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    • 81. 发明授权
    • Multi-layered structure forming method, method of manufacturing wiring substrate, and method of manufacturing electronic apparatus
    • 多层结构形成方法,布线基板的制造方法以及电子设备的制造方法
    • US07723243B2
    • 2010-05-25
    • US11707022
    • 2007-02-16
    • Tsuyoshi ShintateToshiaki MikoshibaKenji WadaKazuaki SakuradaJun Yamada
    • Tsuyoshi ShintateToshiaki MikoshibaKenji WadaKazuaki SakuradaJun Yamada
    • H01L21/31
    • H05K3/4664H05K3/125H05K2203/013Y10S257/921
    • There is provided a multi-layered structure forming method comprising: (A) forming a first insulating material layer containing a first photo-curing material on a substrate; (B) semi-hardening the first insulating material layer by radiating light having a first wavelength to the first insulating material layer; (C) forming a conductive material layer on the semi-hardened first insulating material layer by ejecting droplets of a conductive material to the semi-hardened first insulating material layer from a nozzle of a liquid droplet ejecting apparatus; (D) forming a second insulating material layer containing a second photo-curing material so as to cover the semi-hardened first insulating material layer and the conductive material layer; and (E) forming a first insulating layer, a conductive layer positioned on the first insulating material, and a second insulating layer covering the first insulating layer and the conductive layer by simultaneously heating the first insulating material layer, the conductive material layer, and the second insulating material layer.
    • 提供一种多层结构形成方法,包括:(A)在基板上形成含有第一光固化材料的第一绝缘材料层; (B)通过向第一绝缘材料层照射具有第一波长的光而使第一绝缘材料层半硬化; (C)通过从液滴喷射装置的喷嘴向半硬化的第一绝缘材料层喷射导电材料的液滴,在半硬化的第一绝缘材料层上形成导电材料层; (D)形成包含第二光固化材料的第二绝缘材料层以覆盖半硬化的第一绝缘材料层和导电材料层; 和(E)形成第一绝缘层,位于第一绝缘材料上的导电层和通过同时加热第一绝缘材料层,导电材料层和覆盖第一绝缘层和导电层的第二绝缘层 第二绝缘材料层。
    • 89. 发明申请
    • Photosensitive composition, compound for use in the photosensitive composition and pattern forming method using the photosensitive composition
    • 感光组合物,用于感光组合物的化合物和使用感光组合物的图案形成方法
    • US20060172228A1
    • 2006-08-03
    • US11337899
    • 2006-01-24
    • Kenji Wada
    • Kenji Wada
    • G03C5/00C07C309/45
    • G03F7/0392G03F7/0045G03F7/0046G03F7/0382
    • The invention provides a photosensitive composition for use in the production process of a semiconductor such as IC, in the production of a circuit substrate of liquid crystal, thermal head and the like or in other photofabrication processes, a pattern forming method using the photosensitive composition, and a specific organic acid, which are: a photosensitive composition comprising a compound having a proton acceptor functional group and producing a sulfonic acid group upon irradiation with actinic rays or radiation to reduce or lose the acceptor property or change the proton acceptor functional group to be acidic, or a compound capable of generating a specific organic acid upon irradiation with actinic rays or radiation; a pattern forming method using the photosensitive composition; and a specific organic acid.
    • 本发明提供了一种用于半导体(例如IC)的制造中的液晶,热敏头等电路基板的制造中的光敏性组合物,或者其他的光加工工序,使用该感光性组合物的图案形成方法, 和特定的有机酸,其是:包含具有质子受体官能团的化合物并在用光化射线或辐射照射时产生磺酸基以降低或失去受主性质或将质子受体官能团改变为 酸性或能够在用光化射线或辐射照射时能够产生特定有机酸的化合物; 使用该感光性组合物的图案形成方法; 和特定的有机酸。