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81. 发明授权

US06387969B1 Porous article and process for producing porous article 有权
标题翻译：多孔制品和多孔制品生产工艺
公开(公告)号：US06387969B1
公开(公告)日：2002-05-14
申请号：US09655441
申请日：2000-09-05
申请人： Takayuki Yamamoto , Amane Mochizuki , Takahiro Fukuoka , Tomohiro Taruno , Mitsuhiro Kanada
发明人： Takayuki Yamamoto , Amane Mochizuki , Takahiro Fukuoka , Tomohiro Taruno , Mitsuhiro Kanada
IPC分类号： C08J926
CPC分类号： H05K3/0011 , C08J9/26 , C08J2201/042 , C08J2201/046 , C08J2203/08 , H05K2201/0116 , H05K2203/0773 , H05K2203/0783 , H05K2203/083 , Y02P20/544
摘要： A porous article having excellent heat resistance, a finely cellular structure, and a low dielectric constant; and a process for producing the porous article which comprises subjecting a polymer composition having a micro-domain structure comprising a continuous polymer phase and dispersed therein a discontinuous phase having an average diameter smaller than 10 &mgr;m to a treatment for removing the ingredient constituting the discontinuous phase by at least one operation selected from vaporization and decomposition and by an extraction operation to thereby make the polymer porous. The ingredient constituting the discontinuous phase has a weight average molecular weight of, e.g., 10,000 or lower. Liquefied carbon dioxide, supercritical carbon dioxide, or the like can be used as an extraction solvent for the ingredient constituting the discontinuous phase.
摘要翻译：具有优异的耐热性，细孔结构和低介电常数的多孔制品; 以及一种制造多孔制品的方法，该方法包括使包含连续聚合物相的微结构结构的聚合物组合物分散在平均直径小于10μm的不连续相中，以除去构成不连续相的成分通过选自蒸发和分解的至少一种操作和通过萃取操作，从而使聚合物多孔。构成不连续相的成分的重均分子量例如为10,000以下。可以使用液化二氧化碳，超临界二氧化碳等作为构成不连续相的成分的提取溶剂。

82. 发明授权

US06306980B1 Resin composites and method for producing the same 失效
标题翻译：树脂复合材料及其制备方法
公开(公告)号：US06306980B1
公开(公告)日：2001-10-23
申请号：US09552642
申请日：2000-04-19
申请人： Dong Dong Wang , Motoo Asai
发明人： Dong Dong Wang , Motoo Asai
IPC分类号： C08F28300
CPC分类号： H05K3/387 , C08L63/00 , C08L71/00 , C08L81/06 , C08L101/00 , H05K3/181 , H05K3/4661 , H05K3/4676 , H05K2201/0129 , H05K2201/0212 , H05K2203/0773 , C08L2666/22 , C08L2666/02 , C08L2666/04
摘要： A novel resin composite consists of a thermosetting resin or photosensitive resin and a thermoplastic resin and has a guasi-homogeneous compatible structure not only having properties inherent to the thermosetting or photosensitive resin but also exhibiting values of properties higher than those inherent to the thermoplastic resin.
摘要翻译：一种新型树脂复合材料由热固性树脂或感光性树脂和热塑性树脂组成，并且具有不仅具有热固性或感光性树脂固有性能，而且具有高于热塑性树脂固有性能的特性值的均匀相容的结构。

83. 发明授权

US06294744B1 Multilayer print circuit board and the production method of the multilayer print circuit board 有权
公开(公告)号：US06294744B1
公开(公告)日：2001-09-25
申请号：US09413146
申请日：1999-10-06
申请人： Tohru Kinoshita
发明人： Tohru Kinoshita
IPC分类号： H05K102
CPC分类号： H05K3/421 , H05K3/381 , H05K3/426 , H05K3/4661 , H05K2201/0158 , H05K2201/0195 , H05K2201/0209 , H05K2201/09509 , H05K2201/09518 , H05K2201/09827 , H05K2203/0773 , H05K2203/0796 , Y10S428/901
摘要： The present invention provides a multilayer print circuit board having at least an inner print circuit pattern and an outer print circuit pattern which are laminated on a substrate through an insulation layer and being electrically connected to each other through a blind hole provided in the insulation layer. The insulation layer is composed of a resin insoluble in an oxidization agent and inorganic powder dispersed in the resin. The inorganic powder is soluble in the oxidization agent. The surface of insulation layer and the wall of the blind hole are roughed by the oxidization agent before the outer print circuit pattern is formed on the surface of the insulation layer by plating, whereby the inorganic powder exposed to the oxidization agent is melted therein, resulting in the roughed surface of the insulation layer and the wall of the blind hole.

84. 发明授权

US5976762A Photosensitive element and process for producing multilayer printed wiring board 失效
标题翻译：用于生产多层印刷电路板的感光元件和工艺
公开(公告)号：US5976762A
公开(公告)日：1999-11-02
申请号：US807776
申请日：1997-02-28
申请人： Takashi Takayanagi
发明人： Takashi Takayanagi
IPC分类号： G03F7/004 , G03F7/095 , G03F7/11 , H05K1/03 , H05K3/00 , H05K3/24 , H05K3/38 , H05K3/40 , H05K3/46
CPC分类号： H05K3/4661 , G03F7/11 , H05K2201/0209 , H05K2203/066 , H05K2203/0773 , H05K2203/0793 , H05K3/0023 , H05K3/381 , Y10S430/155
摘要： A photosensitive element comprising a temporary support having thereon an aqueous resin layer which contains at least one kind of fine particles having an average particle size or agglomerated particle size of 1 to 10 .mu.m. The fine particles impart a roughened surface to the aqueous resin layer. Furthermore, a photosensitive insulating resin layer is provided on the aqueous resin layer. Also disclosed is an insulating resin image having a roughened surface which is prepared by a process comprising the steps of providing the above-described photosensitive element, laminating the photosensitive element on an insulating substrate, and pattern exposing and developing the photosensitive insulating resin layer. Also disclosed is a process for producing an multilayer printed wiring board comprising the steps of laminating the above-described photosensitive element on an insulating substrate having thereon a first wiring pattern, forming via holes in the photosensitive insulating resin layer, depositing a conductive material on the photosensitive insulating resin layer and in the via holes, and forming a second wiring pattern on the insulating resin layer which is interconnected to the first wiring pattern through the via holes.
摘要翻译：一种感光元件，其特征在于，具有临时支撑体，其上具有含有平均粒径或聚集粒径为1〜10μm的至少一种微粒的水性树脂层。细颗粒赋予水性树脂层粗糙的表面。此外，在水性树脂层上设置感光绝缘树脂层。还公开了具有粗糙表面的绝缘树脂图像，其通过包括以下步骤制备的方法制备，所述方法包括提供上述感光元件，将光敏元件层压在绝缘基板上，以及图案曝光和显影感光绝缘树脂层。还公开了一种制造多层印刷布线板的方法，包括以下步骤：将上述感光元件层压在其上具有第一布线图案的绝缘基板上，在感光绝缘树脂层中形成通孔，将导电材料沉积在感光绝缘树脂层和通孔中，并且在绝缘树脂层上形成第二布线图案，绝缘树脂层通过通孔与第一布线图形互连。

85. 发明授权

US5804256A Method and device for coating printed-circuit boards 失效
标题翻译：涂布印刷电路板的方法和装置
公开(公告)号：US5804256A
公开(公告)日：1998-09-08
申请号：US765076
申请日：1996-12-23
申请人： Hans-Jorgen Schafer
发明人： Hans-Jorgen Schafer
IPC分类号： B05C1/00 , B05C1/08 , G03F7/16 , H01L21/48 , H05K3/00 , H05K3/10 , H05K3/18 , H05K3/22 , H05K3/46 , B05D3/06
CPC分类号： G03F7/168 , B05C1/006 , B05C1/0808 , G03F7/16 , H01L21/4857 , H05K3/0091 , H05K3/4644 , H05K3/4661 , H05K2201/0209 , H05K2203/0143 , H05K2203/0773 , H05K2203/0789 , H05K2203/081 , H05K2203/1105 , H05K2203/1121 , H05K2203/1509 , H05K2203/1572 , H05K3/0023 , H05K3/108 , H05K3/181 , H05K3/227
摘要： The method of forming a multilayer printed circuit board includes applying a photopolymerizable coating append having a solid content of 70 to 95% by weight and a viscosity of 10 to 60 Pa.s of 25.degree. C. to a surface of the applicator cooled to a temperature of 5.degree. C. by a metering roll surface of which is controllably maintained at a temperature range from 25.degree. to 60.degree. C., so that the coating agent is deposited on opposite sides of a board and has an application viscosity of 20 to 100 Pa.s at a coating speed of 5 to 20 m/min to form a film thickening of 10 to 200 .mu.m.
摘要翻译： PCT No.PCT / EP95 / 02309 Sec。 371日期：1996年12月23日 102（e）日期1996年12月23日PCT归档1995年6月14日PCT公布。出版物WO96 / 日期1996年1月4日形成多层印刷电路板的方法包括将固体含量为70〜95重量％，粘度为10〜60Pa·s的25℃的光聚合性涂料添加到涂布器通过可控地保持在25℃至60℃的温度范围内的计量辊表面将其冷却至5℃的温度，使得涂覆剂沉积在板的相对侧上，并具有涂布粘度为20〜100Pa.s，涂布速度为5〜20m / min，形成10〜200μm的膜增稠。

86. 发明授权

US5741575A Adhesive for printed circuit board 失效
标题翻译：印刷电路板用粘合剂
公开(公告)号：US5741575A
公开(公告)日：1998-04-21
申请号：US755804
申请日：1996-12-17
申请人： Motoo Asai , Chie Onishi
发明人： Motoo Asai , Chie Onishi
IPC分类号： C08G59/18 , C08G59/38 , C08L63/00 , C09J7/00 , C09J163/00 , H01B3/40 , H05K3/00 , H05K3/18 , H05K3/38 , H05K3/42 , H05K3/46 , B32B9/00
CPC分类号： H05K3/4661 , C08G59/18 , C08G59/38 , C08L63/00 , C09J163/00 , C09J7/00 , H01B3/40 , H05K3/387 , H05K2201/0154 , H05K2201/0212 , H05K2203/0143 , H05K2203/066 , H05K2203/0773 , H05K2203/0789 , H05K2203/0796 , H05K3/0035 , H05K3/181 , H05K3/184 , H05K3/426 , H05K3/4644 , Y10S428/901 , Y10S525/934 , Y10S525/935 , Y10T428/24843 , Y10T428/24893 , Y10T428/24917 , Y10T428/24926 , Y10T442/674
摘要： There are disclosed an adhesive obtained by dispersing a cured amino resin fine powder soluble in acid or oxidizing agent into an uncured heat-resistant resin matrix hardly soluble in acid or oxidizing agent when being subjected to a curing treatment as well as a printed circuit board using this adhesive and a method of producing the same. The adhesive has excellent properties such as resistance to chemicals, heat resistance, electric properties, hardness and adhesion property owing to the use of the amino resin fine powder. Therefore, the printed circuit board using such an adhesive is not influenced by service circumstance and is high in the connection reliability without forming short circuit between patterns. Furthermore, in the method of producing the printed circuit board, the adhesive is provided in form of a sheet or a prepreg, whereby the printed circuit board can be produced easily and cheaply.
摘要翻译：公开了一种粘合剂，其通过将可溶于酸或氧化剂的固化的氨基树脂细粉末分散在难溶于酸或氧化剂的未固化的耐热树脂基质中，以及使用该粘合剂及其制造方法。粘合剂由于使用氨基树脂细粉而具有优异的性能，如耐化学性，耐热性，电性能，硬度和粘合性。因此，使用这种粘合剂的印刷电路板不受服务环境的影响，连接可靠性高，不会形成图案之间的短路。此外，在制造印刷电路板的方法中，粘合剂以片材或预浸料的形式提供，由此可以容易且廉价地制造印刷电路板。

87. 发明授权

US5589250A Resin compositions and printed circuit boards using the same 失效
标题翻译：树脂组合物和使用其的印刷电路板
公开(公告)号：US5589250A
公开(公告)日：1996-12-31
申请号：US518358
申请日：1995-08-23
申请人： Motoo Asai , Ritsuko Kato
发明人： Motoo Asai , Ritsuko Kato
IPC分类号： G03F7/11 , H05K1/02 , H05K3/00 , H05K3/18 , H05K3/34 , H05K3/38 , H05K3/46 , B32B9/00
CPC分类号： H05K1/0269 , G03F7/11 , H05K3/4661 , H05K2201/0212 , H05K2203/072 , H05K2203/0773 , H05K2203/0789 , H05K2203/0796 , H05K2203/161 , H05K3/0023 , H05K3/181 , H05K3/184 , H05K3/3452 , H05K3/381 , H05K3/382 , H05K3/384 , H05K3/4644 , Y10T428/24917
摘要： A resin composition as well as a printed circuit board using the same are disclosed. The resin composition is formed by dispersing powder of a cured heat-resistant resin powder soluble in acid or oxidizing agent into a matrix of an uncured photosensitive resin hardly soluble in acid or oxidizing agent, in which a coloring matter is added to the resin matrix and/or the heat-resistant resin powder.
摘要翻译：公开了一种树脂组合物以及使用其的印刷电路板。树脂组合物通过将可溶于酸或氧化剂的固化的耐热树脂粉末的粉末分散在难溶于酸或氧化剂的未固化感光树脂的基质中形成，其中将着色剂加入到树脂基质中， /或耐热树脂粉末。

88. 发明授权

US5519177A Adhesives, adhesive layers for electroless plating and printed circuit boards 失效
标题翻译：粘合剂，无电镀层和印刷电路板的粘合层
公开(公告)号：US5519177A
公开(公告)日：1996-05-21
申请号：US243172
申请日：1994-05-16
申请人： Dong D. Wang , Motoo Asai
发明人： Dong D. Wang , Motoo Asai
IPC分类号： C08J3/00 , C08L63/00 , C08L63/10 , C08L71/00 , C09J171/00 , C23C18/20 , H05K3/00 , H05K3/18 , H05K3/46 , H05K1/02
CPC分类号： H05K3/4661 , C08J3/005 , C08L63/00 , C08L63/10 , C08L71/00 , C09J171/00 , C23C18/2033 , C23C18/208 , C23C18/24 , C23C18/30 , H05K2201/0129 , H05K2201/0212 , H05K2203/0773 , H05K2203/0789 , H05K2203/0796 , H05K3/0023 , H05K3/181
摘要： An adhesive usable for electroless plating in the formation of printed circuit boards is formed by dispersing a cured heat-resistant resin powder soluble in an acid or an oxidizing agent into an uncured heat-resistant resin matrix hardly soluble in an acid or an oxidizing agent after the curing treatment, in which the heat-resistant resin matrix is a mixture of a thermoplastic resin and an uncured thermosetting resin or an uncured photosensitive resin.
摘要翻译：通过将可溶于酸或氧化剂的固化的耐热树脂粉末分散在难溶于酸或氧化剂的未固化的耐热树脂基体中，形成印刷电路板形成中的无电镀的粘合剂。其中耐热树脂基质是热塑性树脂和未固化的热固性树脂或未固化的感光树脂的混合物的固化处理。

89. 发明授权

US4216246A Method of improving adhesion between insulating substrates and metal deposits electrolessly plated thereon, and method of making additive printed circuit boards 失效
标题翻译：提高绝缘基板与无电镀金属镀层之间的附着力的方法以及制造添加剂印刷电路板的方法
公开(公告)号：US4216246A
公开(公告)日：1980-08-05
申请号：US905398
申请日：1978-05-12
申请人： Yorio Iwasaki , Toshiro Okamura , Akishi Nakaso , Nobuo Uozu , Hiroshi Takahashi
发明人： Yorio Iwasaki , Toshiro Okamura , Akishi Nakaso , Nobuo Uozu , Hiroshi Takahashi
IPC分类号： C23C18/16 , C23C18/20 , H05K3/18 , H05K3/38 , B05D3/06
CPC分类号： H05K3/387 , C23C18/1605 , C23C18/1608 , C23C18/1612 , C23C18/2086 , H05K2201/0133 , H05K2201/0212 , H05K2203/0773 , H05K3/181
摘要： A method of improving adhesion between the surface of a substrate and a metal deposit electrolessly plated thereon by forming a novel adhesive material layer comprising (A) a rubber material and (B) a thermosetting resin which is present in a proportion defined by the formula 20.ltoreq.(B)/(A)+(B).ltoreq.85 volume %. In the adhesive layer the thermosetting resin is dispersed, in the form of substantially spherical particles of 0.5 to 15.mu., in the continuous phase of the rubber material. The method is useful for producing printed circuit boards having a high precision and high accuracy pattern circuit. Further, the method is extremely advantageous when it is applied to the so-called photo-forming process since disappearance of the catalyst nuclei on the circuit pattern image can be eliminated.
摘要翻译：通过形成包含（A）橡胶材料的新型粘合剂层和（B）按照式20所定义的比例存在的热固性树脂，改善基材表面和无电镀在其上的金属沉积物之间的粘附性的方法

90. 发明授权

US3625758A Base material and method for the manufacture of printed circuits 失效
标题翻译：印刷电路制造的基础材料和方法
公开(公告)号：US3625758A
公开(公告)日：1971-12-07
申请号：US3625758D
申请日：1967-02-21
申请人： PHOTOCIRCUITS CORP
发明人： STAHL FRITZ THEODOR , BRAUN HEDWIG MARIA , SCHNEBLE JR FREDERICK W , MCCORMACK JOHN F
IPC分类号： H05K1/03 , C23C18/20 , C23C18/40 , H05K3/18 , H05K3/38 , H05K3/10 , C23C5/00
CPC分类号： H05K3/387 , C23C18/208 , C23C18/2086 , C23C18/24 , C23C18/30 , C23C18/405 , H05K2201/0133 , H05K2201/0212 , H05K2203/0773 , Y10S428/901 , Y10T29/49124 , Y10T428/24893 , Y10T428/24917 , Y10T428/249978
摘要： This invention relates to metallizing insulating base materials and more particularly to rendering insulating materials sensitive to electroless metal deposition and then depositing electroless metal on the sensitized material, and to the resulting new and improved metallized articles, including printed circuit boards.

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