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    • 73. 发明申请
    • PCB WITH HEAT DISSIPATION STRUCTURE AND PROCESSING METHODS THEREOF
    • PCB散热结构及其处理方法
    • US20120222888A1
    • 2012-09-06
    • US13141394
    • 2011-05-09
    • Tian Zhang
    • Tian Zhang
    • H05K7/20C04B35/64
    • H05K1/0203C04B37/025C04B2237/062C04B2237/34C04B2237/343C04B2237/36C04B2237/365C04B2237/40H05K1/0306H05K2201/0116H05K2201/10106
    • The invention relates to a printed circuit board (PCB) with a heat dissipating structure. The PCB comprises a conducting layer and a PCB carrier layer, wherein the PCB carrier layer is a porous heat conducting layer; heat conducting liquid or a solid-liquid phase change heat conducting material is injected into holes of the porous heat conducting layer; the conducting layer is arranged on a first surface of the porous heat conducting layer; and a second surface of the porous heat conducting layer is a contact interface with external media. In the invention, the carrier layer of the PCB is a porous heat conducting layer which is made of a porous material with high thermal conductivity, heat conducting liquid such as heat conducting ink or the solid-liquid phase change heat conducting material permeates into the holes of the porous heat conducting layer; when the PCB is heated, the heat conducting ink is separated out of the porous material because the expansion coefficient of the porous material is inconsistent with that of the heat conducting ink, and the separated heat conducting ink fills air gaps between the contact interface and the external medium in the contact interface of the PCB via capillary phenomenon, so that heat resistance between a light-emitting diode (LED) and the contact interface is reduced greatly and the thermal conductivity of the PCB is enhanced; moreover, the PCB has low cost, simple structure and easy installation.
    • 本发明涉及一种具有散热结构的印刷电路板(PCB)。 PCB包括导电层和PCB载体层,其中PCB载体层是多孔导热层; 将导热液体或固液相变导热材料注入多孔导热层的孔中; 所述导电层设置在所述多孔导热层的第一表面上; 并且所述多孔导热层的第二表面是与外部介质的接触界面。 在本发明中,PCB的载体层是由具有高导热性的多孔材料制成的多孔导热层,诸如导热油墨的导热液体或固 - 液相变导热材料渗入孔中 的多孔导热层; 当PCB被加热时,由于多孔材料的膨胀系数与导热油墨的膨胀系数不一致,导热油墨从多孔材料中分离出来,并且分离的导热油墨填充接触界面和 外部介质通过毛细管现象在PCB的接触界面中,使得发光二极管(LED)和接触界面之间的耐热性大大降低,并且PCB的导热性增强; 而且PCB成本低,结构简单,安装方便。