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1. 发明申请

US20060090846A1 Driving mechanism for chip detachment apparatus 有权
标题翻译：排屑装置的驱动机构
公开(公告)号：US20060090846A1
公开(公告)日：2006-05-04
申请号：US10977674
申请日：2004-10-29
申请人： Yiu Cheung , Shiqiang Yao , Gary Widdowson
发明人： Yiu Cheung , Shiqiang Yao , Gary Widdowson
IPC分类号： B29C63/00
CPC分类号： H01L21/6835 , H01L21/67132 , H01L21/67144 , H01L2221/68381 , H01L2221/68386 , Y10S156/932 , Y10S438/976 , Y10T156/1179 , Y10T156/1978 , Y10T156/1983
摘要： A driving mechanism and driving method are provided for driving a detachment tool adapted to detach a chip from an adhesive tape to which the chip is mounted. The mechanism comprises a first actuator coupled to the detachment tool and operative to drive the detachment tool to move along a first axis substantially perpendicular to a surface of the chip, and a second actuator coupled to the detachment tool and operative to drive the detachment tool to move adjacent to a width of the chip along a second axis perpendicular to the first axis. The first actuator is configured to drive the detachment tool for programmable movement along the first axis with respect to the chip in conjunction with the second actuator driving the detachment tool for movement adjacent the width of the chip to provide controlled lifting of the chip for propagation of delamination between the chip and the adhesive tape.
摘要翻译：提供驱动机构和驱动方法，用于驱动适于将芯片从安装有芯片的胶带剥离的拆卸工具。该机构包括联接到分离工具的第一致动器，并且可操作地驱动分离工具沿着基本上垂直于芯片的表面的第一轴线移动;以及第二致动器，其联接到分离工具并且可操作以驱动分离工具沿垂直于第一轴线的第二轴线相邻于芯片的宽度移动。所述第一致动器构造成驱动所述分离工具，用于相对于所述芯片沿着所述第一轴线可编程移动，与所述第二致动器一起驱动所述分离工具，以便在所述芯片的宽度附近移动以提供所述芯片的受控提升以传播芯片与胶带之间的分层。

2. 发明授权

US08013562B2 Driving mechanism having position encoder for two-dimensional positioning 有权
公开(公告)号：US08013562B2
公开(公告)日：2011-09-06
申请号：US12555871
申请日：2009-09-09
申请人： Wai Chuen Gan , Gary Peter Widdowson , Shiqiang Yao , Siu Yan Ho , Hon Yu Peter Ng
发明人： Wai Chuen Gan , Gary Peter Widdowson , Shiqiang Yao , Siu Yan Ho , Hon Yu Peter Ng
IPC分类号： B64C17/06
CPC分类号： H02K16/00 , H02K11/225 , H02K41/03 , H02K2201/18
摘要： A driving mechanism comprises a fixed housing, a movable housing on which an object to be driven is mounted and a driving motor which is operative to drive the movable housing to move linearly as well as to rotate relative to the fixed housing. An inductance-type encoder determines both linear and rotary displacement of the movable housing relative to the fixed housing, whereby to provide closed-loop control of the position of the object in both linear and rotary directions.

3. 发明授权

US07303647B2 Driving mechanism for chip detachment apparatus 有权
标题翻译：排屑装置的驱动机构
公开(公告)号：US07303647B2
公开(公告)日：2007-12-04
申请号：US10977674
申请日：2004-10-29
申请人： Yiu Ming Cheung , Shiqiang Yao , Gary Peter Widdowson
发明人： Yiu Ming Cheung , Shiqiang Yao , Gary Peter Widdowson
IPC分类号： B32B38/10
CPC分类号： H01L21/6835 , H01L21/67132 , H01L21/67144 , H01L2221/68381 , H01L2221/68386 , Y10S156/932 , Y10S438/976 , Y10T156/1179 , Y10T156/1978 , Y10T156/1983
摘要： A driving mechanism and method are provided for driving a detachment tool adapted to detach a chip from an adhesive tape to which the chip is mounted. The mechanism includes a first actuator coupled to the detachment tool and operative to drive the detachment tool to move along a first axis substantially perpendicular to a surface of the chip, and a second actuator coupled to the detachment tool and operative to drive the detachment tool to move adjacent to a width of the chip along a second axis perpendicular to the first axis. The first actuator is configured for programmable movement along the first axis with respect to the chip in conjunction with the second actuator for movement adjacent the width of the chip to provide controlled lifting of the chip for propagation of delamination between the chip and the adhesive tape.
摘要翻译：提供驱动机构和方法，用于驱动适于将芯片从安装有芯片的胶带剥离的拆卸工具。该机构包括联接到分离工具的第一致动器并且可操作地驱动分离工具沿着基本上垂直于芯片的表面的第一轴线移动;以及第二致动器，其联接到分离工具并且可操作以驱动拆卸工具沿垂直于第一轴线的第二轴线相邻于芯片的宽度移动。第一致动器被配置用于相对于芯片与第二致动器相关的第一轴线的可编程移动，以便相邻于芯片的宽度移动，以提供芯片的受控提升，以在芯片和胶带之间传播分层。

4. 发明申请

US20100060086A1 DRIVING MECHANISM HAVING POSITION ENCODER FOR TWO-DIMENSIONAL POSITIONING 有权
公开(公告)号：US20100060086A1
公开(公告)日：2010-03-11
申请号：US12555871
申请日：2009-09-09
申请人： Wai Chuen GAN , Gary Peter WIDDOWSON , Shiqiang YAO , Siu Yan HO , Hon Yu Peter NG
发明人： Wai Chuen GAN , Gary Peter WIDDOWSON , Shiqiang YAO , Siu Yan HO , Hon Yu Peter NG
IPC分类号： H02K57/00 , H02K41/02
CPC分类号： H02K16/00 , H02K11/225 , H02K41/03 , H02K2201/18
摘要： A driving mechanism comprises a fixed housing, a movable housing on which an object to be driven is mounted and a driving motor which is operative to drive the movable housing to move linearly as well as to rotate relative to the fixed housing. An inductance-type encoder determines both linear and rotary displacement of the movable housing relative to the fixed housing, whereby to provide closed-loop control of the position of the object in both linear and rotary directions.

5. 发明授权

US07665204B2 Die detachment apparatus comprising pre-peeling structure 有权
标题翻译：脱模装置包括预剥离结构
公开(公告)号：US07665204B2
公开(公告)日：2010-02-23
申请号：US11582055
申请日：2006-10-16
申请人： Yiu Ming Cheung , Shiqiang Yao , Gary Peter Widdowson
发明人： Yiu Ming Cheung , Shiqiang Yao , Gary Peter Widdowson
IPC分类号： B23P19/00 , B29C1/00 , B29C63/00
CPC分类号： H01L21/67132 , Y10T29/49819 , Y10T29/53174 , Y10T29/53191 , Y10T29/53274 , Y10T156/1179
摘要： An apparatus and method are provided for detaching a die from an adhesive film, the apparatus comprising a vacuum platform having a surface configured to support a part of the adhesive film on which the die is attached. A plurality of pre-peeling columns having substantially flat contact surfaces are projectable relative to the surface of the vacuum platform to push against the adhesive film at the position of the die to generate initial peeling between the die and the adhesive film. Thereafter, a plurality of ejector pins that are positionable relative to the pre-peeling columns are operative to push against the adhesive film at the position of the die to generate further peeling between the die and the adhesive film. The die is then removed from the adhesive film.
摘要翻译：提供了一种用于将模具从粘合剂膜上分离的装置和方法，该装置包括一个真空平台，该真空平台具有被配置为支撑其上连接有模具的粘合膜的一部分的表面。具有大致平坦接触表面的多个预剥离柱相对于真空平台的表面是可投射的，以在模具的位置处推压粘合剂膜，以在模具和粘合剂膜之间产生初始剥离。此后，可以相对于预剥离柱定位的多个顶针可操作以在模具的位置处推动粘合剂膜，以在模具和粘合剂膜之间产生进一步的剥离。然后从粘合膜中取出模具。

6. 发明申请

US20080086874A1 Die detachment apparatus comprising pre-peeling structure 有权
标题翻译：脱模装置包括预剥离结构
公开(公告)号：US20080086874A1
公开(公告)日：2008-04-17
申请号：US11582055
申请日：2006-10-16
申请人： Yiu Ming Cheung , Shiqiang Yao , Gary Peter Widdowson
发明人： Yiu Ming Cheung , Shiqiang Yao , Gary Peter Widdowson
IPC分类号： B23P19/00
CPC分类号： H01L21/67132 , Y10T29/49819 , Y10T29/53174 , Y10T29/53191 , Y10T29/53274 , Y10T156/1179
摘要： An apparatus and method are provided for detaching a die from an adhesive film, the apparatus comprising a vacuum platform having a surface configured to support a part of the adhesive film on which the die is attached. A plurality of pre-peeling columns having substantially flat contact surfaces are projectable relative to the surface of the vacuum platform to push against the adhesive film at the position of the die to generate initial peeling between the die and the adhesive film. Thereafter, a plurality of ejector pins that are positionable relative to the pre-peeling columns are operative to push against the adhesive film at the position of the die to generate further peeling between the die and the adhesive film. The die is then removed from the adhesive film.
摘要翻译：提供了一种用于将模具从粘合剂膜上分离的装置和方法，该装置包括一个真空平台，该真空平台具有被配置为支撑其上连接有模具的粘合膜的一部分的表面。具有大致平坦接触表面的多个预剥离柱相对于真空平台的表面是可投射的，以在模具的位置处推压粘合剂膜，以在模具和粘合剂膜之间产生初始剥离。此后，可以相对于预剥离柱定位的多个顶针可操作以在模具的位置处推动粘合剂膜，以在模具和粘合剂膜之间产生进一步的剥离。然后从粘合膜中取出模具。

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