)日：2009-10-13
申请号：US11550866
申请日：2006-10-19
申请人： Gary Peter Widdowson , Dazhang Liao
发明人： Gary Peter Widdowson , Dazhang Liao
IPC分类号： H02K41/00
CPC分类号： H02K41/03 , H02K3/28 , H02K16/04
摘要： A linear motor is provided that includes a magnetic assembly, a movable element and a coil assembly that is operative to interact with the magnetic assembly to drive the movable element along a direction. The coil assembly further includes a first coil section having a first motor force constant and a second coil section having a second motor force constant that is lower than that of the first coil section for driving the movable element along the said direction.
摘要翻译：提供一种线性电动机，其包括磁性组件，可移动元件和线圈组件，其可操作地与磁性组件相互作用以沿着一个方向驱动可移动元件。线圈组件还包括具有第一马达力常数的第一线圈部分和具有比用于沿着所述方向驱动可移动元件的第一线圈部分的第二马达力常数低的第二马达力常数的第二线圈部分。

10. 发明授权

US07458495B2 Flip chip bonding tool 有权
标题翻译：倒装芯片焊接工具
公开(公告)号：US07458495B2
公开(公告)日：2008-12-02
申请号：US10964292
申请日：2004-10-13
申请人： Ran Fu , Deming Liu , Chi Chuen Chaw , Hing Leung Li , Chak Hau Pang , Hing Suen Siu
发明人： Ran Fu , Deming Liu , Chi Chuen Chaw , Hing Leung Li , Chak Hau Pang , Hing Suen Siu
IPC分类号： B23K1/06 , B29C65/08
CPC分类号： B23K20/106 , B23K2101/40 , H01L24/75 , H01L2224/16 , H01L2224/75 , H01L2224/75743 , H01L2224/81205 , H01L2224/81801 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01024 , H01L2924/01033 , H01L2924/01042 , H01L2924/01061 , H01L2924/01074 , H01L2924/01082 , H01L2924/14 , H01L2924/3011 , H01L2224/0401
摘要： A bonding tool and method for bonding a semiconductor chip to a surface is provided wherein the bonding tool includes a bonding tip comprising a ceramic material, preferably titanium carbide. The bonding tip is operative to hold the chip and a bonding energy generator such as an ultrasonic transducer is coupled to the bonding tip for applying bonding energy to the bonding tip and the chip to bond the chip to the surface. The bonding tip may further include martensite such that the titanium carbide is present in a hard phase and the martensite is present in a soft phase as a binder for the same.
摘要翻译：提供了一种用于将半导体芯片接合到表面的接合工具和方法，其中所述接合工具包括具有陶瓷材料的接合末端，优选为碳化钛。接合端可操作以保持芯片，并且诸如超声波换能器的键合能量发生器耦合到接合尖端，以将粘合能量施加到接合尖端和芯片以将芯片粘合到表面。接合端可以进一步包括马氏体，使得碳化钛存在于硬质相中，并且马氏体作为粘合剂存在于软相中。

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