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71. 发明授权

US4760671A Method of and apparatus for automatically grinding cathode ray tube faceplates 失效
标题翻译：自动研磨阴极射线管面板的方法和设备
公开(公告)号：US4760671A
公开(公告)日：1988-08-02
申请号：US766721
申请日：1985-08-19
申请人： William R. Ward
发明人： William R. Ward
IPC分类号： B23Q7/03 , B23Q7/04 , B23Q7/18 , B23Q39/04 , B24B13/00 , B24B13/015 , B24B17/10 , B24B41/00 , B24B47/22
CPC分类号： B24B13/0031 , B23Q7/03 , B23Q7/048 , B23Q7/18 , B24B13/015 , B24B17/10 , B24B41/005 , B24B47/22
摘要： A workpiece manipulating apparatus for faceplate panels of cathode ray tubes includes a conveyor for carrying panels along two groups of grinder stations in a pattern coordinated with carriage mounted loaders which move along the conveyor. The conveyor indexes to loading stations as do the loaders. Unground panels are sequenced to the stations as the loaders are present. Loaders pick the unground panels from the conveyor and transfer them to an orienting station which orients panels for loading into a grinder. Loaders pick an oriented panel from the orienting station and load it in to the grinder at the loading station. They also pick up ground panels from the grinder and place them in a reorient station and pick ground panels from the reorient station and place them on the conveyor in the position from which they removed an unground panel. The loader advances to a next loading station to load a next grinder and the conveyor with panels picked up at the preceeding station. The cycle is continuous with the panel manipulation through a complete cycle approximating the grinding time of a panel in a grinder.
摘要翻译：用于阴极射线管面板的工件操纵装置包括用于沿着两组研磨机站以与沿着输送机移动的滑架安装的装载机配合的模式承载面板的输送机。输送机对装载站的指示与装载机一样。随着装载机的存在，非地板面板对工位进行排序。装载机从输送机上取出未磨合的面板，并将它们转移到定向工位，该定位工位将面板装载到研磨机中。装载机从定向站挑选定向的面板，并将其装入装载站的研磨机。他们还从磨床上拿起接地面板，并将它们放在一个重新定位站，并从重新定位站拾取接地面板，并将它们放置在输送机上，从而拆除了未接地的面板。装载机前进到下一个装载站，以装载下一个研磨机和带有在前一个工作站拾取的面板的输送机。该循环与面板操作连续，通过接近研磨机中面板研磨时间的完整循环。

72. 再颁专利

USRE32166E Detection of flaws in metal members 失效
标题翻译：检测金属构件中的缺陷
公开(公告)号：USRE32166E
公开(公告)日：1986-06-03
申请号：US597207
申请日：1984-04-06
申请人： Arnulf Berge
发明人： Arnulf Berge
IPC分类号： B24B47/22 , G01N25/72 , G01N27/00
CPC分类号： G01N25/72 , B24B47/22
摘要： A method of detecting flaws in metal members is disclosed. The metal member is exposed to high frequency heating whereupon the temperature profile across the work piece is measured, preferably by recording with an infrared camera. The recorded data can be used for automatic marking or repair of the metal member.

73. 发明授权

US3721046A Horizontal disc grinder with equal feed control from workpiece contact 失效
标题翻译：水平盘研磨机与工件接触的均匀进料控制
公开(公告)号：US3721046A
公开(公告)日：1973-03-20
申请号：US3721046D
申请日：1970-07-02
申请人： LITTON INDUSTRIES INC
发明人： DUNN E
IPC分类号： B24B47/22 , B24B7/04
CPC分类号： B24B47/22
摘要： AN AUTOMATIC FEED APPARATUS FOR A HORIZONTAL DISC GRINDER IS USED TO EFFECT EQUAL AND/OR UNEQUAL MOVEMENT OF OPPOSED GRINDING DISCS (14L, 14R) AS REQUIRED BY GRINDING STOCK LOCATION, TO REMOVE AN EQUAL AMOUNT OF STOCK FROM THE PARALLEL SURFACES (21, 22) OF DISC-TYPE WORKPIECES (W). A FACE CUT FEED SYSTEM IS HYDRAULICALLY OPERATED TO EFFECT FIRST A RAPID MOVEMENT IN UNISON OF TWO GRINDING HEADS (11L, 11R) UNTIL ONE OR THE OTHER DISC CONTACTS THE WORKPIECE (W), THEN THE MOVEMENT OF EACH GRINDING HEAD (11L, 11R) IS CONTROLLED IN RESPONSE TO SEQUENTIAL CONTACT OF THE DISCS (14L, 14R) WITH THE CORRESPONDING SIDES (21, 22) OF THE WORKPIECE (W). INDIVIDUAL MOTOR LOAD SENSORS (1MLS, 2MLS) ACTUATE MOTOR LOAD RELAYS (1CRE, 2CRE) WHICH ARE USED TO CONTROL FIRST A SEQUENTIAL MOMENTARY STOPPAGE IN FEED MOVEMENT OF FIRST ONE AND THEN THE OTHER GRINDING HEAD FOLLOWED BY RESUMPTION OF FURTHER INFEED IN UNISON AT A SLOW GRINDING FEED RATE, FOLLOWING A MONENTARY CONTROLLED TIME DELAY. FOLLOWING THE TIMED DELAY, AN EQUAL AMOUNT OF STOCK IS REMOVED FROM EACH PARALLEL SURFACE (21, 22) OF THE WORKPIECE (W) AS DETERMINED BY A METERED VOLUME OF FLUID WHICH IS DISCHARGED FROM A SINGLE DISPLACEMENT CYLINDER (64), WHICH PERMITS AN EQUAL INFEED MOVEMENT TO OCCUR IN EACH GRINDING HEAD (11L, 11R).

74. 发明授权

US3455064A Preloaded pivot type feed for grinders 失效
标题翻译：用于研磨机的预加工类型饲料
公开(公告)号：US3455064A
公开(公告)日：1969-07-15
申请号：US3455064D
申请日：1966-04-15
申请人： SKF IND INC
发明人： STROM BERTIL , WEISSING OTTO
IPC分类号： B24B47/22 , B24B49/00 , B24B5/18 , B24B5/00 , B24B29/00
CPC分类号： B24B47/22 , B24B49/00

75. 发明授权

US09754622B2 Methods for optimizing friction between a pad and a disc in an optical disc restoration device 有权
公开(公告)号：US09754622B2
公开(公告)日：2017-09-05
申请号：US14640321
申请日：2015-03-06
申请人： Venmill Industries Incorporated
发明人： William Olszta , Daniel St. Laurent , Mariusz Surowaniec
IPC分类号： B24B7/24 , G11B23/50 , B24B13/00 , B24B47/22 , B24B13/04
CPC分类号： G11B23/505 , B24B7/241 , B24B13/00 , B24B13/04 , B24B47/22
摘要： The invention pertains in general to a latching mechanism for maintaining desired friction levels on an optical disc in an optical disc restoration device. In particular the invention pertains to devices, systems and methods for easily maintaining friction levels between pads and an optical disc in an optical disc restoration device for ease of adjusting friction settings during quality control, repair operation or when optimization settings are being set in an optical disc restoration device by a user.

76. 发明授权

US09724797B2 Polishing apparatus 有权
公开(公告)号：US09724797B2
公开(公告)日：2017-08-08
申请号：US14464130
申请日：2014-08-20
申请人： EBARA CORPORATION
发明人： Osamu Nabeya , Tetsuji Togawa , Makoto Fukushima , Hozumi Yasuda
IPC分类号： B24B37/10 , B24B37/32 , B24B37/20 , B24B37/30 , B24B47/22 , B24B49/16 , B24B37/005 , B24B49/00
CPC分类号： B24B37/20 , B24B37/005 , B24B37/10 , B24B37/105 , B24B37/30 , B24B37/32 , B24B47/22 , B24B49/00 , B24B49/16
摘要： A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position.

77. 发明授权

US09630294B2 Machine tools and methods of operation thereof 有权
公开(公告)号：US09630294B2
公开(公告)日：2017-04-25
申请号：US12863786
申请日：2009-01-21
申请人： Mark Andrew Stocker
发明人： Mark Andrew Stocker
IPC分类号： B24B49/00 , B24B47/22 , B23Q1/25 , B24B41/00 , B24B47/20 , B23Q1/54 , B23Q1/48
CPC分类号： B24B47/22 , B23Q1/25 , B23Q1/4804 , B23Q1/5425 , B24B41/005 , B24B47/20 , B24B49/00
摘要： A machine tool is provided which comprises a machine base (10), a first support (20,100) mounted on a first rotational machine axis on the base, and a second support (22,102) mounted on a second rotational machine axis on the base. The second rotational axis is parallel to and spaced laterally from the first rotational axis and carries a mount (38,112) moveable relative to the second support along a first linear machine axis orthogonal to the second rotational axis. A control arrangement is operable to control the orientation of the first support on the first rotational axis, and the orientation of the mount relative to the second rotational axis and its location along the linear axis, so as to govern the position and orientation of the first support and the mount relative to each other. Existing machine tools often use long linear guide rails and stacked orthogonal axes which introduce alignment and offset errors. The present invention avoids the need for and/or reduces the number of these structures in machine tools.

78. 发明授权

US09321145B2 Device for fine machining of optically effective surfaces on in particular spectacle lenses and flexible production cell comprising such a device 有权
标题翻译：用于在特别是眼镜镜片上精细加工光学有效表面的装置和包括这种装置的柔性生产单元
公开(公告)号：US09321145B2
公开(公告)日：2016-04-26
申请号：US14384011
申请日：2013-01-29
申请人： Satisloh AG
发明人： Steffen Wallendorf , Holger Schäfer
IPC分类号： B24B47/22 , B24B13/00 , B24B27/00 , B24B41/00
CPC分类号： B24B47/22 , B24B13/00 , B24B13/0037 , B24B27/0084 , B24B41/005
摘要： The invention relates to a polishing machine for spectacle lenses, including a least one workpiece spindle protruding into a workspace for a rotary drive of the spectacle lens about a workpiece rotational axis. At least one feed device lowers and raises a polishing tool relative to the spectacle lens. An oscillation drive unit moves the feed device back and forth in an oscillation direction, which during the polishing runs substantially transversely to the workpiece rotational axis. A swivel drive unit swivels the feed device about a swivel-adjusting axis which runs substantially perpendicular to the workpiece rotational axis and substantially normal to the oscillation direction. A swivel mechanism is provided to swivel the feed device, the oscillation drive unit and the swivel drive unit relative to the workpiece.
摘要翻译：本发明涉及一种用于眼镜镜片的抛光机，其包括突出到工作空间中的至少一个工件轴，用于围绕工件旋转轴线旋转驱动眼镜镜片。至少一个进给装置相对于眼镜镜降低并升高抛光工具。振荡驱动单元使振动方向前后移动，在振荡方向上，抛光过程基本上横向于工件旋转轴。旋转驱动单元围绕基本上垂直于工件旋转轴线并且基本上垂直于振荡方向延伸的旋转调节轴线旋转进给装置。提供旋转机构以使进给装置，振荡驱动单元和旋转驱动单元相对于工件旋转。

79. 发明申请

US20140329446A1 POLISHING APPARATUS 审中-公开
公开(公告)号：US20140329446A1
公开(公告)日：2014-11-06
申请号：US14332357
申请日：2014-07-15
申请人： EBARA CORPORATION
发明人： Osamu NABEYA , Tetsuji TOGAWA , Makoto FUKUSHIMA , Hozumi YASUDA
IPC分类号： B24B37/005 , B24B49/00 , B24B37/10
CPC分类号： B24B37/20 , B24B37/005 , B24B37/042 , B24B37/10 , B24B37/105 , B24B37/30 , B24B37/32 , B24B47/22 , B24B49/00 , B24B49/16 , B24B49/18 , B24B49/183
摘要： A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position.

80. 发明申请

US20140302754A1 POLISHING APPARATUS 审中-公开
公开(公告)号：US20140302754A1
公开(公告)日：2014-10-09
申请号：US14312641
申请日：2014-06-23
申请人： EBARA CORPORATION
发明人： Osamu NABEYA , Tetsuji TOGAWA , Makoto FUKUSHIMA , Hozumi YASUDA
IPC分类号： B24B37/32
CPC分类号： B24B37/20 , B24B37/005 , B24B37/10 , B24B37/105 , B24B37/30 , B24B37/32 , B24B47/22 , B24B49/00 , B24B49/16
摘要： A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position.

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