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81. 发明申请

US20090026583A1 Method of Producing 3-D Mold, Method of Producing Finely Processed Product, Method of Producing Fine-Pattern Molded Product, 3-D Mold, Finely Processed Product, Fine-Pattern Molded Product and Optical Component 失效
标题翻译：三维模具生产方法，精细加工产品生产方法，精细图案模制品生产方法，三维模具，精细加工产品，精细图案成型产品及光学元件
公开(公告)号：US20090026583A1
公开(公告)日：2009-01-29
申请号：US11816773
申请日：2006-02-21
申请人： Jun Taniguchi
发明人： Jun Taniguchi
IPC分类号： H01L29/06 , G21G5/00 , H01L21/00
CPC分类号： B29C33/3842 , B29C33/424 , B29K2083/00 , B81C99/0085 , B82Y10/00 , B82Y40/00 , G03F7/0002 , G03F7/0017 , H01J37/3174
摘要： To provide production methods for a 3-D mold, a finely processed product, and a fine pattern molded product in which the depth and the line width can be formed with high precision, a 3-D mold, a finely processed product, a fine-pattern molded product, and an optical element formed with high precision.A method of producing a 3-D mold that is configured to control depth within 10 nm and form a line width of 200 nm or less, wherein an irradiation step, which irradiates an electron beam to a resist layer of an object of processing that has the resist layer constituted with a polysiloxane-based material on or above a substrate, includes a step having irradiation conditions such that the acceleration voltage is from 1 kV to 3 kV without generation of the backscattering and the dosage is 400 μC/cm2, a method of producing finely processed product using the 3-D mold, a method of producing fine-pattern molded product using the 3-D mold or the finely processed product, and the 3-D mold, the finely processed product, the fine-pattern molded product, and an optical element formed with high precision with these production methods.
摘要翻译：为了提供三维模具，精细加工产品和精细图案模制产品的制造方法，其中可以高精度地形成深度和线宽度，三维模具，精细加工的产品，细微的图案模制产品和高精度地形成的光学元件。一种制造三维模具的方法，其被配置为控制10nm内的深度并形成200nm以下的线宽，其中照射步骤将电子束照射到具有在基板上或上方由基于聚硅氧烷的材料构成的抗蚀剂层包括具有使得加速电压为1kV〜3kV而不产生后向散射且剂量为400μC/ cm 2的照射条件的工序，使用3-D模具生产精细加工的产品，使用3-D模具或精细加工产品制造精细图案模制产品的方法，以及3-D模具，精加工产品，精细图案模制产品和以这些制造方法高精度地形成的光学元件。

82. 发明申请

US20090025427A1 Manufacturing Method for Micro Components 审中-公开
标题翻译：微型零件制造方法
公开(公告)号：US20090025427A1
公开(公告)日：2009-01-29
申请号：US11839690
申请日：2007-08-16
申请人： Ching-Cherng Sun , Shih-Hsin Ma , Tsung-Xian Lee
发明人： Ching-Cherng Sun , Shih-Hsin Ma , Tsung-Xian Lee
IPC分类号： C03B23/023
CPC分类号： B81C99/0085 , B81B2201/047
摘要： A manufacturing method for micro components includes the steps of manufacturing a large component by molding and shaping a thermally contractible material; heating and cooling the large component, such that the size of the large component can be reduced by the contraction of the material to form a reduced component; duplicating the reduced component to obtain a mold; and manufacturing a further reduced component by the molding and shaping process of the mold. The manufacturing method simply requires the processes of duplicating the component, contracting the material with an equal contraction ratio, and preparing the mold, and thus the manufacturing method is simple, easy and fast. The method can overcome the shortcomings of the prior art, of which the precision and the freedom for the external design of the micro components cannot be controlled easily.
摘要翻译：微型部件的制造方法包括以下步骤：通过模制和成形热收缩材料来制造大部件; 加热和冷却大部件，使得可以通过材料的收缩来减小大部件的尺寸以形成减少的部件; 复制还原组分以获得模具; 并通过模具的成型和成型工艺制造进一步减少的部件。制造方法简单地要求复制部件，以等收缩比收缩材料，制备模具的过程，因此制造方法简单，容易和快速。该方法可以克服现有技术的缺点，其中微组件的外部设计的精度和自由度不能容易地被控制。

83. 发明申请

US20090004737A1 Microfluidic Devices and Methods for Fabricating the Same 有权
标题翻译：微流体装置及其制造方法
公开(公告)号：US20090004737A1
公开(公告)日：2009-01-01
申请号：US11944095
申请日：2007-11-21
申请人： Jeffrey T. Borenstein , Chris Bettinger , David Kaplan
发明人： Jeffrey T. Borenstein , Chris Bettinger , David Kaplan
IPC分类号： C12N5/00 , B01J19/00 , C12M3/00 , G05D7/00 , B32B38/00
CPC分类号： C12M25/02 , B01L3/502707 , B01L2200/12 , B01L2300/163 , B81B2201/058 , B81C99/0085 , C12M23/16 , C12M23/20 , C12M29/10 , Y10T137/0324
摘要： A microfluidic device includes, in one embodiment, a first silk film coupled to a second silk film with at least one microchannel therebetween.
摘要翻译：在一个实施例中，微流体装置包括与第二丝膜连接的第一丝膜，其间具有至少一个微通道。

84. 发明申请

US20080230951A1 Methods for making microfluidic devices and devices produced thereof 有权
标题翻译：制造微流体装置及其装置的方法
公开(公告)号：US20080230951A1
公开(公告)日：2008-09-25
申请号：US12072754
申请日：2008-02-28
申请人： Thierry Luc Alain Dannoux , Paulo Gaspar Jorge Marques , Robert Michael Morena , Cameron Wayne Tanner
发明人： Thierry Luc Alain Dannoux , Paulo Gaspar Jorge Marques , Robert Michael Morena , Cameron Wayne Tanner
IPC分类号： B28B11/08
CPC分类号： C03B23/203 , B81B2201/051 , B81C99/0085 , B81C2201/019 , B81C2201/036 , C03B2215/412
摘要： Described herein are methods for making microfluidic devices comprising glass or glass-containing materials, wherein the methods have decreased cost and/or improved dimensional properties over similar formed glass articles produced using current techniques.
摘要翻译：本文描述了用于制造包含玻璃或含玻璃材料的微流体装置的方法，其中相对于使用当前技术制备的相似的成形玻璃制品，所述方法具有降低的成本和/或改善的尺寸性能。

85. 发明申请

US20080131550A1 Mold and Molding Apparatus Using the Same 失效
公开(公告)号：US20080131550A1
公开(公告)日：2008-06-05
申请号：US12024338
申请日：2008-02-01
申请人： Junichi Seki , Tohru Den
发明人： Junichi Seki , Tohru Den
IPC分类号： B28B11/10
CPC分类号： G03F7/0002 , B29C35/02 , B29C43/003 , B29C43/021 , B29C59/002 , B29C59/022 , B29C2043/025 , B29C2043/3634 , B29C2059/023 , B81C99/0085 , B81C2201/034 , B82Y10/00 , B82Y40/00
摘要： A molding apparatus for patterning a workpiece includes a mold having a pattern to be transferred to the workpiece, with the pattern including recesses, a first support member for supporting the mold, and a second support member, arranged opposite to the first support member, for supporting the workpiece. A pressing mechanism brings the first and second support members close to each other and presses the mold and the workpiece together so as to transfer, to the workpiece, the pattern on the mold. Recessed portions are provided on at least one of a surface of the mold on the first support member side, a region of the first support member, and a region of the second support member. The recessed portions correspond to recesses in the pattern of the mold.

86. 发明授权

US07338753B2 Method for manufacturing metal microstructure 失效
标题翻译：制造金属微观结构的方法
公开(公告)号：US07338753B2
公开(公告)日：2008-03-04
申请号：US11503303
申请日：2006-08-14
申请人： Jun Yorita , Yoshihiro Hirata , Tsuyoshi Haga
发明人： Jun Yorita , Yoshihiro Hirata , Tsuyoshi Haga
IPC分类号： G03F7/039
CPC分类号： B81C99/0085 , B81C2201/032 , C25D1/003 , H01L21/4821 , H05K3/202 , H05K3/205
摘要： A method of manufacturing a metal microstructure (1) by using a resin mold (13). In order to provide a method in which a mild manufacturing condition which causes less damage to the resin mold (13) can be set and the high-precision metal microstructure (1) can be mass-produced by uniform electroforming, the method of manufacturing the metal microstructure (1) according to the present invention includes the steps of: fixing on a conductive substrate (11) the resin mold (13) having a vacant portion penetrating in the direction of thickness, by interposing a photosensitive polymer (12) having a chemical composition changed by an electron beam, ultraviolet radiation or visible radiation so as to form a layered structure (2) having the resin mold (13); exposing the layered structure (2) having the resin mold (13) to an electron beam, ultraviolet radiation or visible radiation; removing an exposed photosensitive polymer (12c) existing at the vacant portion of the resin mold (13); and filling with a metal (14) the vacant portion of the layered structure (2) having the resin mold (13) by electroforming.
摘要翻译：一种通过使用树脂模具（13）制造金属微结构（1）的方法。为了提供可以设定对树脂模具（13）造成较小损害的温和制造条件并且可以通过均匀电铸来大量生产高精度金属微结构（1）的方法，制造根据本发明的金属微结构（1）包括以下步骤：通过插入具有一个或多个金属微结构（1）的光敏聚合物（12）将具有穿过厚度方向的空白部分的树脂模具（13）固定在导电基板（11）上，化学成分由电子束，紫外线辐射或可见光辐射而变化，形成具有树脂模具（13）的层状结构（2）。将具有树脂模具（13）的层状结构（2）暴露于电子束，紫外线或可见光; 去除存在于树脂模具（13）的空缺部分的暴露的光敏聚合物（12c）; 并通过电铸将金属（14）填充到具有树脂模具（13）的层状结构（2）的空位部分上。

87. 发明申请

US20070275193A1 Functional Materials and Novel Methods for the Fabrication of Microfluidic Devices 审中-公开
标题翻译：功能材料和微流控器件制造的新方法
公开(公告)号：US20070275193A1
公开(公告)日：2007-11-29
申请号：US10589222
申请日：2005-02-14
申请人： Joseph DeSimone , Jason Rolland , Ginger Rothrock
发明人： Joseph DeSimone , Jason Rolland , Ginger Rothrock
IPC分类号： B32B7/02 , B05D1/40 , B05D3/02 , C08F16/24 , C12M1/40 , H05H1/00 , G01F13/00 , C08G73/24 , B67D5/00 , B05D3/06
CPC分类号： B81C99/0085 , B01L3/0268 , B01L3/502707 , B01L3/502738 , B01L7/52 , B01L2200/12 , B01L2300/0816 , B01L2400/0481 , B01L2400/0655 , B29C66/9121 , B81B2201/051 , B81C1/00206 , B81C2201/019 , B81C2201/034 , F16K99/0001 , F16K99/0015 , F16K99/0034 , F16K2099/008 , F16K2099/0084 , Y10T137/0329 , Y10T428/13 , Y10T428/24
摘要： The presently disclosed subject matter provides functional perfluoropolyether (PFPE) materials for use in fabricating and utilizing microscale devices, such as a microfluidic device. The functional PFPE materials can be used to adhere layers of PFPE materials to one another or to other substrates to form a microscale device. Further, the presently disclosed subject matter provides a method for functionalizing the interior surface of a microfluidic channel and/or a microtiter well. Also the presently disclosed subject matter provides a method for fabricating a microscale structure through the use of a sacrificial layer of a degradable material.
摘要翻译：目前公开的主题提供了用于制造和利用诸如微流体装置的微量装置的功能性全氟聚醚（PFPE）材料。功能性PFPE材料可用于将PFPE材料层彼此粘附或粘附到其它基底上以形成微米级装置。此外，目前公开的主题提供了用于对微流体通道和/或微量滴定阱的内表面进行官能化的方法。此外，目前公开的主题还提供了通过使用可降解材料的牺牲层来制造微结构的方法。

88. 发明申请

US20070191761A1 Method of molding for microneedle arrays 审中-公开
标题翻译：微针阵列成型方法
公开(公告)号：US20070191761A1
公开(公告)日：2007-08-16
申请号：US10590210
申请日：2005-02-22
申请人： Mary Boone , Chad Carter , Franklyn Frederickson
发明人： Mary Boone , Chad Carter , Franklyn Frederickson
IPC分类号： A61M37/00 , A61B17/20 , A61B17/06 , A61M5/32 , B29C45/73 , C25D1/00 , C25D7/00 , B29C33/40
CPC分类号： B29C45/372 , A61B17/205 , A61B2017/00526 , A61B2017/00893 , A61M37/0015 , A61M2037/0053 , B29C33/3842 , B29C33/3857 , B29C33/42 , B29C45/2669 , B29C45/37 , B29C45/561 , B29C45/73 , B29C2045/0094 , B29C2045/7393 , B29L2031/753 , B29L2031/7544 , B29L2031/756 , B81B2201/055 , B81C99/0085 , C25D1/10
摘要： A method of manufacturing a moldable microneedle array (54) is described comprising providing a negative mold insert (44) characterized by a negative image of microneedle topography wherein at least one negative image of a microneedle is characterized by an aspect ratio of between about 2 to 1 and about 5 to 1. The negative mold insert (44) is used to define a structured surface of a negative mold cavity (42). Molten plastic material is injected into the heated negative mold cavity. The molten plastic material is subsequently cooled and detached from the mold insert to provide a molded microneedle array (54). One manner of using microneedle arrays of the present invention is in methods involving the penetration of skin to deliver medicaments or other substances and/or extract blood or tissue through the skin.
摘要翻译：描述了一种制造可成形微针阵列（54）的方法，其包括提供负模具插入物（44），其特征在于微针形地形图的负像，其中微针的至少一个负像的特征在于纵横比在大约2至负模具插入件（44）用于限定阴模腔（42）的结构化表面。将熔融塑料材料注入加热的阴模腔中。随后将熔融的塑料材料冷却并从模具插入件中分离以提供模制的微针阵列（54）。使用本发明的微针阵列的一种方式是涉及皮肤渗透以递送药物或其它物质和/或通过皮肤提取血液或组织的方法。

89. 发明申请

US20070148653A1 Fine metal structure, process for producing the same, fine metal mold and device 审中-公开
标题翻译：精细金属结构，制造方法，精细金属模具及装置
公开(公告)号：US20070148653A1
公开(公告)日：2007-06-28
申请号：US10584139
申请日：2004-12-21
申请人： Hiroshi Yoshida
发明人： Hiroshi Yoshida
IPC分类号： C12Q1/68 , B05D3/04 , B32B3/30 , G01N33/53 , C12M3/00 , B32B15/02
CPC分类号： B29C33/3842 , B29C33/424 , B81B2203/0361 , B81C1/00111 , B81C1/00206 , B81C99/0085 , B81C99/009 , B81C2201/034 , B82Y10/00 , B82Y40/00 , C23C18/1608 , C23C18/1651 , C23C18/1653 , C23C18/1657 , C23C18/1689 , C23C18/208 , C23C18/42 , G03F7/0002 , H01J1/304 , H01J9/025 , Y10T428/12389 , Y10T428/12993
摘要： A fine metal structure having its surface furnished with microprojections of high strength, high precision and large aspect ratio; and a process for producing the fine metal structure free of defects. There is provided a fine metal structure having its surface furnished with microprojections, characterized in that the microprojections have a minimum thickness or minimum diameter ranging from 10 nanometers to 10 micrometers and that the ratio between minimum thickness or minimum diameter (D) of microprojections and height of microprojections (H), H/D, is greater than 1. There is further provided a process for producing a fine metal structure, characterized by comprising providing a substrate having a fine rugged pattern on its surface, applying a molecular electroless plating catalyst to the surface, thereafter carrying out electroless plating to thereby form a metal layer having the rugged pattern filled, and detaching the metal layer from the substrate to thereby obtain a fine metal structure furnished with a surface having undergone reversal transfer of the above rugged pattern.
摘要翻译：精细的金属结构，其表面具有高强度，高精度和大纵横比的微喷射体; 以及没有缺陷的金属微细结构的制造方法。提供了具有微喷射体的表面的细金属结构，其特征在于，微喷射体具有10纳米至10微米的最小厚度或最小直径，并且微喷射体的最小厚度或最小直径（D）与高度的微喷射体（H）H / D大于1.还提供了一种制造精细金属结构的方法，其特征在于，在其表面上提供具有细凹凸图案的基板，将分子无电镀催化剂然后进行无电解电镀，从而形成具有凹凸图案的金属层，并将金属层与基板分离，从而获得配备有经过上述凹凸图案的反转传送的表面的精细金属结构。

90. 发明授权

US07229542B2 Methods of and apparatus for molding structures using sacrificial metal patterns 有权
标题翻译：使用牺牲金属图案模制结构的方法和装置
公开(公告)号：US07229542B2
公开(公告)日：2007-06-12
申请号：US10434315
申请日：2003-05-07
申请人： Christopher A. Bang
发明人： Christopher A. Bang
IPC分类号： B41C3/02 , C25D1/10 , B29C33/40 , B29C45/14 , B29B13/00
CPC分类号： G01P15/0802 , B33Y10/00 , B81B2201/042 , B81C99/0085 , B81C2201/0107 , B81C2201/0109 , B81C2201/0197 , G01P15/125
摘要： Molded structures, methods of and apparatus for producing the molded structures are provided. At least a portion of the surface features for the molds are formed from multilayer electrochemically fabricated structures (e.g. fabricated by the EFAB™ formation process), and typically contain features having resolutions within the 1 to 100 μm range. The layered structure is combined with other mold components, as necessary, and a molding material is injected into the mold and hardened. The layered structure is removed (e.g. by etching) along with any other mold components to yield the molded article. In some embodiments portions of the layered structure remain in the molded article and in other embodiments an additional molding material is added after a partial or complete removal of the layered structure.
摘要翻译：提供了模制结构，制造模制结构的方法和设备。用于模具的表面特征的至少一部分由多层电化学制造的结构（例如通过EFAB TM形成工艺制造）形成，并且通常包含具有在1至100μm范围内的分辨率的特征。根据需要，将层状结构与其他模具部件组合，并将模塑材料注入模具中并硬化。层压结构与任何其它模具部件一起被除去（例如通过蚀刻）以产生模塑制品。在一些实施例中，分层结构的部分保留在模制品中，并且在其它实施例中，在部分或完全去除层状结构之后添加另外的模制材料。

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