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81. 发明申请

US20090014736A1 Coating method utilizing phosphor containment structure and devices fabricated using same 审中-公开
标题翻译：使用磷光体容纳结构的涂布方法和使用其制造的器件
公开(公告)号：US20090014736A1
公开(公告)日：2009-01-15
申请号：US11827626
申请日：2007-07-11
申请人： James Ibbetson , Kristi Wong , Maryanne Becerra
发明人： James Ibbetson , Kristi Wong , Maryanne Becerra
IPC分类号： H01L33/00 , H01L21/00
CPC分类号： H01L33/508 , H01L33/44 , H01L33/54 , H01L2933/0041
摘要： Methods for fabricating a semiconductor devices, and in particular light emitting diodes (LEDS) comprising providing a plurality of semiconductor devices on a substrate and forming a contact on at least some of the semiconductor devices. A containment structure is formed on at least some of the semiconductor devices having a contact with each containment structure defining a deposition area excluding the contact. A coating material is deposited then within the deposition area, with the coating material not covering the contact. A light emitting diode (LED) chip wafer comprising a plurality of LEDs on a substrate wafer with at least some of the LEDs having a contact. A plurality of containment structures are included, each of which is associated with a respective one of the plurality of LEDs. Each of the containment structures at least partially on its respective one of the LEDs and defining a deposition area on its respective one of the LEDs. The deposition area excludes the contact. A coating is included in each of the deposition areas.
摘要翻译：制造半导体器件的方法，特别是包括在衬底上提供多个半导体器件并在至少一些半导体器件上形成接触的发光二极管（LEDS）。在至少一些半导体器件上形成容纳结构，该半导体器件与限定除接触之外的沉积区域的每个容纳结构接触。然后在沉积区域内沉积涂层材料，涂层材料不覆盖接触。一种发光二极管（LED）芯片晶片，其在衬底晶片上包括多个LED，其中至少一些LED具有接触。包括多个容纳结构，每个包含结构与多个LED中的相应一个LED相关联。每个容纳结构至少部分地在其相应的一个LED上并且在其相应的一个LED上限定沉积区域。沉积区不包括接触。在每个沉积区域中包括涂层。

82. 发明授权

US07420222B2 Light emitting diodes including transparent oxide layers 有权
标题翻译：包括透明氧化物层的发光二极管
公开(公告)号：US07420222B2
公开(公告)日：2008-09-02
申请号：US11842350
申请日：2007-08-21
申请人： David B. Slater, Jr. , Robert C. Glass , Charles M. Swoboda , Bernd Keller , James Ibbetson , Brian Thibeault , Eric J. Tarsa
发明人： David B. Slater, Jr. , Robert C. Glass , Charles M. Swoboda , Bernd Keller , James Ibbetson , Brian Thibeault , Eric J. Tarsa
IPC分类号： H01L33/00
CPC分类号： H01L33/20 , H01L33/10 , H01L33/405 , H01L33/60 , H01L33/62 , H01L2224/32014 , H01L2224/48091 , H01L2224/73265 , H01L2924/01079 , H01L2924/01322 , H01L2924/10253 , H01L2924/12032 , H01L2924/12041 , H01L2924/00014 , H01L2924/00
摘要： Light emitting diodes include a substrate having first and second opposing faces and that is transparent to optical radiation in a predetermined wavelength range and that is patterned to define, in cross-section, a plurality of pedestals that extend into the substrate from the first face towards the second face. A diode region on the second face is configured to emit light in the predetermined wavelength range, into the substrate upon application of voltage across the diode region. A mounting support on the diode region, opposite the substrate is configured to support the diode region, such that the light that is emitted from the diode region into the substrate, is emitted from the first face upon application of voltage across the diode region. A reflector is provided between the mounting support and the diode region, that is configured to reflect light that is emitted from the diode region back into the diode region, through the substrate that is transparent to optical radiation in the predetermined wavelength range and from the plurality of pedestals, upon application of voltage across the diode region. A layer of Indium Tin Oxide (ITO) is provided between the reflector and the diode region.
摘要翻译：发光二极管包括具有第一和第二相对面并且对于预定波长范围内的光辐射透明的衬底，其被图案化以在横截面中限定多个基座，其从第一面朝向第二张脸。第二面上的二极管区域被配置为在施加二极管区域上的电压时将预定波长范围内的光发射到衬底中。配置在与衬底相对的二极管区域上的安装支撑件被配置为支撑二极管区域，使得从二极管区域发射到衬底中的光在施加二极管区域上的电压时从第一面发射。在安装支撑件和二极管区域之间设置反射器，其被配置为将从二极管区域发射的光反射回二极管区域，穿过对于预定波长范围内的光辐射透明的基板和从多个在二极管区域施加电压时，在反射器和二极管区域之间设置一层氧化铟锡（ITO）。

83. 发明申请

US20080142817A1 CHIP-SCALE METHODS FOR PACKAGING LIGHT EMITTING DEVICES AND CHIP-SCALE PACKAGED LIGHT EMITTING DEVICES 有权
标题翻译：用于包装发光装置和芯片尺寸的包装光发射装置的芯片尺寸方法
公开(公告)号：US20080142817A1
公开(公告)日：2008-06-19
申请号：US12027313
申请日：2008-02-07
申请人： James Ibbetson , Bernd Keller , Primit Parikh
发明人： James Ibbetson , Bernd Keller , Primit Parikh
IPC分类号： H01L33/00 , H01L21/02
CPC分类号： H01L33/62 , H01L33/0079 , H01L33/483 , H01L33/486 , H01L33/60 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： A packaged light emitting device includes a carrier substrate having a top surface and a bottom surface, first and second conductive vias extending from the top surface of the substrate to the bottom surface of the substrate, and a bond pad on the top surface of the substrate in electrical contact with the first conductive via. A diode having first and second electrodes is mounted on the bond pad with the first electrode is in electrical contact with the bond pad. A passivation layer is formed on the diode, exposing the second electrode of the diode. A conductive trace is formed on the top surface of the carrier substrate in electrical contact with the second conductive via and the second electrode. The conductive trace is on and extends across the passivation layer to contact the second electrode.Methods of packaging light emitting devices include providing an epiwafer including a growth substrate and an epitaxial structure on the growth substrate, bonding a carrier substrate to the epitaxial structure of the epiwafer, forming a plurality of conductive vias through the carrier substrate, defining a plurality of isolated diodes in the epitaxial structure, and electrically connecting at least one conductive via to respective ones of the plurality of isolated diodes.
摘要翻译：封装的发光器件包括具有顶表面和底表面的载体衬底，从衬底的顶表面延伸到衬底的底表面的第一和第二导电通孔以及衬底的顶表面上的接合焊盘与第一导电通孔电接触。具有第一和第二电极的二极管安装在接合焊盘上，第一电极与接合焊盘电接触。在二极管上形成钝化层，使二极管的第二电极露出。导电迹线形成在载体基板的顶表面上，与第二导电通孔和第二电极电接触。导电迹线在钝化层上并且延伸穿过第二电极。封装发光器件的方法包括在生长衬底上提供包括生长衬底和外延结构的外延膜，将载体衬底结合到外延膜的外延结构，形成通过载体衬底的多个导电通孔，限定多个隔离二极管，并且将至少一个导电通孔电连接到多个隔离二极管中的相应二极管。

84. 发明申请

US20080007953A1 High power solid-state lamp 有权
标题翻译：大功率固态灯
公开(公告)号：US20080007953A1
公开(公告)日：2008-01-10
申请号：US11149999
申请日：2005-06-10
申请人： Bernd Keller , James Ibbetson
发明人： Bernd Keller , James Ibbetson
IPC分类号： F21V29/00
CPC分类号： H01L33/641 , H01L33/60 , H01L33/642 , H01L2924/0002 , H01L2924/00
摘要： A high power semiconductor component structure having a semiconductor device arranged to operate in response to an electrical signal, with the device heating up during operation in response to the electrical signal. A heat sink is positioned in thermal contact with the semiconductor device such that heat from the device transmits into the first heat sink. The heat sink has at least partially a porous material region of a thermally conductive material in a 3-dimensional pore structure with the surfaces of the pore structure providing surface area for heat to dissipate into the ambient air.
摘要翻译：一种具有半导体器件的高功率半导体器件结构，该半导体器件被布置成响应于电信号而工作，该器件响应于该电信号在操作期间加热。散热器定位成与半导体器件热接触，使得来自器件的热量传输到第一散热器。散热器至少部分地具有三维孔结构中的导热材料的多孔材料区域，孔结构的表面提供用于热量散发到周围空气中的表面积。

85. 发明申请

US20070018183A1 Roughened high refractive index layer/LED for high light extraction 有权
$Roughened high refractive index layer/LED for high light extraction$
标题翻译：用于高光提取的粗化高折射率层/ LED
公开(公告)号：US20070018183A1
公开(公告)日：2007-01-25
申请号：US11187075
申请日：2005-07-21
申请人： Steven Denbaars , James Ibbetson , Shuji Nakamura
发明人： Steven Denbaars , James Ibbetson , Shuji Nakamura
IPC分类号： H01L33/00 , H01L29/22
CPC分类号： H01L33/22 , H01L33/007 , H01L33/0079 , H01L33/42
摘要： A light emitting diode (LED) includes a p-type layer of material, an n-type layer of material and an active layer between the p-type layer and the n-type layer. A roughened layer of transparent material is adjacent one of the p-type layer of material and the n-type layer of material. The roughened layer of transparent material has a refractive index close to or substantially the same as the refractive index of the material adjacent the layer of transparent material, and may be a transparent oxide material or a transparent conducting material. An additional layer of conductive material may be between the roughened layer and the n-type or p-type layer.
摘要翻译：发光二极管（LED）包括p型层材料，n型层材料和p型层与n型层之间的有源层。透明材料的粗糙层与p型材料层和n型材料层相邻。透明材料的粗糙层具有接近或基本上等于与透明材料层相邻的材料的折射率的折射率，并且可以是透明氧化物材料或透明导电材料。附加的导电材料层可以在粗糙层和n型或p型层之间。

86. 发明申请

US20060046328A1 Ultra-thin ohmic contacts for p-type nitride light emitting devices and methods of forming 有权
标题翻译：用于p型氮化物发光器件的超薄欧姆接触和形成方法
公开(公告)号：US20060046328A1
公开(公告)日：2006-03-02
申请号：US11191111
申请日：2005-07-27
申请人： Mark Raffetto , Jayesh Bharathan , Kevin Haberern , Michael Bergmann , David Emerson , James Ibbetson , Ting Li
发明人： Mark Raffetto , Jayesh Bharathan , Kevin Haberern , Michael Bergmann , David Emerson , James Ibbetson , Ting Li
IPC分类号： H01L21/00
CPC分类号： H01L33/42 , H01L24/32 , H01L33/32 , H01L33/38 , H01L33/40 , H01L33/405 , H01L2224/48463 , H01L2224/73265 , H01L2924/12041 , H01L2924/12042 , H01L2924/3011 , H01L2933/0016 , H01L2924/00
摘要： A semiconductor based Light Emitting Device (LED) can include a p-type nitride layer and a metal ohmic contact, on the p-type nitride layer. The metal ohmic contact can have an average thickness of less than about 25 Å and a specific contact resistivity less than about 10−3 ohm-cm2.
摘要翻译：基于半导体的发光器件（LED）可以在p型氮化物层上包括p型氮化物层和金属欧姆接触。金属欧姆接触可以具有小于约的平均厚度和小于约10 -3欧姆 - 厘米2的特定接触电阻。

87. 发明申请

US20050218421A1 Methods for packaging a light emitting device and packaged light emitting devices 有权
标题翻译：用于封装发光器件和封装的发光器件的方法
公开(公告)号：US20050218421A1
公开(公告)日：2005-10-06
申请号：US11044126
申请日：2005-01-27
申请人： Peter Andrews , Thomas Coleman , James Ibbetson , Michael Leung , Gerald Negley , Eric Tarsa
发明人： Peter Andrews , Thomas Coleman , James Ibbetson , Michael Leung , Gerald Negley , Eric Tarsa
IPC分类号： H01L29/22 , H01L33/52 , H01L33/58 , H01L33/60
CPC分类号： H01L33/58 , H01L33/52 , H01L33/60 , H01L2924/181 , H01L2924/00012
摘要： Methods of packaging a semiconductor light emitting device positioned in a reflective cavity are provided. A first quantity of encapsulant material is dispensed into the reflective cavity including the light emitting device therein and the first quantity of encapsulant in the reflective cavity is cured. A second quantity of encapsulant material is dispensed onto the cured first quantity of encapsulant material. A lens is positioned in the reflective cavity on the dispensed second quantity of encapsulant material. The dispensed second quantity of encapsulant material is cured to attach the lens in the reflective cavity.
摘要翻译：提供了封装位于反射腔中的半导体发光器件的方法。第一量的密封剂材料被分配到包括其中的发光器件的反射腔中，并且反射腔中的第一量的密封剂被固化。将第二数量的密封剂材料分配到固化的第一量的密封剂材料上。透镜位于所分配的第二数量的密封剂材料的反射腔中。所分配的第二数量的密封剂材料被固化以将透镜附着在反射腔中。

88. 发明申请

US20050093430A1 Composite white light source and method for fabricating 有权
标题翻译：复合白光源及其制造方法
公开(公告)号：US20050093430A1
公开(公告)日：2005-05-05
申请号：US10786755
申请日：2004-02-24
申请人： James Ibbetson , Eric Tarsa
发明人： James Ibbetson , Eric Tarsa
IPC分类号： H01J1/62 , H01L33/50 , H01L33/58 , H01L33/62
CPC分类号： H01L33/505 , H01L33/507 , H01L33/58 , H01L33/62 , H01L2924/0002 , H01L2933/0041 , H01L2924/00
摘要： An emitter includes a light source and a separately formed conversion material region with conversion particles. The light source is capable of emitting light along a plurality of light paths extending through the conversion material region where at least some of the light can be absorbed by the conversion particles. The light from the light source and the light re-emitted from the conversion particles combine to provide a desired color of light. Each light path extends through a substantially similar amount of conversion particles so that the desired color of light has a substantially uniform color and intensity along each light path.
摘要翻译：发射器包括光源和具有转换颗粒的单独形成的转换材料区域。光源能够沿着延伸穿过转换材料区域的多个光路发射光，其中至少一些光可以被转化颗粒吸收。来自光源的光和从转换颗粒再发射的光结合在一起以提供期望的光的颜色。每个光路延伸穿过基本相似量的转化颗粒，使得所需的光颜色沿着每个光路具有基本均匀的颜色和强度。

89. 发明授权

US09142734B2 Composite white light source and method for fabricating 有权
标题翻译：复合白光源及其制造方法
公开(公告)号：US09142734B2
公开(公告)日：2015-09-22
申请号：US10786755
申请日：2004-02-24
申请人： James Ibbetson , Eric Tarsa
发明人： James Ibbetson , Eric Tarsa
IPC分类号： H01J1/62 , H01L33/50 , H01L33/58 , H01L33/62
CPC分类号： H01L33/505 , H01L33/507 , H01L33/58 , H01L33/62 , H01L2924/0002 , H01L2933/0041 , H01L2924/00
摘要： An emitter includes a light source and a separately formed conversion material region with conversion particles. The light source is capable of emitting light along a plurality of light paths extending through the conversion material region where at least some of the light can be absorbed by the conversion particles. The light from the light source and the light re-emitted from the conversion particles combine to provide a desired color of light. Each light path extends through a substantially similar amount of conversion particles so that the desired color of light has a substantially uniform color and intensity along each light path.
摘要翻译：发射器包括光源和具有转换颗粒的单独形成的转换材料区域。光源能够沿着延伸穿过转换材料区域的多个光路发射光，其中至少一些光可以被转化颗粒吸收。来自光源的光和从转换颗粒再发射的光结合在一起以提供期望的光的颜色。每个光路延伸穿过基本相似量的转化颗粒，使得所需的光颜色沿着每个光路具有基本均匀的颜色和强度。

90. 发明授权

US09105824B2 High reflective board or substrate for LEDs 有权
标题翻译：高反射板或LED基板
公开(公告)号：US09105824B2
公开(公告)日：2015-08-11
申请号：US13370696
申请日：2012-02-10
申请人： Sten Heikman , Zhimin Jamie Yao , James Ibbetson , Fan Zhang
发明人： Sten Heikman , Zhimin Jamie Yao , James Ibbetson , Fan Zhang
IPC分类号： H01L33/46 , H01L33/60 , H01L33/54 , H01L33/62
CPC分类号： H01L33/60 , H01L33/54 , H01L33/62 , H01L2224/73265 , H01L2224/48091 , H01L2924/00014
摘要： Light emitting devices and methods are disclosed that provide improved light output. The devices have an LED mounted to a substrate, board or submount characterized by improved reflectivity, which reduces the absorption of LED light. This increases the amount of light that can emit from the LED device. The LED devices also exhibit improved emission characteristics by having a reflective coating on the submount that is substantially non-yellowing. One embodiment of a light emitting device according to the present invention comprises a submount having a circuit layer. A reflective coating is included between at least some of the elements of the circuit layer. A light emitting diode mounted to the circuit layer, the reflective coating being reflective to the light emitted by the light emitting diode. In some embodiments, the reflective coating comprises a carrier with scattering particles having a different index of refraction than said carrier material.
摘要翻译：公开了提供改进的光输出的发光器件和方法。这些装置具有安装到基板，板或基座的LED，其特征在于改进的反射率，这降低了LED光的吸收。这增加了可从LED器件发射的光量。 LED器件还通过在基座上具有基本不变黄的反射涂层来显示出改进的发射特性。根据本发明的发光器件的一个实施例包括具有电路层的基座。反射涂层包括在电路层的至少一些元件之间。安装到电路层的发光二极管，反射涂层对由发光二极管发出的光反射。在一些实施例中，反射涂层包括具有与所述载体材料不同的折射率的散射颗粒的载体。

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