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    • 71. 发明申请
    • Digital Semiconductor Variable Capacitor
    • 数字半导体可变电容器
    • US20140332928A1
    • 2014-11-13
    • US13889317
    • 2013-05-07
    • Fabio Alessio MarinoPaolo Menegoli
    • Fabio Alessio MarinoPaolo Menegoli
    • H01L29/93H01L29/66
    • H01L29/93H01L29/66174H01L29/66189H01L29/94
    • A novel semiconductor variable capacitor is presented. The semiconductor structure is simple and is based on a semiconductor variable capacitor with MOS compatible structure suitable for integrated circuits, which has at least three terminals, one of which is used to modulate the capacitance value between the other two terminals of the device, by increasing or decreasing its DC voltage with respect to one of the main terminals of the device. Furthermore, the present invention decouples the AC signal and the DC control voltage preventing distortion of the RF signal. The present invention describes a controllable capacitor whose capacitance value is not necessarily linear with its control voltage, but although possibly abrupt in its characteristic, is utilized to manufacture a semiconductor variable capacitor with digital control to improve its noise and linearity performance while maintaining high quality factor.
    • 介绍一种新型的半导体可变电容器。 半导体结构简单,并且基于具有MOS兼容结构的半导体可变电容器,其适用于集成电路,其具有至少三个端子,其中一个用于通过增加器件的另外两个端子来调制电容值 或者相对于设备的主端子之一降低其直流电压。 此外,本发明解耦AC信号和DC控制电压,防止RF信号的失真。 本发明描述了一种可控制的电容器,其电容值不一定与其控制电压成线性关系,但是尽管其特性可能突然地被用于制造具有数字控制的半导体可变电容器,以改善其噪声和线性性能,同时保持高品质因数 。
    • 72. 发明申请
    • Inversion Mode Varactor
    • 反转模式Varactor
    • US20140049315A1
    • 2014-02-20
    • US14060835
    • 2013-10-23
    • International Business Machines Corporation
    • Bruce B. DorisKangguo ChengAli KhakifiroozPranita Kulkarni
    • H01L29/93
    • H01L29/93H01L27/1203H01L29/66174
    • In one exemplary embodiment of the invention, a method includes: providing an inversion mode varactor having a substrate, a backgate layer overlying the substrate, an insulating layer overlying the backgate layer, a semiconductor layer overlying the insulating layer and at least one metal-oxide semiconductor field effect transistor (MOSFET) device disposed upon the semiconductor layer, where the semiconductor layer includes a source region and a drain region, where the at least one MOSFET device includes a gate stack defining a channel between the source region and the drain region, where the gate stack has a gate dielectric layer overlying the semiconductor layer and a conductive layer overlying the gate dielectric layer; and applying a bias voltage to the backgate layer to form an inversion region in the semiconductor layer at an interface between the semiconductor layer and the insulating layer.
    • 在本发明的一个示例性实施例中,一种方法包括:提供具有衬底,覆盖衬底的背栅层,覆盖在背栅层上的绝缘层,覆盖绝缘层的半导体层和至少一种金属氧化物 半导体场效应晶体管(MOSFET)器件,其设置在所述半导体层上,其中所述半导体层包括源极区和漏极区,其中所述至少一个MOSFET器件包括限定所述源极区和所述漏极区之间的沟道的栅极叠层, 其中所述栅极堆叠具有覆盖所述半导体层的栅极介电层和覆盖所述栅极介电层的导电层; 以及向所述背栅层施加偏置电压,以在所述半导体层和所述绝缘层之间的界面处在所述半导体层中形成反转区域。
    • 75. 发明授权
    • Large tuning range junction varactor
    • 大调谐范围结变容二极管
    • US08450832B2
    • 2013-05-28
    • US11696732
    • 2007-04-05
    • Manju SarkarPurakh Raj Verma
    • Manju SarkarPurakh Raj Verma
    • H01L29/93
    • H01L27/0808H01L29/93
    • Large tuning range junction varactor includes first and second junction capacitors coupled in parallel between first and second varactor terminals. First and second plates of the capacitors are formed by three alternating doped regions in a substrate. The first and third doped regions are of the same type sandwiching the second doped region of the second type. A first input terminal is coupled to the first and third doped regions and a second terminal is coupled to the second doped region. At the interfaces of the doped regions are first and second depletion regions whose width can be varied by varying the voltage across the terminals from zero to full reverse bias.
    • 大型调谐范围结变容二极管包括并联在第一和第二变容二极管端子之间的第一和第二结电容器。 电容器的第一和第二板由衬底中的三个交替掺杂区域形成。 第一和第三掺杂区域具有夹着第二类型的第二掺杂区域的相同类型。 第一输入端子耦合到第一和第三掺杂区域,第二端子耦合到第二掺杂区域。 在掺杂区域的界面处是第一和第二耗尽区域,其宽度可以通过将端子间的电压从零改变为全反向偏压来改变。
    • 78. 发明授权
    • Insulated gate bipolar transistor (IGBT) electrostatic discharge (ESD) protection devices
    • 绝缘栅双极晶体管(IGBT)静电放电(ESD)保护器件
    • US08049307B2
    • 2011-11-01
    • US12358943
    • 2009-01-23
    • Yeh-Ning JouShang-Hui TuJui-Chun ChangChen-Wei Wu
    • Yeh-Ning JouShang-Hui TuJui-Chun ChangChen-Wei Wu
    • H01L29/93
    • H01L29/7393H01L27/0259
    • Insulated gate bipolar transistor (IGBT) electrostatic discharge (ESD) protection devices are presented. An IGBT-ESD device includes a semiconductor substrate and patterned insulation regions disposed on the semiconductor substrate defining a first active region and a second active region. A high-V N-well is formed in the first active region of the semiconductor substrate. A P-body doped region is formed in the second active region of the semiconductor substrate, wherein the high-V N-well and the P-body doped region are separated with a predetermined distance exposing the semiconductor substrate. A P+ doped drain region is disposed in the high-V N-well. A P+ diffused region and an N+ doped source region are disposed in the P-body doped region. A gate structure is disposed on the semiconductor substrate with one end adjacent to the N+ doped source region and the other end extending over the insulation region.
    • 介绍了绝缘栅双极晶体管(IGBT)静电放电(ESD)保护装置。 IGBT-ESD器件包括半导体衬底和设置在半导体衬底上的图案化绝缘区域,其限定第一有源区域和第二有源区域。 在半导体衬底的第一有源区中形成高V N阱。 在半导体衬底的第二有源区中形成P体掺杂区域,其中高V N阱和P体掺杂区域以暴露半导体衬底的预定距离被分离。 P +掺杂漏区设置在高V N阱中。 P +扩散区域和N +掺杂源极区域设置在P体掺杂区域中。 栅极结构设置在半导体衬底上,其一端与N +掺杂源极区相邻,另一端延伸在绝缘区上。