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    • 85. 发明授权
    • Mask superposition for multiple exposures
    • 多重曝光的面膜叠加
    • US07394080B2
    • 2008-07-01
    • US11317974
    • 2005-12-23
    • Burn Jeng Lin
    • Burn Jeng Lin
    • H01J37/08G21K5/10G03F7/20
    • G03F7/70275G03F7/70208G03F7/70283
    • An exposure system includes a mask stage module adapted for holding a first mask and a second mask, wherein the first mask is configured for illumination by a first beam to form a transformed first beam having a first pattern from the first mask and the second mask is configured for illumination by a second beam to form a transformed second beam having a second pattern from the second mask. The exposure system also includes a beam combiner configured to combine the transformed first and second beams to form a resultant beam, wherein the resultant beam is projected into a substrate coated with a photoresist layer.
    • 曝光系统包括适于保持第一掩模和第二掩模的掩模台模块,其中第一掩模被配置为由第一光束照明以形成具有来自第一掩模的第一图案的变换的第一光束,而第二掩模是 被配置为由第二光束照明以形成具有来自第二掩模的第二图案的变换的第二光束。 曝光系统还包括光束组合器,其被配置为组合变换的第一和第二光束以形成合成光束,其中所得到的光束投射到涂覆有光致抗蚀剂层的基板中。
    • 86. 发明授权
    • Method for imaging wafers using a projection mask aligner
    • 使用投影掩模对准器成像晶片的方法
    • US07151593B2
    • 2006-12-19
    • US11412555
    • 2006-04-27
    • Burn Jeng Lin
    • Burn Jeng Lin
    • G03B27/32G03B27/62G03F1/00G03C5/00
    • G03F1/62G03F7/70866G03F7/70975G03F7/70983G03F7/70991
    • A method uses a projection mask aligner that includes a hard pellicle mounting apparatus having an enclosure with an interior cavity, an inlet port for receiving a mask with a protective cover, and an outlet port for outputting a mask covered by a hard pellicle, that has a demounting portion for removing the protective cover from the mask, that has a mounting portion for mounting the hard pellicle on the mask, and that has a conduit for receiving a light-transmitting gas. The method includes: forming a hard pellicle/mask assembly having at least one hard pellicle mounted thereon; positioning the hard pellicle/mask assembly between a light source and an imaging lens; positioning a photoresist-coated semiconductor wafer under the imaging lens with a photoresist layer facing the lens; and imaging microelectronics circuits from the hard pellicle/mask assembly onto the semiconductor wafer.
    • 一种方法使用投影掩模对准器,其包括具有具有内腔的外壳的硬膜保护装置,用于接收具有保护盖的掩模的入口端口和用于输出由硬膜覆盖的掩模的出口,所述掩模具有 用于从掩模中去除保护盖的拆卸部分,其具有用于将硬膜安装在掩模上的安装部分,并且具有用于接收透光气体的导管。 该方法包括:形成安装在其上的至少一层硬膜的硬膜/掩模组件; 将硬膜/掩模组件定位在光源和成像透镜之间; 将光致抗蚀剂涂覆的半导体晶片定位在成像透镜下面,其中光致抗蚀剂层面向透镜; 以及将硬膜组件/掩模组件的微电子电路成像到半导体晶片上。