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71. 发明授权

US09850390B2 Epoxy resin composition for encapsulating semiconductor device and semiconductor device prepared using the same 有权
公开(公告)号：US09850390B2
公开(公告)日：2017-12-26
申请号：US15188454
申请日：2016-06-21
申请人： SAMSUNG SDI CO., LTD.
发明人： Jin Min Cheon , Ki Hyeok Kwon , Min Gyum Kim , Joo Young Chung , Jin Woo Choi , Seung Han
IPC分类号： C08L63/00 , H01L23/29 , C09D163/00 , C09D7/12 , C08G59/68 , C08K3/00 , C08K3/32 , C08K5/00 , C08K5/13 , C08K5/136 , C08K5/1535 , C08K7/18 , C08K5/50 , C08K5/053 , C09J7/00
CPC分类号： C09D7/63 , C08G59/688 , C08K3/36 , C08K5/053 , C08K5/50 , C08L63/00 , C09D163/00 , C09J7/00 , H01L23/293 , H01L2224/73204 , H01L2924/181 , H01L2924/18161 , H01L2924/00012
摘要： An epoxy resin composition for encapsulation of a semiconductor device and a semiconductor device encapsulated with the epoxy resin composition, the composition including an epoxy resin; a curing agent; an inorganic filler; a curing catalyst; and a compound containing at least one hydroxyl group, wherein the curing catalyst includes a phosphonium compound represented by Formula 4:

72. 发明授权

US09765199B2 Non-yellowing easy-to-clean antimicrobial plastic 有权
公开(公告)号：US09765199B2
公开(公告)日：2017-09-19
申请号：US13998431
申请日：2013-10-31
申请人： Uschi M. Graham , Bryan Livengood
发明人： Uschi M. Graham , Bryan Livengood
IPC分类号： C08K5/06 , C08K5/136 , C08K5/00
CPC分类号： C08K5/06 , C08K5/0058 , C08K5/136
摘要： An additive that is incorporated into a thermoplastic acrylic pre-polymer formulation to render the polymer surface hydrophilic with easy cleanability and also making the surface antimicrobial. The additive is a hydrophilic reactive additive or (“HRA”), is incorporated with the other acrylic formulation components and polymerized into the acrylic polymer backbone. This reaction ensures that there will be no loss of hydrophilicity after repeated contact of the easy to clean acrylic sheet with water, as is typically happens with most sanitary ware products.

73. 发明授权

US09422410B2 Flame-retardant foamed styrene resin composition 有权
标题翻译：阻燃发泡苯乙烯树脂组合物
公开(公告)号：US09422410B2
公开(公告)日：2016-08-23
申请号：US14653366
申请日：2013-12-13
申请人： DAI-ICHI KOGYO SEIYAKU CO., LTD.
发明人： Masahito Nishiura , Hideaki Onishi , Hisanori Semori , Naomi Toyoshima
IPC分类号： C08J9/00 , C08J9/04 , C08K3/16 , C08J9/14 , C08K3/22 , C08K5/06 , C08K5/3492 , C08K3/26 , C08K3/34 , C08K5/136
CPC分类号： C08J9/142 , C08J9/0019 , C08J9/0023 , C08J9/0028 , C08J9/0066 , C08J9/0095 , C08J9/04 , C08J9/141 , C08J2201/03 , C08J2205/00 , C08J2325/06 , C08K3/22 , C08K3/26 , C08K3/34 , C08K5/06 , C08K5/136 , C08K5/34924 , C08K2003/2296
摘要： Provided is a recyclable flame-retardant foamed styrene resin composition having high flame-retardancy and heat stability by adding little bromine-containing flame retardant. A flame-retardant foamed styrene resin composition containing (A) a styrene resin, (B) a mixture of (B1) tetrabromobisphenol A-bis(2,3-dibromo-2-methylpropyl ether) and (B2) another bromine-containing flame retardant, (C) zinc-modified hydrotalcite, (D) zeolite, and (G) a foaming agent, containing 0.005-0.08 parts by weight of (C) the zinc-modified hydrotalcite per 100 parts by weight of (A) the styrene resin.
摘要翻译：提供了通过加入少量含溴阻燃剂而具有高阻燃性和热稳定性的可回收的阻燃发泡苯乙烯树脂组合物。一种阻燃发泡苯乙烯树脂组合物，其包含（A）苯乙烯树脂，（B）（B1）四溴双酚A-双（2,3-二溴-2-甲基丙基醚）和（B2）另外含溴的火焰的混合物阻燃剂，（C）锌改性水滑石，（D）沸石和（G）发泡剂，每100重量份的（A）苯乙烯（A）含有0.005-0.08重量份的（C）锌改性水滑石树脂。

74. 发明授权

US09236165B2 Electric cable 有权
标题翻译：电缆
公开(公告)号：US09236165B2
公开(公告)日：2016-01-12
申请号：US14005922
申请日：2012-02-24
申请人： Kousuke Kogo
发明人： Kousuke Kogo
IPC分类号： H01B3/30 , H01B7/295 , H01B3/28 , H01B3/44 , C08L23/02 , C08L23/12 , C08L21/00 , C08K5/00 , C08L23/26 , C08K5/136 , C08K3/22 , C08L23/16 , C08K3/00 , C08K3/20
CPC分类号： H01B3/307 , C08K3/016 , C08K3/20 , C08K5/0066 , C08K5/136 , C08K2003/2224 , C08K2003/2227 , C08L21/00 , C08L23/025 , C08L23/12 , C08L23/16 , C08L23/26 , H01B3/28 , H01B3/441 , H01B7/295
摘要： To provide an electric cable that can satisfy flame retardancy and battery fluid resistance in the CHFUS region provided in ISO 6722 and also satisfy low-temperature resistance, wear resistance, and peelability by using a halogen-containing flame retardant. An electric cable in which a coat layer is formed of a non-crosslinked resin composition that includes (A) 40 to 84 parts by mass of a polypropylene homopolymer, (B) 1 to 10 parts by mass of a polypropylene-based modified resin, (C) 10 to 30 parts by mass of a polyolefin-based copolymer, and (D) 5 to 20 parts by mass of an olefin-based elastomer and further includes 1 to 45 parts by mass of a metal hydroxide and 10 to 80 parts by mass of a halogen-containing flame retardant based on 100 parts by mass of the resins (A), (B), (C), and (D) in total.
摘要翻译：提供可以满足ISO 6722中提供的CHFUS区域中的阻燃性和电池流体阻力的电缆，并且通过使用含卤阻燃剂来满足耐低温性，耐磨性和剥离性。一种电缆，其特征在于，包括（A）40〜84质量份的聚丙烯均聚物，（B）1〜10质量份聚丙烯类改性树脂的非交联型树脂组合物，（C）10〜30质量份的聚烯烃类共聚物，（D）5〜20质量份的烯烃系弹性体，还含有1〜45质量份的金属氢氧化物和10〜80份基于100质量份的树脂（A），（B），（C）和（D）的总量为含卤阻燃剂。

75. 发明授权

US09187607B2 Flame-retarded foamable styrene-based resin compositions 有权
标题翻译：阻燃发泡苯乙烯类树脂组合物
公开(公告)号：US09187607B2
公开(公告)日：2015-11-17
申请号：US13203789
申请日：2010-04-02
申请人： Hideaki Onishi , Hisanori Semori , Masashi Asaoka
发明人： Hideaki Onishi , Hisanori Semori , Masashi Asaoka
IPC分类号： C08J9/35 , C08J9/00 , C08K5/00 , C08K5/06 , C08K5/136 , C08K5/3492 , C08K5/41 , C08L33/16
CPC分类号： C08J9/0019 , C08J2201/03 , C08J2325/04 , C08K5/0066 , C08K5/06 , C08K5/136 , C08K5/3492 , C08K5/41 , C08L33/16 , C08L25/14
摘要： In a flame-retarded foamable styrene-based resin composition comprising a bromine-containing flame retardant, the flame retardant is a mixture of (a) an organic bromine-containing compound having a 2,3-dibromopropyl group or an organic bromine-containing compound having a bromine content of greater than 60 wt% in which all bromine atoms are attached to a benzene ring, and (b) an organic bromine compound having a 2,3-dibromo-2-alkylpropyl group. The composition comprises this mixture in amount from 0.5 to 10 parts by weight per 100 parts by weight of the styrene-based resin. The composition exhibits high flame retardant and heat stabilizing effects yet allowing recycling.
摘要翻译：在包含含溴阻燃剂的阻燃可发泡苯乙烯基树脂组合物中，阻燃剂是（a）具有2,3-二溴丙基的有机含溴化合物或含有机溴化合物的混合物其中溴含量大于60重量％，其中所有溴原子连接到苯环上，和（b）具有2,3-二溴-2-烷基丙基的有机溴化合物。该组合物包含该混合物的量为每100重量份苯乙烯基树脂0.5至10重量份。该组合物显示出高阻燃和热稳定作用，但允许再循环。

76. 发明申请

US20150152214A1 POWDERY COMPOSITION COMPRISING THERMOPLASTIC POLYURETHANE AND USE THEREOF 有权
标题翻译：包含热塑性聚氨酯的粉末组合物及其用途
公开(公告)号：US20150152214A1
公开(公告)日：2015-06-04
申请号：US14557616
申请日：2014-12-02
申请人： Timur Uenlue
发明人： Timur Uenlue , Wilfried Leirer
IPC分类号： C08G18/72 , C08K3/00 , C08K5/136 , C08K3/10 , C08K5/3432 , C08K5/00 , C08G18/32 , C08K3/08
CPC分类号： C08K5/136 , B29C64/153 , B33Y70/00 , C08G18/32 , C08G18/72 , C08G2140/00 , C08K3/015 , C08K3/08 , C08K5/0058 , C08K5/3432 , C08K2003/0806 , C08K2003/0831 , C08K2003/085 , C08K2003/0893 , C08L75/04 , Y10T428/2982 , C08K3/005
摘要： The invention relates to a powdery composition for use in the layer by layer manufacturing of three-dimensional molded bodies. The composition comprises at least one powder made of an aliphatic thermoplastic polyurethane (TPU) and is characterized in that the TPU powder has a melting temperature of less than 135° C. and a melting viscosity at 150° C. of at most 800 Pa·s.
摘要翻译：本发明涉及用于三维成型体的逐层制造的粉末状组合物。所述组合物包含至少一种由脂肪族热塑性聚氨酯（TPU）制成的粉末，其特征在于，所述TPU粉末的熔融温度低于135℃，150℃下的熔融粘度为至多800Pa· s。

77. 发明申请

US20110313069A1 FLAME-RETARDED FOAMABLE STYRENE-BASED RESIN COMPOSITIONS 有权
标题翻译：阻燃可泡沫苯乙烯树脂组合物
公开(公告)号：US20110313069A1
公开(公告)日：2011-12-22
申请号：US13203789
申请日：2011-04-02
申请人： Hideaki Onishi , HIsanori Semori , Masashi Asaoka
发明人： Hideaki Onishi , HIsanori Semori , Masashi Asaoka
IPC分类号： C08L25/04 , C08K5/136 , C08K5/37 , C08K5/3467 , C08K3/34 , C08K5/3417 , C08K5/105 , C08K5/03 , C08J9/35 , C08K5/3492
CPC分类号： C08J9/0019 , C08J2201/03 , C08J2325/04 , C08K5/0066 , C08K5/06 , C08K5/136 , C08K5/3492 , C08K5/41 , C08L33/16 , C08L25/14
摘要： In a flame-retarded foamable styrene-based resin composition comprising a bromine-containing flame retardant, the flame retardant is a mixture of (a) an organic bromine-containing compound having a 2,3-dibromopropyl group or an organic bromine-containing compound having a bromine content of greater than 60 wt % in which all bromine atoms are attached to a benzene ring, and (b) an organic bromine compound having a 2,3-dibromo-2-alkylpropyl group. The composition comprises this mixture in amount from 0.5 to 10 parts by weight per 100 parts by weight of the styrene-based resin. The composition exhibits high flame retardant and heat stabilizing effects yet allowing recycling.
摘要翻译：在包含含溴阻燃剂的阻燃可发泡苯乙烯基树脂组合物中，阻燃剂是（a）具有2,3-二溴丙基的有机含溴化合物或含有机溴化合物的混合物其中溴含量大于60重量％，其中所有溴原子连接到苯环上，和（b）具有2,3-二溴-2-烷基丙基的有机溴化合物。该组合物包含该混合物的量为每100重量份苯乙烯基树脂0.5至10重量份。该组合物显示出高阻燃和热稳定作用，但允许再循环。

78. 发明申请

US20100240811A1 Thermosetting Resin Composition and Application Thereof 审中-公开
标题翻译：热固性树脂组合物及其应用
公开(公告)号：US20100240811A1
公开(公告)日：2010-09-23
申请号：US12406877
申请日：2009-03-18
申请人： Yufang HE , Lunqiang ZHANG
发明人： Yufang HE , Lunqiang ZHANG
IPC分类号： C08L63/00 , C08K5/3417 , C08K5/50 , C08K5/136 , C08K3/38 , C08K3/28 , C08K3/22 , C08K3/34 , C08K3/36 , C08K3/40 , C08K3/04
CPC分类号： C08G59/4284 , C08K3/04 , C08K3/22 , C08K3/34 , C08K3/38 , C08K5/0066 , C08K5/136 , C08K7/14 , C08L35/06 , H05K1/0353 , C08L63/00
摘要： The present invention discloses a thermosetting resin composition including: a bi-functional or multi-functional epoxy resin, a SMA uses as a curing agent, an allyl phenol such as diallyl bisphenol A used as a co-curing agent and a toughening agent a low-bromine or high-bromine BPA epoxy resin or tetrabromobispheno A (TBBPA or TBBA) uses as a flame retardant agent, and an appropriate solvent. After the resin composition of the invention is cured, the resin composition has lower dielectric property and better thermal reliability and tenacity. A copper clad laminate made of an enhanced material such as glass fiber has lower dielectric constant (Dk) and loss tangent (Df), high Tg, high thermal decomposition temperature (Td), better tenacity and PCB manufacturability, and thus very suitable to be used as a copper clad laminate and a prepreg for manufacturing PCBs or applied as a molding resin material for contraction, automobile and air navigation.
摘要翻译：本发明公开了一种热固性树脂组合物，其包含：双官能或多官能环氧树脂，SMA用作固化剂，烯丙基苯酚如用作共固化剂的二烯丙基双酚A和低硬度的增韧剂溴或溴溴BPA环氧树脂或四溴双酚A（TBBPA或TBBA）用作阻燃剂和合适的溶剂。本发明的树脂组合物固化后，树脂组合物具有较低的介电性能和更好的热可靠性和韧性。由玻璃纤维增强材料制成的覆铜层压板具有较低的介电常数（Dk）和损耗角正切（Df），高Tg，高热分解温度（Td），更好的韧性和PCB制造能力，因此非常适合用作覆铜层压板和用于制造PCB的预浸料或用作收缩，汽车和空中导航的模制树脂材料。

79. 发明申请

US20080114100A1 Encapsulating resin composition and light-emitting device 有权
标题翻译：封装树脂组合物和发光装置
公开(公告)号：US20080114100A1
公开(公告)日：2008-05-15
申请号：US11976888
申请日：2007-10-29
申请人： Kouki Hatsuda , Hiroshi Samukawa
发明人： Kouki Hatsuda , Hiroshi Samukawa
IPC分类号： C08K5/136
CPC分类号： C08F220/30 , C08K5/101 , C08K5/134 , C09D4/00 , H01L33/56 , Y10T428/31855 , C08L33/08
摘要： An encapsulating resin composition is provided, which gives a cured product having heat resistance, light resistance, and flexibility equivalent to those of silicone resins and having a refractive index of 1.57 or greater which is larger than that of epoxy resins. The encapsulating resin composition contains: a high refractive index acrylic-based or methacrylic-based monomer having a refractive index of 1.55 or greater; and a nonfunctional fluorene compound. In a preferred form, each of the high refractive index acrylic-based or methacrylic-based monomer and the nonfunctional fluorene compound has a 9,9-bisphenylfluorene skeleton.
摘要翻译：提供了一种封装树脂组合物，其产生具有与硅树脂相当的耐热性，耐光性和柔性的固化产物，其折射率大于环氧树脂的1.57或更大。包封树脂组合物包含：折射率为1.55以上的高折射率丙烯酸类或甲基丙烯酸类单体; 和非功能性芴化合物。在优选形式中，高折射率丙烯酸类或甲基丙烯酸类单体和非功能性芴化合物各自具有9,9-双苯芴骨架。

80. 发明申请

US20050282937A1 Electrochemical compatibilizer and hydrophobic wetting agent for fiber reinforced vinyl esters and related thermosets 审中-公开
公开(公告)号：US20050282937A1
公开(公告)日：2005-12-22
申请号：US10869161
申请日：2004-06-16
申请人： Richard Petersen
发明人： Richard Petersen
IPC分类号： B32B27/38 , C08K5/136 , C08L63/00 , C08L63/10 , H05K1/03
CPC分类号： C08L63/10 , C08K5/136 , H05K1/0366 , H05K1/0373 , Y10T428/31511
摘要： Triclosan, a diphenyl ether additive characterized by molecular electrochemical functionality, is proposed as a unique compatibilizer with nonpolar bisphenyl vinyl ester thermosets and especially those resins containing hydroxyl groups. Electrochemical functionality is being described as alternating conformational changes related to molecular asymmetry where a dipole is either hidden alongside the ether dihedral angle with phenyl planes at about 30 degrees, or the dipole becomes exposed as the phenyl planes rotate toward 90 degrees. Accentuated electrochemical compatibilization through nonbonded Lennard-Jones parameters with molecular similarities related to closer intermolecular distances involves resin polymer chain and monomer entanglement for increased toughness and other improved mechanical properties. Triclosan compatibilization with bisphenyl-A vinyl esters is extreme, allowing major concentrations to be incorporated. The dipole of Triclosan is particularly important where it can open up in the presence of more polar elements or functional groups such that extra curing agents may be required for sufficient free radicals to ensure complete polymerization. Nonpolar electrochemical Triclosan compatibilization is further related to hydrophobic wetting viscosity reduction with disruption of secondary bonding. Lowered resin viscosity then promotes entropic mixing stabilization to improve homogeneous dispersion during fiber resin impregnation with vinyl esters and related monomers, for inclusion of filler particulate, or other polymer modifiers. Hydrophobic wetting becomes especially important when incorporating high levels of filler into molding compound where resin mobility is significantly restricted by reinforcing fibers necessary for mechanical strengths. Additionally, hydrophobic wetting reduces interfacial porosity to improve composite mechanical and physical properties.

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