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    • 81. 发明授权
    • Nanostructure templating using low temperature atomic layer deposition
    • 使用低温原子层沉积的纳米结构模板
    • US08080280B1
    • 2011-12-20
    • US11872749
    • 2007-10-16
    • Robert K. GrubbsGregory R. BogartJohn A. Rogers
    • Robert K. GrubbsGregory R. BogartJohn A. Rogers
    • C23C16/00
    • C23C16/46C23C16/45525
    • Methods are described for making nanostructures that are mechanically, chemically and thermally stable at desired elevated temperatures, from nanostructure templates having a stability temperature that is less than the desired elevated temperature. The methods comprise depositing by atomic layer deposition (ALD) structural layers that are stable at the desired elevated temperatures, onto a template employing a graded temperature deposition scheme. At least one structural layer is deposited at an initial temperature that is less than or equal to the stability temperature of the template, and subsequent depositions made at incrementally increased deposition temperatures until the desired elevated temperature stability is achieved. Nanostructure templates include three dimensional (3D) polymeric templates having features on the order of 100 nm fabricated by proximity field nanopatterning (PnP) methods.
    • 描述了用于制备在所需高温下机械,化学和热稳定的纳米结构的方法,所述纳米结构具有的稳定性温度低于所需升高的温度。 所述方法包括通过使用渐变温度沉积方案的模板将在期望的高温下稳定的原子层沉积(ALD)结构层沉积到模板上。 至少一个结构层在小于或等于模板的稳定温度的初始温度下沉积,随后在逐渐增加的沉积温度下进行沉积,直至实现所需的高温稳定性。 纳米结构模板包括通过接近场纳米图案(PnP)方法制造的具有大约100nm的特征的三维(3D)聚合物模板。
    • 87. 发明授权
    • Method and device for measuring the thickness of thin films near a sample's edge and in a damascene-type structure
    • 用于测量样品边缘和镶嵌型结构附近薄膜厚度的方法和装置
    • US06256100B1
    • 2001-07-03
    • US09067411
    • 1998-04-27
    • Matthew J. BanetMartin FuchsJohn A. Rogers
    • Matthew J. BanetMartin FuchsJohn A. Rogers
    • G01N2184
    • G01B11/0666
    • A method for measuring a structure that contains overlying and underlying films in a region where the overlying film's thickness rapidly decreases until the underlying film is exposed (e.g., an edge-exclusion structure). The method includes the steps of: (1) exciting acoustic modes in a first portion of the region with at least one excitation laser beam; (2) detecting the acoustic modes with a probe laser beam that is either reflected or diffracted to generate a signal beam; (3) analyzing the signal beam to determine a property of the structure (e.g., the thickness of the overlying layer) in the first portion of the region; (4) translating the structure or the excitation and probe laser beams; and (5) repeating the exciting, detecting, and analyzing steps to determine a property of the structure in a second portion of the region.
    • 一种用于测量在覆盖膜的厚度迅速减小直到底层膜暴露的区域(例如,边缘排除结构)中的覆盖和下层膜的结构的测量方法。 该方法包括以下步骤:(1)利用至少一个激发激光束激发该区域的第一部分中的声模; (2)用反射或衍射的探针激光束检测声学模式以产生信号光束; (3)分析信号光束以确定该区域的第一部分中的结构的性质(例如,上覆层的厚度); (4)平移结构或激发和探测激光束; 和(5)重复激励,检测和分析步骤以确定该区域的第二部分中的结构的属性。
    • 88. 发明授权
    • Patterned light emitting diode devices
    • 图案化的发光二极管器件
    • US06252253B1
    • 2001-06-26
    • US09095236
    • 1998-06-10
    • Zhenan BaoJohn A. Rogers
    • Zhenan BaoJohn A. Rogers
    • H01L3300
    • H01L51/5036H01L27/3239H01L51/0003H01L51/5225H01L51/5281H01L51/56
    • An LED device that emits light in a pattern is disclosed. The LED device is a layer of active material that is sandwiched between a transparent substrate with an anode formed thereon and a cathode. The active material has a layer of light emitting material that emits light when electron/hole recombination is induced in the material. The patterned emission is defined by a patterned layer in the active material of the LED device. The patterned layer has at least a first thickness and a second thickness. When the device is on, the portion of the device associated with the first thickness of the patterned layer is visually distinct from the portion of the device that is associated with the second thickness of the patterned layer.
    • 公开了以图案发光的LED装置。 LED装置是夹在其上形成有阳极的透明基板和阴极之间的活性材料层。 活性材料具有在材料中诱发电子/空穴复合时发光的发光材料层。 图案化发射由LED器件的活性材料中的图案化层限定。 图案化层具有至少第一厚度和第二厚度。 当器件接通时,与图案化层的第一厚度相关联的器件的部分在视觉上不同于与图案化层的第二厚度相关联的器件的部分。