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    • 88. 发明授权
    • Control of oxygen- and carbon-related crystal defects in silicon
processing
    • 硅处理中氧和碳相关晶体缺陷的控制
    • US4400232A
    • 1983-08-23
    • US319638
    • 1981-11-09
    • Paul D. OwnbyPaul E. Grayson
    • Paul D. OwnbyPaul E. Grayson
    • C30B15/04C30B33/00
    • C30B29/06C30B15/04C30B33/00Y10S117/90Y10S117/916
    • In the production of silicon articles at an elevated temperature, a stream comprising a controlled mixture of an oxygen-containing first gas and a second gas is admitted to the processing chamber. The first gas is one which partially dissociates under the conditions in the chamber to form both oxygen and the second gas. The second gas is one which is not harmful to silicon at the conditions in the chamber. Substantially equilibrium conditions are established in the chamber so that the dissociation of the first gas to oxygen occurs reversibly. The partial pressure of oxygen (P.sub.O.sbsb.2) is sensed in the chamber during processing of the article. In response to the P.sub.O.sbsb.2 level, the ratio of the rates of flow of the oxygen-containing gas and the second gas is adjusted so as to maintain the P.sub.O.sbsb.2 at a level less than about 10.sup.-6 atmosphere, and usually no greater than about 10.sup.-10 atmosphere, at which the density of oxygen-related defects in the processed silicon article is acceptably low. Oxygen-related defects in the silicon are thereby reduced. If graphite structures are present in the hot zone of the processing chamber, they are preferably coated with an impervious coating which will stand the high temperature and will prevent the gas stream from coming into contact with the hot graphite. Carbon-related defects in the silicon are thereby also reduced.
    • 在高温下制造硅制品时,包含含氧第一气体和第二气体的受控混合物的物流进入处理室。 第一气体是在室内的条件下部分解离以形成氧气和第二气体的气体。 第二种气体是在室内条件下对硅无害的气体。 在室中建立了基本上平衡的条件,使得第一气体与氧的解离可逆地发生。 在制品的处理过程中,室内感测氧气分压(PO2)。 响应于PO2水平,调节含氧气体和第二气体的流速比,以将PO 2保持在低于约10-6气氛的水平,通常不大于约10 -10气氛中,加工硅制品中氧相关缺陷的密度可接受地低。 因此,与硅中的氧相关的缺陷减少。 如果石墨结构存在于处理室的热区中,则它们优选地涂覆有将保持高温并且将防止气流与热石墨接触的不透水涂层。 因此,硅中的碳相关缺陷也降低。
    • 89. 发明授权
    • Device and process for pulling high-purity semiconductor rods from a melt
    • 从熔体中拉出高纯度半导体棒的装置和工艺
    • US4330362A
    • 1982-05-18
    • US240537
    • 1981-03-04
    • Werner Zulehner
    • Werner Zulehner
    • C30B15/00C30B15/02C30B15/14H01L21/208C30B15/22
    • C30B15/02C30B15/14Y10S117/90Y10T117/1056Y10T117/106
    • In the crucible pulling of silicon according to the Czochralski technique,ilicon monoxide forms as a result of the silicon melt reacting with the quartz crucible containing the melt, and evaporates and deposits in the form of solid particles on the upper edge of the crucible, on the monocrystalline rod, on the walls of the vessel, and also on recharging devices in the upper pulling chamber. These solid particles can fall back into the melt and then cause dislocations and polycrystalline growth in the growing silicon rod. As a result of the reaction of the carbon of the hot graphite parts with silicon monoxide, carbon monoxide is also formed and this partially diffuses into the melt and gives rise to carbon impurities in the silicon rod. In addition, because of heat irradiation from the inner wall of the quartz crucible as it becomes more empty, high pulling speeds, such as those usual in crucible-free zone pulling, cannot be obtained. These disadvantages of the conventional crucible-pulling process are effectively obviated according to the invention by a pot-like device which entails a partial covering of the melt surface, the crucible and the space laterally adjoining the crucible.
    • 在根据切克劳斯基(Czochralski)技术的坩埚拉硅中,由于硅熔体与含有熔体的石英坩埚反应而形成一氧化硅,并在坩埚的上边缘上以固体颗粒的形式蒸发并沉积在坩埚的上边缘上 容器的壁上的单晶棒,以及上拉室中的再充电装置。 这些固体颗粒可以回落到熔体中,然后在生长的硅棒中引起位错和多晶生长。 由于热石墨部分的碳与一氧化硅反应的结果,也形成一氧化碳,并且这部分地扩散到熔体中并在硅棒中产生碳杂质。 此外,由于当石英坩埚变得更空时由于来自石英坩埚的内壁的热照射,不能获得诸如通常在无坩埚区域拉伸中的高牵引速度。 根据本发明,通过盆形装置有效地避免了常规坩埚拉拔过程的这些缺点,该盆形装置需要部分地覆盖熔体表面,坩埚和横向邻接坩埚的空间。